2102061-4 Board-to-Board Headers & Receptacles
ANSI/VITA 61.0
  • Connector Style Receptacle
  • Sealable No
  • Connector & Contact Terminates To Printed Circuit Board
  • Stabilizers Without
  • Row-to-Row Spacing 1.27
  • Series Mezalok
  • PCB Mounting Orientation Vertical
  • Connector Type Connector Assembly
  • Boss No
  • Hybrid No
  • Product Type Connector
  • Stackable Yes
  • Number of Positions 114
  • Number of Rows 6
  • Dielectric Withstanding Voltage 750
  • Voltage 250
  • Insulation Resistance 1000
  • Contact Mating Area Plating Material Gold
  • Contact Mating Area Plating Thickness 1.27
  • Contact Layout Matrix
  • Contact Base Material Beryllium Copper
  • Contact Type Socket
  • Termination Method to PC Board Surface Mount - Solder Ball
  • PCB Mount Retention Without
  • Centerline (Pitch) 1.27
  • Housing Material LCP (Liquid Crystal Polymer)
  • Housing Color Natural
  • Stack Height 12
  • Height 8
  • Operating Temperature Range -55 – 125
  • Assembly Process Feature Pick and Place Cover
  • Pick and Place Cover With
  • For Use With Pin Housing
  • Industry Standard VITA 61
  • Packaging Method Tape & Reel
  • Packaging Quantity 350
  • Comment Conforms to requirement of VITA 61 (VITA 42 Alternate).
2102061-2 Board-to-Board Headers & Receptacles
ANSI/VITA 61.0
  • Connector Style Receptacle
  • Sealable No
  • Connector & Contact Terminates To Printed Circuit Board
  • Stabilizers Without
  • Row-to-Row Spacing 1.27
  • Series Mezalok
  • PCB Mounting Orientation Vertical
  • Connector Type Connector Assembly
  • Boss No
  • Hybrid No
  • Product Type Connector
  • Stackable Yes
  • Number of Positions 114
  • Number of Rows 6
  • Dielectric Withstanding Voltage 750
  • Voltage 250
  • Insulation Resistance 1000
  • Contact Mating Area Plating Material Gold
  • Contact Mating Area Plating Thickness 1.27
  • Contact Layout Matrix
  • Contact Base Material Beryllium Copper
  • Contact Type Socket
  • Termination Method to PC Board Surface Mount - Solder Ball
  • PCB Mount Retention Without
  • Centerline (Pitch) 1.27
  • Housing Material LCP (Liquid Crystal Polymer)
  • Housing Color Natural
  • Stack Height 10
  • Height 6
  • Operating Temperature Range -55 – 125
  • Assembly Process Feature Pick and Place Cover
  • Pick and Place Cover With
  • For Use With Pin Housing
  • Industry Standard VITA 61
  • Packaging Method Tape & Reel
  • Packaging Quantity 450
  • Comment Conforms to requirement of VITA 61 (VITA 42 Alternate).
2102061-1 Board-to-Board Headers & Receptacles
ANSI/VITA 61.0
  • Connector Style Receptacle
  • Sealable No
  • Connector & Contact Terminates To Printed Circuit Board
  • Stabilizers Without
  • Row-to-Row Spacing 1.27
  • Series Mezalok
  • PCB Mounting Orientation Vertical
  • Connector Type Connector Assembly
  • Boss No
  • Hybrid No
  • Product Type Connector
  • Stackable Yes
  • Number of Positions 114
  • Number of Rows 6
  • Dielectric Withstanding Voltage 750
  • Voltage 250
  • Insulation Resistance 1000
  • PCB Termination Area Plating Material Tin-Lead
  • Contact Mating Area Plating Material Gold
  • Contact Mating Area Plating Thickness 1.27
  • Contact Layout Matrix
  • Contact Base Material Beryllium Copper
  • Contact Type Socket
  • Termination Method to PC Board Surface Mount - Solder Ball
  • PCB Mount Retention Without
  • Centerline (Pitch) 1.27
  • Housing Material LCP (Liquid Crystal Polymer)
  • Housing Color Natural
  • Stack Height 10
  • Height 6
  • Operating Temperature Range -55 – 125
  • Assembly Process Feature Pick and Place Cover
  • Pick and Place Cover With
  • For Use With Pin Housing
  • Industry Standard VITA 61
  • Packaging Method Tape & Reel
  • Packaging Quantity 450
  • Comment Conforms to requirement of VITA 61 (VITA 42 Alternate).
2102060-2 Board-to-Board Headers & Receptacles
ANSI/VITA 61.0
  • Connector Style Plug
  • Sealable No
  • Connector & Contact Terminates To Printed Circuit Board
  • Stabilizers Without
  • Row-to-Row Spacing 1.27
  • Series Mezalok
  • PCB Mounting Orientation Vertical
  • Connector Type Connector Assembly
  • Boss No
  • Hybrid No
  • Product Type Connector
  • Stackable Yes
  • Number of Positions 114
  • Number of Rows 6
  • Dielectric Withstanding Voltage 750
  • Voltage 250
  • Insulation Resistance 1000
  • Contact Shape Square
  • Contact Mating Area Plating Material Gold
  • Contact Mating Area Plating Thickness 1.27
  • Contact Layout Matrix
  • Contact Base Material Phosphor Bronze
  • Contact Type Pin
  • Termination Method to PC Board Surface Mount - Solder Ball
  • PCB Mount Retention Without
  • Centerline (Pitch) 1.27
  • Housing Material LCP (Liquid Crystal Polymer)
  • Housing Color Natural
  • Stack Height 10
  • Height 9.15
  • Operating Temperature Range -55 – 125
  • Assembly Process Feature Pick and Place Cover
  • Pick and Place Cover With
  • For Use With Socket Housing
  • Industry Standard VITA 61
  • Packaging Method Tape & Reel
  • Packaging Quantity 230
  • Comment Conforms to requirement of VITA 61 (VITA 42 Alternate).
2102061-9 Board-to-Board Headers & Receptacles
ANSI/VITA 61.0
  • Connector Style Receptacle
  • Sealable No
  • Connector & Contact Terminates To Printed Circuit Board
  • Stabilizers Without
  • Row-to-Row Spacing 1.27
  • Series Mezalok
  • PCB Mounting Orientation Vertical
  • Connector Type Connector Assembly
  • Boss No
  • Hybrid No
  • Product Type Connector
  • Stackable Yes
  • Number of Positions 114
  • Number of Rows 6
  • Dielectric Withstanding Voltage 750
  • Voltage 250
  • Insulation Resistance 1000
  • PCB Termination Area Plating Material Tin-Lead
  • Contact Mating Area Plating Material Gold
  • Contact Mating Area Plating Thickness 1.27
  • Contact Layout Matrix
  • Contact Base Material Beryllium Copper
  • Contact Type Socket
  • Termination Method to PC Board Surface Mount - Solder Ball
  • PCB Mount Retention Without
  • Centerline (Pitch) 1.27
  • Housing Material LCP (Liquid Crystal Polymer)
  • Housing Color Natural
  • Stack Height 18
  • Height 14
  • Operating Temperature Range -55 – 125
  • Assembly Process Feature Pick and Place Cover
  • Pick and Place Cover With
  • For Use With Pin Housing
  • Industry Standard VITA 61
  • Packaging Method Tape & Reel
  • Packaging Quantity 100
  • Comment Conforms to requirement of VITA 61 (VITA 42 Alternate).
2102079-2 Board-to-Board Headers & Receptacles
ANSI/VITA 61.0
  • Connector Style Plug
  • Sealable No
  • Connector & Contact Terminates To Printed Circuit Board
  • Stabilizers Without
  • Row-to-Row Spacing 1.27
  • Series Mezalok
  • PCB Mounting Orientation Vertical
  • Connector Type Connector Assembly
  • Boss No
  • Hybrid No
  • Product Type Connector
  • Stackable Yes
  • Number of Positions 60
  • Number of Rows 6
  • Dielectric Withstanding Voltage 750
  • Voltage 250
  • Insulation Resistance 1000
  • Contact Shape Square
  • Contact Mating Area Plating Material Gold
  • Contact Mating Area Plating Thickness 1.27
  • Contact Layout Matrix
  • Contact Base Material Phosphor Bronze
  • Contact Type Pin
  • Termination Method to PC Board Surface Mount - Solder Ball
  • PCB Mount Retention Without
  • Centerline (Pitch) 1.27
  • Housing Material LCP (Liquid Crystal Polymer)
  • Housing Color Natural
  • Stack Height 10
  • Height 9.15
  • Operating Temperature Range -55 – 125
  • Assembly Process Feature Pick and Place Cover
  • Pick and Place Cover With
  • For Use With Socket Housing
  • Packaging Method Tape & Reel
  • Packaging Quantity 230
1-2102061-0 Board-to-Board Headers & Receptacles
ANSI/VITA 61.0
  • Connector Style Receptacle
  • Sealable No
  • Connector & Contact Terminates To Printed Circuit Board
  • Stabilizers Without
  • Row-to-Row Spacing 1.27
  • Series Mezalok
  • PCB Mounting Orientation Vertical
  • Connector Type Connector Assembly
  • Boss No
  • Hybrid No
  • Product Type Connector
  • Stackable Yes
  • Number of Positions 114
  • Number of Rows 6
  • Dielectric Withstanding Voltage 750
  • Voltage 250
  • Insulation Resistance 1000
  • Contact Mating Area Plating Material Gold
  • Contact Mating Area Plating Thickness 1.27
  • Contact Layout Matrix
  • Contact Base Material Beryllium Copper
  • Contact Type Socket
  • Termination Method to PC Board Surface Mount - Solder Ball
  • PCB Mount Retention Without
  • Centerline (Pitch) 1.27
  • Housing Material LCP (Liquid Crystal Polymer)
  • Housing Color Natural
  • Stack Height 18
  • Height 14
  • Operating Temperature Range -55 – 125
  • Assembly Process Feature Pick and Place Cover
  • Pick and Place Cover With
  • For Use With Pin Housing
  • Industry Standard VITA 61
  • Packaging Method Tape & Reel
  • Packaging Quantity 100
  • Comment Conforms to requirement of VITA 61 (VITA 42 Alternate).
1-2102061-3 Board-to-Board Headers & Receptacles
ANSI/VITA 61.0
  • Connector Style Receptacle
  • Sealable No
  • Connector & Contact Terminates To Printed Circuit Board
  • Stabilizers Without
  • Row-to-Row Spacing 1.27
  • Series Mezalok
  • PCB Mounting Orientation Vertical
  • Connector Type Connector Assembly
  • Boss No
  • Hybrid No
  • Product Type Connector
  • Stackable Yes
  • Number of Positions 114
  • Number of Rows 6
  • Dielectric Withstanding Voltage 750
  • Voltage 250
  • Insulation Resistance 1000
  • PCB Termination Area Plating Material Tin-Lead
  • Contact Mating Area Plating Material Gold
  • Contact Mating Area Plating Thickness 1.27
  • Contact Layout Matrix
  • Contact Base Material Beryllium Copper
  • Contact Type Socket
  • Termination Method to PC Board Surface Mount - Solder Ball
  • PCB Mount Retention Without
  • Centerline (Pitch) 1.27
  • Housing Material LCP (Liquid Crystal Polymer)
  • Housing Color Natural
  • Stack Height 15
  • Height 11
  • Operating Temperature Range -55 – 125
  • Assembly Process Feature Pick and Place Cover
  • Pick and Place Cover With
  • For Use With Pin Housing
  • Industry Standard VITA 61
  • Packaging Method Tape & Reel
  • Packaging Quantity 230
  • Comment Conforms to requirement of VITA 61 (VITA 42 Alternate).
1-2102061-6 Board-to-Board Headers & Receptacles
ANSI/VITA 61.0
  • Connector Style Receptacle
  • Sealable No
  • Connector & Contact Terminates To Printed Circuit Board
  • Stabilizers Without
  • Row-to-Row Spacing 1.27
  • Series Mezalok
  • PCB Mounting Orientation Vertical
  • Connector Type Connector Assembly
  • Boss No
  • Hybrid No
  • Product Type Connector
  • Stackable Yes
  • Number of Positions 114
  • Number of Rows 6
  • Dielectric Withstanding Voltage 750
  • Voltage 250
  • Insulation Resistance 1000
  • Contact Mating Area Plating Material Gold
  • Contact Mating Area Plating Thickness .76
  • Contact Layout Matrix
  • Contact Base Material Beryllium Copper
  • Contact Type Socket
  • Termination Method to PC Board Surface Mount - Solder Ball
  • PCB Mount Retention Without
  • Centerline (Pitch) 1.27
  • Housing Material LCP (Liquid Crystal Polymer)
  • Housing Color Natural
  • Stack Height 15
  • Height 11
  • Operating Temperature Range -55 – 125
  • Assembly Process Feature Pick and Place Cover
  • Pick and Place Cover With
  • For Use With Pin Housing
  • Industry Standard VITA 61
  • Packaging Method Tape & Reel
  • Packaging Quantity 230
  • Comment Conforms to requirement of VITA 61 (VITA 42 Alternate).
1-2102430-1 Board-to-Board Headers & Receptacles
ANSI/VITA 61.0
  • Connector Style Receptacle
  • Connector System Board-to-Board
  • Sealable No
  • Connector & Contact Terminates To Printed Circuit Board
  • Stabilizers Without
  • Row-to-Row Spacing 1.27
  • Series Mezalok
  • PCB Mounting Orientation Vertical
  • Connector Type Connector Assembly
  • Hybrid No
  • Product Type Connector
  • Number of Positions 320
  • Board-to-Board Configuration Mezzanine
  • Number of Rows 8
  • Dielectric Withstanding Voltage 750
  • Voltage 250
  • Data Rate 10
  • PCB Termination Area Plating Material Tin-Lead
  • Contact Shape Square
  • Contact Mating Area Plating Material Gold over Nickel
  • Contact Mating Area Plating Thickness .076
  • Contact Mating Area Plating Material Finish Bright
  • Contact Current Rating (Max) 1.5
  • Contact Layout Matrix
  • Contact Base Material Beryllium Copper
  • Contact Type Socket
  • Contact Plating Thickness Gold:30 - Nickel:50
  • Termination Method to PC Board Surface Mount - Solder Ball
  • Mating Alignment With
  • Mating Alignment Type Polarizing Rib
  • PCB Mount Retention Without
  • PCB Mount Retention Type None
  • PCB Mount Alignment Without
  • PCB Mount Alignment Type None
  • Centerline (Pitch) 1.27
  • Housing Material LCP (Liquid Crystal Polymer)
  • Housing Color Natural
  • Stack Height 18
  • Operating Temperature Range -55 – 125
  • Assembly Process Feature Pick and Place Cover
  • Pick and Place Cover With
  • MIL-C-55032 Yes
  • Packaging Method Pocket Tape