1658014-3 Board-to-Board Headers & Receptacles
  • Connector Style Plug
  • Connector System Board-to-Board
  • Sealable No
  • Connector & Contact Terminates To Printed Circuit Board
  • Row-to-Row Spacing 4.73
  • Series MICTOR SB
  • PCB Mounting Orientation Vertical
  • Connector Type Connector Assembly
  • Boss Yes
  • Product Type Connector
  • Selectively Loaded Fully Loaded
  • Stackable No
  • Number of Positions 120
  • Board-to-Board Configuration Vertical
  • Number of Rows 2
  • Impedance 50 Ω
  • Dielectric Withstanding Voltage 675
  • Insulation Resistance 120
  • Voltage 125
  • Insulation Resistance 2
  • Busbar Mating Area Plating Thickness 675
  • Hold-Down Post Plating Thickness 125 – 125
  • PCB Termination Area Plating Material Gold over Nickel
  • Contact Configuration Single Beam
  • Contact Shape Square
  • Contact Mating Area Plating Material Select Gold
  • Contact Mating Area Plating Thickness .25
  • Contact Current Rating (Max) 1.25
  • Solder Tail Contact Plating Thickness .25
  • Ground Contact Material Phosphor Bronze
  • Contact Base Material Phosphor Bronze
  • Contact Type Pin
  • Termination Method to PC Board Surface Mount
  • Mating Alignment With
  • Mating Alignment Type Guide Post
  • PCB Mount Retention Without
  • PCB Mount Alignment With
  • PCB Mount Alignment Type Locating Posts
  • Connector Mounting Type Board Mount
  • Boardlock Plating Material Phosphor Bronze
  • Centerline (Pitch) .8
  • Housing Material LCP (Liquid Crystal Polymer)
  • Stack Height 8
  • Height 7.06
  • Operating Temperature Range -65 – 125
  • Assembly Process Feature None
  • Pick and Place Cover Without
  • Circuit Application Signal
  • For Use With Receptacle Assembly
  • Packaging Method Box & Tray
  • Packaging Quantity 42
  • Comment Use of stand offs recommended. Contact Product Engineering for recommendations.
1658462-1 Board-to-Board Headers & Receptacles
  • Connector Style Receptacle
  • Connector System Board-to-Board
  • Sealable No
  • Connector & Contact Terminates To Printed Circuit Board
  • Row-to-Row Spacing 3.47
  • Series MICTOR SB
  • PCB Mounting Orientation Vertical
  • Connector Type Connector Assembly
  • Boss Yes
  • Product Type Connector
  • Selectively Loaded Fully Loaded
  • Stackable No
  • Number of Positions 40
  • Board-to-Board Configuration Vertical
  • Number of Rows 2
  • Impedance 50 Ω
  • Dielectric Withstanding Voltage 675
  • Insulation Resistance 40
  • Voltage 125
  • Insulation Resistance 2
  • Busbar Mating Area Plating Thickness 675
  • Hold-Down Post Plating Thickness 125 – 125
  • PCB Termination Area Plating Material Gold over Nickel
  • Contact Configuration Single Beam
  • Contact Mating Area Plating Material Select Gold
  • Contact Mating Area Plating Thickness .76
  • Contact Current Rating (Max) 1.25
  • Solder Tail Contact Plating Thickness .76
  • Ground Contact Material Phosphor Bronze
  • Contact Base Material Phosphor Bronze
  • Contact Type Socket
  • Termination Method to PC Board Surface Mount
  • Mating Alignment With
  • Mating Alignment Type Guide Post
  • PCB Mount Retention Without
  • PCB Mount Alignment With
  • PCB Mount Alignment Type Locating Posts
  • Connector Mounting Type Board Mount
  • Boardlock Plating Material Phosphor Bronze
  • Centerline (Pitch) .8
  • Housing Material LCP (Liquid Crystal Polymer)
  • Stack Height 5
  • Height 3.05
  • Operating Temperature Range -65 – 125
  • Assembly Process Feature None
  • Pick and Place Cover Without
  • Circuit Application Signal
  • For Use With Header
  • Packaging Method Box & Tray
  • Packaging Quantity 96
  • Comment Use of stand offs recommended. Contact Product Engineering for recommendations.
2-1658013-3 Board-to-Board Headers & Receptacles
  • Connector Style Plug
  • Connector System Board-to-Board
  • Sealable No
  • Connector & Contact Terminates To Printed Circuit Board
  • Row-to-Row Spacing 4.73
  • Series MICTOR SB
  • PCB Mounting Orientation Vertical
  • Connector Type Connector Assembly
  • Boss Yes
  • Product Type Connector
  • Selectively Loaded Fully Loaded
  • Stackable No
  • Number of Positions 120
  • Board-to-Board Configuration Vertical
  • Number of Rows 2
  • Impedance 50 Ω
  • Dielectric Withstanding Voltage 675
  • Insulation Resistance 120
  • Voltage 125
  • Insulation Resistance 2
  • Busbar Mating Area Plating Thickness 675
  • Hold-Down Post Plating Thickness 125 – 125
  • Cover Material Polyamide
  • PCB Termination Area Plating Material Gold over Nickel
  • Contact Configuration Single Beam
  • Contact Shape Square
  • Contact Mating Area Plating Material Select Gold
  • Contact Mating Area Plating Thickness .25
  • Contact Current Rating (Max) 1.25
  • Solder Tail Contact Plating Thickness .25
  • Ground Contact Material Phosphor Bronze
  • Contact Base Material Phosphor Bronze
  • Contact Type Pin
  • Termination Method to PC Board Surface Mount
  • Mating Alignment With
  • Mating Alignment Type Guide Post
  • PCB Mount Retention Without
  • PCB Mount Alignment With
  • PCB Mount Alignment Type Locating Posts
  • Connector Mounting Type Board Mount
  • Boardlock Plating Material Phosphor Bronze
  • Centerline (Pitch) .8
  • Housing Material LCP (Liquid Crystal Polymer)
  • Stack Height 5
  • Height 4.06
  • Operating Temperature Range -65 – 125
  • Assembly Process Feature None
  • Pick and Place Cover Without
  • Circuit Application Signal
  • For Use With Receptacle Assembly
  • Packaging Method Box & Tray
  • Packaging Quantity 42
  • Comment Use of stand offs recommended. Contact Product Engineering for recommendations.
1658012-1 Board-to-Board Headers & Receptacles
  • Connector Style Receptacle
  • Connector System Board-to-Board
  • Sealable No
  • Connector & Contact Terminates To Printed Circuit Board
  • Row-to-Row Spacing 3.47
  • Series MICTOR SB
  • PCB Mounting Orientation Vertical
  • Connector Type Connector Assembly
  • Boss Yes
  • Product Type Connector
  • Selectively Loaded Fully Loaded
  • Stackable No
  • Number of Positions 40
  • Board-to-Board Configuration Vertical
  • Number of Rows 2
  • Impedance 50 Ω
  • Dielectric Withstanding Voltage 675
  • Insulation Resistance 40
  • Voltage 125
  • Insulation Resistance 2
  • Busbar Mating Area Plating Thickness 675
  • Hold-Down Post Plating Thickness 125 – 125
  • PCB Termination Area Plating Material Gold over Nickel
  • Contact Configuration Single Beam
  • Contact Mating Area Plating Material Select Gold
  • Contact Mating Area Plating Thickness .25
  • Contact Current Rating (Max) 1.25
  • Solder Tail Contact Plating Thickness .25
  • Ground Contact Material Phosphor Bronze
  • Contact Base Material Phosphor Bronze
  • Contact Type Socket
  • Termination Method to PC Board Surface Mount
  • Mating Alignment With
  • Mating Alignment Type Guide Post
  • PCB Mount Retention Without
  • PCB Mount Alignment With
  • PCB Mount Alignment Type Locating Posts
  • Connector Mounting Type Board Mount
  • Boardlock Plating Material Phosphor Bronze
  • Centerline (Pitch) .8
  • Housing Material LCP (Liquid Crystal Polymer)
  • Stack Height 5
  • Height 3.05
  • Operating Temperature Range -65 – 125
  • Assembly Process Feature None
  • Pick and Place Cover Without
  • Circuit Application Signal
  • For Use With Header
  • Packaging Method Box & Tray
  • Packaging Quantity 90
  • Comment Use of stand offs recommended. Contact Product Engineering for recommendations.
6-1658013-1 Board-to-Board Headers & Receptacles
  • Connector Style Plug
  • Connector System Board-to-Board
  • Sealable No
  • Connector & Contact Terminates To Printed Circuit Board
  • Row-to-Row Spacing 4.73
  • Series MICTOR SB
  • PCB Mounting Orientation Vertical
  • Connector Type Connector Assembly
  • Boss Yes
  • Product Type Connector
  • Selectively Loaded Fully Loaded
  • Stackable No
  • Number of Positions 40
  • Board-to-Board Configuration Vertical
  • Number of Rows 2
  • Impedance 50 Ω
  • Dielectric Withstanding Voltage 675
  • Insulation Resistance 40
  • Voltage 125
  • Insulation Resistance 2
  • Busbar Mating Area Plating Thickness 675
  • Hold-Down Post Plating Thickness 125 – 125
  • Cover Material Polyamide
  • PCB Termination Area Plating Material Gold over Nickel
  • Contact Configuration Single Beam
  • Contact Shape Square
  • Contact Mating Area Plating Material Select Gold
  • Contact Mating Area Plating Thickness .25
  • Contact Current Rating (Max) 1.25
  • Solder Tail Contact Plating Thickness .25
  • Ground Contact Material Phosphor Bronze
  • Contact Base Material Phosphor Bronze
  • Contact Type Pin
  • Termination Method to PC Board Surface Mount
  • Mating Alignment With
  • Mating Alignment Type Guide Post
  • PCB Mount Retention Without
  • PCB Mount Alignment With
  • PCB Mount Alignment Type Locating Posts
  • Connector Mounting Type Board Mount
  • Boardlock Plating Material Phosphor Bronze
  • Centerline (Pitch) .8
  • Housing Material LCP (Liquid Crystal Polymer)
  • Stack Height 5
  • Height 4.06
  • Operating Temperature Range -65 – 125
  • Assembly Process Feature None
  • Pick and Place Cover Without
  • Circuit Application Signal
  • For Use With Receptacle Assembly
  • Packaging Method Pocket Tape
  • Packaging Quantity 425
  • Comment Use of stand offs recommended. Contact Product Engineering for recommendations.
1658012-3 Board-to-Board Headers & Receptacles
  • Connector Style Receptacle
  • Connector System Board-to-Board
  • Sealable No
  • Connector & Contact Terminates To Printed Circuit Board
  • Row-to-Row Spacing 3.47
  • Series MICTOR SB
  • PCB Mounting Orientation Vertical
  • Connector Type Connector Assembly
  • Boss Yes
  • Product Type Connector
  • Selectively Loaded Fully Loaded
  • Stackable No
  • Number of Positions 120
  • Board-to-Board Configuration Vertical
  • Number of Rows 2
  • Impedance 50 Ω
  • Dielectric Withstanding Voltage 675
  • Insulation Resistance 120
  • Voltage 125
  • Insulation Resistance 2
  • Busbar Mating Area Plating Thickness 675
  • Hold-Down Post Plating Thickness 125 – 125
  • PCB Termination Area Plating Material Gold over Nickel
  • Contact Configuration Single Beam
  • Contact Mating Area Plating Material Select Gold
  • Contact Mating Area Plating Thickness .25
  • Contact Current Rating (Max) 1.25
  • Solder Tail Contact Plating Thickness .25
  • Ground Contact Material Phosphor Bronze
  • Contact Base Material Phosphor Bronze
  • Contact Type Socket
  • Termination Method to PC Board Surface Mount
  • Mating Alignment With
  • Mating Alignment Type Guide Post
  • PCB Mount Retention Without
  • PCB Mount Alignment With
  • PCB Mount Alignment Type Locating Posts
  • Connector Mounting Type Board Mount
  • Boardlock Plating Material Phosphor Bronze
  • Centerline (Pitch) .8
  • Housing Material LCP (Liquid Crystal Polymer)
  • Stack Height 5
  • Height 3.05
  • Operating Temperature Range -65 – 125
  • Assembly Process Feature None
  • Pick and Place Cover Without
  • Circuit Application Signal
  • For Use With Header
  • Packaging Method Box & Tray
  • Packaging Quantity 42
  • Comment Use of stand offs recommended. Contact Product Engineering for recommendations.
1-1658013-3 Board-to-Board Headers & Receptacles
  • Connector Style Plug
  • Connector System Board-to-Board
  • Sealable No
  • Connector & Contact Terminates To Printed Circuit Board
  • Row-to-Row Spacing 4.73
  • Series MICTOR SB
  • PCB Mounting Orientation Vertical
  • Connector Type Connector Assembly
  • Boss Yes
  • Product Type Connector
  • Selectively Loaded Differential Load
  • Stackable No
  • Number of Positions 84
  • Board-to-Board Configuration Vertical
  • Number of Rows 2
  • Impedance 50 Ω
  • Dielectric Withstanding Voltage 675
  • Insulation Resistance 84
  • Voltage 125
  • Insulation Resistance 2
  • Busbar Mating Area Plating Thickness 675
  • Hold-Down Post Plating Thickness 125 – 125
  • PCB Termination Area Plating Material Gold over Nickel
  • Contact Configuration Single Beam
  • Contact Shape Square
  • Contact Mating Area Plating Material Select Gold
  • Contact Mating Area Plating Thickness .25
  • Contact Current Rating (Max) 1.25
  • Solder Tail Contact Plating Thickness .25
  • Ground Contact Material Phosphor Bronze
  • Contact Base Material Phosphor Bronze
  • Contact Type Pin
  • Termination Method to PC Board Surface Mount
  • Mating Alignment With
  • Mating Alignment Type Guide Post
  • PCB Mount Retention Without
  • PCB Mount Alignment With
  • PCB Mount Alignment Type Locating Posts
  • Connector Mounting Type Board Mount
  • Boardlock Plating Material Phosphor Bronze
  • Centerline (Pitch) .8
  • Housing Material LCP (Liquid Crystal Polymer)
  • Stack Height 5
  • Height 4.06
  • Operating Temperature Range -65 – 125
  • Assembly Process Feature None
  • Pick and Place Cover Without
  • Circuit Application Signal
  • For Use With Receptacle Assembly
  • Packaging Method Box & Tray
  • Packaging Quantity 42
  • Comment Use of stand offs recommended. Contact Product Engineering for recommendations.
1-1658043-1 Board-to-Board Headers & Receptacles
  • Connector Style Receptacle
  • Connector System Board-to-Board
  • Sealable No
  • Connector & Contact Terminates To Printed Circuit Board
  • Row-to-Row Spacing 3.47
  • Series MICTOR SB
  • PCB Mounting Orientation Vertical
  • Connector Type Connector Assembly
  • Boss Yes
  • Product Type Connector
  • Selectively Loaded Differential Load
  • Stackable No
  • Number of Positions 28
  • Board-to-Board Configuration Vertical
  • Number of Rows 2
  • Impedance 50 Ω
  • Dielectric Withstanding Voltage 675
  • Insulation Resistance 28
  • Voltage 125
  • Insulation Resistance 2
  • Busbar Mating Area Plating Thickness 675
  • Hold-Down Post Plating Thickness 125 – 125
  • PCB Termination Area Plating Material Gold over Nickel
  • Contact Configuration Single Beam
  • Contact Mating Area Plating Material Select Gold Flash
  • Contact Mating Area Plating Thickness .12
  • Contact Mating Area Plating Material Finish Gold Flash
  • Contact Current Rating (Max) 1.25
  • Ground Contact Material Phosphor Bronze
  • Contact Base Material Phosphor Bronze
  • Contact Type Socket
  • Termination Method to PC Board Surface Mount
  • Mating Alignment With
  • Mating Alignment Type Guide Post
  • PCB Mount Retention Without
  • PCB Mount Alignment With
  • PCB Mount Alignment Type Locating Posts
  • Connector Mounting Type Board Mount
  • Boardlock Plating Material Phosphor Bronze
  • Centerline (Pitch) .8
  • Housing Material LCP (Liquid Crystal Polymer)
  • Stack Height 5
  • Height 3.05
  • Tail Length .12
  • Operating Temperature Range -65 – 125
  • Assembly Process Feature None
  • Pick and Place Cover Without
  • Circuit Application Signal
  • For Use With Header
  • Packaging Method Box & Tray
  • Packaging Quantity 96
  • Comment Use of stand offs recommended. Contact Product Engineering for recommendations.
1-1658043-3 Board-to-Board Headers & Receptacles
  • Connector Style Receptacle
  • Connector System Board-to-Board
  • Sealable No
  • Connector & Contact Terminates To Printed Circuit Board
  • Row-to-Row Spacing 3.47
  • Series MICTOR SB
  • PCB Mounting Orientation Vertical
  • Connector Type Connector Assembly
  • Boss Yes
  • Product Type Connector
  • Selectively Loaded Differential Load
  • Stackable No
  • Number of Positions 84
  • Board-to-Board Configuration Vertical
  • Number of Rows 2
  • Impedance 50 Ω
  • Dielectric Withstanding Voltage 675
  • Insulation Resistance 84
  • Voltage 125
  • Insulation Resistance 2
  • Busbar Mating Area Plating Thickness 675
  • Hold-Down Post Plating Thickness 125 – 125
  • PCB Termination Area Plating Material Gold over Nickel
  • Contact Configuration Single Beam
  • Contact Mating Area Plating Material Select Gold Flash
  • Contact Mating Area Plating Thickness .12
  • Contact Mating Area Plating Material Finish Gold Flash
  • Contact Current Rating (Max) 1.25
  • Ground Contact Material Phosphor Bronze
  • Contact Base Material Phosphor Bronze
  • Contact Type Socket
  • Termination Method to PC Board Surface Mount
  • Mating Alignment With
  • Mating Alignment Type Guide Post
  • PCB Mount Retention Without
  • PCB Mount Alignment With
  • PCB Mount Alignment Type Locating Posts
  • Connector Mounting Type Board Mount
  • Boardlock Plating Material Phosphor Bronze
  • Centerline (Pitch) .8
  • Housing Material LCP (Liquid Crystal Polymer)
  • Stack Height 5
  • Height 3.05
  • Tail Length .12
  • Operating Temperature Range -65 – 125
  • Assembly Process Feature None
  • Pick and Place Cover Without
  • Circuit Application Signal
  • For Use With Header
  • Packaging Method Box & Tray
  • Packaging Quantity 42
  • Comment Use of stand offs recommended. Contact Product Engineering for recommendations.
1-1658051-1 Board-to-Board Headers & Receptacles
  • Connector Style Plug
  • Connector System Board-to-Board
  • Sealable No
  • Connector & Contact Terminates To Printed Circuit Board
  • Row-to-Row Spacing 4.73
  • Series MICTOR SB
  • PCB Mounting Orientation Vertical
  • Connector Type Connector Assembly
  • Boss Yes
  • Product Type Connector
  • Selectively Loaded Differential Load
  • Stackable No
  • Number of Positions 28
  • Board-to-Board Configuration Vertical
  • Number of Rows 2
  • Impedance 50 Ω
  • Dielectric Withstanding Voltage 675
  • Insulation Resistance 28
  • Voltage 125
  • Insulation Resistance 2
  • Busbar Mating Area Plating Thickness 675
  • Hold-Down Post Plating Thickness 125 – 125
  • PCB Termination Area Plating Material Gold over Nickel
  • Contact Configuration Single Beam
  • Contact Shape Square
  • Contact Mating Area Plating Material Select Gold Flash
  • Contact Mating Area Plating Thickness 1.27
  • Contact Mating Area Plating Material Finish Gold Flash
  • Contact Current Rating (Max) 1.25
  • Ground Contact Material Phosphor Bronze
  • Contact Base Material Phosphor Bronze
  • Contact Type Pin
  • Termination Method to PC Board Surface Mount
  • Mating Alignment With
  • Mating Alignment Type Guide Post
  • PCB Mount Retention Without
  • PCB Mount Alignment With
  • PCB Mount Alignment Type Locating Posts
  • Connector Mounting Type Board Mount
  • Boardlock Plating Material Phosphor Bronze
  • Centerline (Pitch) .8
  • Housing Material LCP (Liquid Crystal Polymer)
  • Stack Height 30
  • Height 29.24
  • Tail Length 1.27
  • Operating Temperature Range -65 – 125
  • Assembly Process Feature None
  • Pick and Place Cover Without
  • Circuit Application Signal
  • For Use With Receptacle Assembly
  • Packaging Method Box & Tray
  • Packaging Quantity 40
  • Comment Use of stand offs recommended. Contact Product Engineering for recommendations.