2-2822979-3 LGA Sockets  1
  • Connector System Board-to-Board
  • Connector & Contact Terminates To Board
  • Product Type Socket
  • Number of Positions 3647
  • Grid Spacing .9906 x .8585
  • Plating Thickness 30
  • Plating Material Gold
  • Frame Style Square
  • Socket Type LGA 3647
  • Contact Mating Area Plating Material Gold
  • Contact Mating Area Plating Thickness 30
  • Contact Current Rating (Max) .5
  • Contact Base Material Copper Alloy
  • PCB Mounting Style Surface Mount - Solder Ball
  • Connector Mounting Type Board Mount
  • Heat Sink Attachment Without
  • Centerline (Pitch) .8585
  • Housing Color Black
  • Housing Material High Temperature Thermoplastic
  • Operating Temperature Range -25 – 100
  • Circuit Application Signal
  • UL Flammability Rating UL 94V-0
  • Packaging Method Tray
  • Comment Lead-Free Solderball
2134440-3 LGA Sockets  1
  • Product Type Hardware
  • Plating Material Nickel Plating
  • Frame Style Square
  • Socket Type LGA 2011
  • Contact Mating Area Plating Material Nickel Plating
  • Contact Base Material Carbon Steel
  • Heat Sink Attachment Without
  • Operating Temperature Range -25 – 100
  • UL Flammability Rating UL 94V-0
  • Packaging Method Soft Tray
  • Tray Color White
2-2129710-8 LGA Sockets  1
  • Connector System Board-to-Board
  • Connector & Contact Terminates To Board
  • Product Type Socket
  • Number of Positions 1823
  • Grid Spacing .9906 x .8585
  • Plating Thickness 30
  • Plating Material Gold
  • Frame Style C Shape
  • Socket Type LGA 3647
  • Contact Mating Area Plating Material Gold
  • Contact Mating Area Plating Thickness 30
  • Contact Current Rating (Max) .5
  • Contact Base Material Copper Alloy
  • PCB Mounting Style Surface Mount - Solder Ball
  • Connector Mounting Type Board Mount
  • Heat Sink Attachment Without
  • Centerline (Pitch) .8585
  • Housing Color Black
  • Housing Material High Temperature Thermoplastic
  • Operating Temperature Range -25 – 100
  • Circuit Application Signal
  • UL Flammability Rating UL 94V-0
  • Packaging Method Tray
  • Tray Color Blue
  • Comment Lead-Free Solderball
2-2129710-7 LGA Sockets  1
  • Connector System Board-to-Board
  • Connector & Contact Terminates To Board
  • Product Type Socket
  • Number of Positions 1824
  • Grid Spacing .9906 x .8585
  • Plating Thickness 30
  • Plating Material Gold
  • Frame Style C Shape
  • Socket Type LGA 3647
  • Contact Mating Area Plating Material Gold
  • Contact Mating Area Plating Thickness 30
  • Contact Current Rating (Max) .5
  • Contact Base Material Copper Alloy
  • PCB Mounting Style Surface Mount - Solder Ball
  • Connector Mounting Type Board Mount
  • Heat Sink Attachment Without
  • Centerline (Pitch) .8585
  • Housing Color Black
  • Housing Material High Temperature Thermoplastic
  • Operating Temperature Range -25 – 100
  • Circuit Application Signal
  • UL Flammability Rating UL 94V-0
  • Packaging Method Tray
  • Tray Color Black
  • Comment Lead-Free Solderball
2134928-1 LGA Sockets
  • Connector System Board-to-Board
  • Connector & Contact Terminates To Board
  • Product Type Socket
  • Number of Positions 1150
  • Grid Spacing .914 x .914
  • Plating Thickness 15
  • Plating Material Gold
  • Frame Style Square
  • Socket Type LGA 1150
  • Contact Mating Area Plating Material Gold
  • Contact Mating Area Plating Thickness 15
  • Contact Current Rating (Max) .5
  • Contact Base Material Copper Alloy
  • PCB Mounting Style Surface Mount - Solder Ball
  • Connector Mounting Type Board Mount
  • Heat Sink Attachment Without
  • Centerline (Pitch) .9144
  • Housing Color Black
  • Housing Material High Temperature Thermoplastic
  • Operating Temperature Range -25 – 100
  • Circuit Application Signal
  • UL Flammability Rating UL 94V-0
  • Packaging Method Bag
  • Tray Color Black
  • Comment Lead-Free Solderball
2069965-1 LGA Sockets
  • Connector System Board-to-Board
  • Connector & Contact Terminates To Board
  • Product Type Socket
  • Number of Positions 1155
  • Grid Spacing .914 x .914
  • Plating Thickness 15
  • Plating Material Gold
  • Frame Style Square
  • Socket Type LGA 1155
  • Contact Mating Area Plating Material Gold
  • Contact Mating Area Plating Thickness 15
  • Contact Current Rating (Max) .5
  • Contact Base Material Copper Alloy
  • PCB Mounting Style Surface Mount - Solder Ball
  • Connector Mounting Type Board Mount
  • Heat Sink Attachment Without
  • Centerline (Pitch) .9144
  • Housing Color Black
  • Housing Material High Temperature Thermoplastic
  • Operating Temperature Range -25 – 100
  • Circuit Application Signal
  • UL Flammability Rating UL 94V-0
  • Packaging Method Tray
  • Tray Color Black
  • Comment Lead-Free Solderball
1554653-1 LGA Sockets
  • Connector System Board-to-Board
  • Connector & Contact Terminates To Board
  • Product Type Socket
  • Number of Positions 2011
  • Grid Spacing 1.016 x .8814
  • Plating Thickness 15
  • Plating Material Gold
  • Frame Style Square
  • Socket Type LGA 2011
  • Contact Mating Area Plating Material Gold
  • Contact Mating Area Plating Thickness 15
  • Contact Current Rating (Max) .5
  • Contact Base Material Copper Alloy
  • PCB Mounting Style Surface Mount - Solder Ball
  • Connector Mounting Type Board Mount
  • Heat Sink Attachment Without
  • Centerline (Pitch) 1.016
  • Housing Color Black
  • Housing Material High Temperature Thermoplastic
  • Operating Temperature Range -25 – 100
  • Circuit Application Signal
  • UL Flammability Rating UL 94V-0
  • Packaging Method Tray
  • Tray Color Blue
  • Comment Lead-Free Solderball
1-1554653-1 LGA Sockets
  • Connector System Board-to-Board
  • Connector & Contact Terminates To Board
  • Product Type Socket
  • Number of Positions 2011
  • Grid Spacing 1.016 x .8814
  • Plating Thickness 30
  • Plating Material Gold
  • Frame Style Square
  • Socket Type LGA 2011
  • Contact Mating Area Plating Material Gold
  • Contact Mating Area Plating Thickness 30
  • Contact Current Rating (Max) .5
  • Contact Base Material Copper Alloy
  • PCB Mounting Style Surface Mount - Solder Ball
  • Connector Mounting Type Board Mount
  • Heat Sink Attachment Without
  • Centerline (Pitch) 1.016
  • Housing Color Black
  • Housing Material High Temperature Thermoplastic
  • Operating Temperature Range -25 – 100
  • Circuit Application Signal
  • UL Flammability Rating UL 94V-0
  • Packaging Method Tray
  • Tray Color Blue
  • Comment Lead-Free Solderball
2-2129710-5 LGA Sockets  1
  • Connector System Board-to-Board
  • Connector & Contact Terminates To Board
  • Product Type Socket
  • Number of Positions 1824
  • Grid Spacing .9906 x .8585
  • Plating Thickness 30
  • Plating Material Gold
  • Frame Style C Shape
  • Socket Type LGA 3647
  • Contact Mating Area Plating Material Gold
  • Contact Mating Area Plating Thickness 30
  • Contact Current Rating (Max) .5
  • Contact Base Material Copper Alloy
  • PCB Mounting Style Surface Mount - Solder Ball
  • Connector Mounting Type Board Mount
  • Heat Sink Attachment Without
  • Centerline (Pitch) .8585
  • Housing Color Black
  • Housing Material High Temperature Thermoplastic
  • Operating Temperature Range -25 – 100
  • Circuit Application Signal
  • UL Flammability Rating UL 94V-0
  • Packaging Method Tray
  • Tray Color Black
  • Comment Lead-Free Solderball
2-2129710-6 LGA Sockets  1
  • Connector System Board-to-Board
  • Connector & Contact Terminates To Board
  • Product Type Socket
  • Number of Positions 1823
  • Grid Spacing .9906 x .8585
  • Plating Thickness 30
  • Plating Material Gold
  • Frame Style C Shape
  • Socket Type LGA 3647
  • Contact Mating Area Plating Material Gold
  • Contact Mating Area Plating Thickness 30
  • Contact Current Rating (Max) .5
  • Contact Base Material Copper Alloy
  • PCB Mounting Style Surface Mount - Solder Ball
  • Connector Mounting Type Board Mount
  • Heat Sink Attachment Without
  • Centerline (Pitch) .8585
  • Housing Color Black
  • Housing Material High Temperature Thermoplastic
  • Operating Temperature Range -25 – 100
  • Circuit Application Signal
  • UL Flammability Rating UL 94V-0
  • Packaging Method Tray
  • Tray Color Blue
  • Comment Lead-Free Solderball
2201838-2 LGA Sockets
  • Connector System Board-to-Board
  • Connector & Contact Terminates To Board
  • Product Type Socket
  • Number of Positions 2011
  • Grid Spacing 1.016 x .8814
  • Plating Thickness 30
  • Plating Material Gold
  • Frame Style Square
  • Socket Type LGA 2011
  • Contact Mating Area Plating Material Gold
  • Contact Mating Area Plating Thickness 30
  • Contact Current Rating (Max) .5
  • Contact Base Material Copper Alloy
  • PCB Mounting Style Surface Mount - Solder Ball
  • Connector Mounting Type Board Mount
  • Heat Sink Attachment Without
  • Centerline (Pitch) 1.016
  • Housing Color Black
  • Housing Material High Temperature Thermoplastic
  • Operating Temperature Range -25 – 100
  • Circuit Application Signal
  • UL Flammability Rating UL 94V-0
  • Packaging Method Tray
  • Tray Color Black
  • Comment Lead-Free Solderball
2287402-1 LGA Sockets  1
  • Connector System Board-to-Board
  • Connector & Contact Terminates To Board
  • Product Type Socket
  • Number of Positions 1151
  • Grid Spacing .914 x .914
  • Plating Thickness 15
  • Plating Material Gold
  • Frame Style Square
  • Socket Type LGA 1151
  • Contact Mating Area Plating Material Gold
  • Contact Mating Area Plating Thickness 15
  • Contact Current Rating (Max) .5
  • Contact Base Material Copper Alloy
  • PCB Mounting Style Surface Mount - Solder Ball
  • Connector Mounting Type Board Mount
  • Heat Sink Attachment Without
  • Centerline (Pitch) .9144
  • Housing Color Black
  • Housing Material High Temperature Thermoplastic
  • Operating Temperature Range -25 – 100
  • Circuit Application Signal
  • UL Flammability Rating UL 94V-0
  • Packaging Method Tray
  • Tray Color Gray
  • Comment Lead-Free Solderball
2201838-1 LGA Sockets
  • Connector System Board-to-Board
  • Connector & Contact Terminates To Board
  • Product Type Socket
  • Number of Positions 2011
  • Grid Spacing 1.016 x .8814
  • Plating Thickness 15
  • Plating Material Gold
  • Frame Style Square
  • Socket Type LGA 2011
  • Contact Mating Area Plating Material Gold
  • Contact Mating Area Plating Thickness 15
  • Contact Current Rating (Max) .5
  • Contact Base Material Copper Alloy
  • PCB Mounting Style Surface Mount - Solder Ball
  • Connector Mounting Type Board Mount
  • Heat Sink Attachment Without
  • Centerline (Pitch) 1.016
  • Housing Color Black
  • Housing Material High Temperature Thermoplastic
  • Operating Temperature Range -25 – 100
  • Circuit Application Signal
  • UL Flammability Rating UL 94V-0
  • Packaging Method Tray
  • Tray Color Black
  • Comment Lead-Free Solderball
2134928-2 LGA Sockets
  • Connector System Board-to-Board
  • Connector & Contact Terminates To Board
  • Product Type Socket
  • Number of Positions 1150
  • Grid Spacing .914 x .914
  • Plating Thickness 4
  • Plating Material Gold
  • Frame Style Square
  • Socket Type LGA 1150
  • Contact Mating Area Plating Material Gold
  • Contact Mating Area Plating Thickness 4
  • Contact Current Rating (Max) .5
  • Contact Base Material Copper Alloy
  • PCB Mounting Style Surface Mount - Solder Ball
  • Connector Mounting Type Board Mount
  • Heat Sink Attachment Without
  • Centerline (Pitch) .9144
  • Housing Color Black
  • Housing Material High Temperature Thermoplastic
  • Operating Temperature Range -25 – 100
  • Circuit Application Signal
  • UL Flammability Rating UL 94V-0
  • Packaging Method Bag
  • Tray Color Black
  • Comment Lead-Free Solderball
1-2229348-1 LGA Sockets
  • Product Type Accessory
  • Number of Positions 2011
  • Grid Spacing 1.016 x .8814
  • Plating Material Gold
  • Frame Style Square
  • Socket Type LGA 2011
  • Contact Mating Area Plating Material No Plating
  • Contact Base Material Copper Alloy
  • PCB Mounting Style Surface Mount - Solder Ball
  • Heat Sink Attachment Without
  • Housing Color Without
  • Housing Material High Temperature Thermoplastic
  • UL Flammability Rating UL 94V-0
  • Packaging Method Tray
  • Tray Color Black
  • Comment Lead-Free Solderball
2-2822979-4 LGA Sockets  1
  • Connector System Board-to-Board
  • Connector & Contact Terminates To Board
  • Product Type Socket
  • Number of Positions 3647
  • Grid Spacing .9906 x .8585
  • Plating Thickness 30
  • Plating Material Gold
  • Frame Style Square
  • Socket Type LGA 3647
  • Contact Mating Area Plating Material Gold
  • Contact Mating Area Plating Thickness 30
  • Contact Current Rating (Max) .5
  • Contact Base Material Copper Alloy
  • PCB Mounting Style Surface Mount - Solder Ball
  • Connector Mounting Type Board Mount
  • Heat Sink Attachment Without
  • Centerline (Pitch) .8585
  • Housing Color Black
  • Housing Material High Temperature Thermoplastic
  • Operating Temperature Range -25 – 100
  • Circuit Application Signal
  • UL Flammability Rating UL 94V-0
  • Packaging Method Tray
  • Comment Lead-Free Solderball
2134439-3 LGA Sockets
  • Product Type Hardware
  • Plating Material Nobelium Plating
  • Frame Style Square
  • Socket Type LGA 2010
  • Contact Mating Area Plating Material No Plating
  • Contact Base Material Stainless Steel
  • Heat Sink Attachment Without
  • Operating Temperature Range -25 – 100
  • UL Flammability Rating UL 94V-0
  • Packaging Method Soft Tray
  • Tray Color White
2134439-4 LGA Sockets  1
  • Product Type Hardware
  • Plating Material Nobelium Plating
  • Frame Style Square
  • Socket Type LGA 2011
  • Contact Mating Area Plating Material No Plating
  • Contact Base Material Stainless Steel
  • Heat Sink Attachment Without
  • Operating Temperature Range -25 – 100
  • UL Flammability Rating UL 94V-0
  • Packaging Method Soft Tray
  • Tray Color White
2174988-1 LGA Sockets
  • Connector System Board-to-Board
  • Connector & Contact Terminates To Board
  • Product Type Socket
  • Number of Positions 2011
  • Grid Spacing 1.016 x .8814
  • Plating Thickness 15
  • Plating Material Gold
  • Frame Style Square
  • Socket Type LGA 2011
  • Contact Mating Area Plating Material Gold
  • Contact Mating Area Plating Thickness 15
  • Contact Current Rating (Max) .5
  • Contact Base Material Copper Alloy
  • PCB Mounting Style Surface Mount - Solder Ball
  • Connector Mounting Type Board Mount
  • Heat Sink Attachment Without
  • Centerline (Pitch) 1.016
  • Housing Color Black
  • Housing Material High Temperature Thermoplastic
  • Operating Temperature Range -25 – 100
  • Circuit Application Signal
  • UL Flammability Rating UL 94V-0
  • Packaging Method Tray
  • Tray Color Blue
  • Comment Lead-Free Solderball
2174988-2 LGA Sockets
  • Connector System Board-to-Board
  • Connector & Contact Terminates To Board
  • Product Type Socket
  • Number of Positions 2011
  • Grid Spacing 1.016 x .8814
  • Plating Thickness 30
  • Plating Material Gold
  • Frame Style Square
  • Socket Type LGA 2011
  • Contact Mating Area Plating Material Gold
  • Contact Mating Area Plating Thickness 30
  • Contact Current Rating (Max) .5
  • Contact Base Material Copper Alloy
  • PCB Mounting Style Surface Mount - Solder Ball
  • Connector Mounting Type Board Mount
  • Heat Sink Attachment Without
  • Centerline (Pitch) 1.016
  • Housing Color Black
  • Housing Material High Temperature Thermoplastic
  • Operating Temperature Range -25 – 100
  • Circuit Application Signal
  • UL Flammability Rating UL 94V-0
  • Packaging Method Tray
  • Tray Color Blue
  • Comment Lead-Free Solderball