HMD-5B TO-5/.100 Grid Relays
  • MOSFET Driver Without
  • Product Type Relay
  • Relay Type Military/Aerospace High Performance
  • Enclosure Type Hermetically Sealed
  • Transistor Driver Without
  • Coil Power Measurement Milliwatts
  • Input Voltage 5
  • Coil Suppression Diode With
  • Coil Voltage 5
  • Coil Resistance 50
  • Coil Power Rating (DC) 500
  • Coil Polarity Protection Diode Without
  • Actuating System DC
  • Vibration 10G's, 10 – 500Hz
  • Shock 30G's, 6ms
  • Coil Magnetic System Non-Polarized, Monostable
  • Contact Arrangement 2 Form C, DPDT, 2 C/O
  • Contact Current Rating 1
  • Contact Current Class Low Level – 1 A
  • Termination Type Long Leads
  • Mounting Type Printed Circuit Board
  • Operating Temperature Range -55 – 85
3-1658017-1 Board-to-Board Headers & Receptacles
  • Connector Style Plug
  • Connector System Board-to-Board
  • Sealable No
  • Connector & Contact Terminates To Printed Circuit Board
  • Row-to-Row Spacing 4.02
  • Series MICTOR SB
  • PCB Mounting Orientation Vertical
  • Connector Type Connector Assembly
  • Boss Yes
  • Product Type Connector
  • Selectively Loaded Differential Load
  • Stackable No
  • Number of Positions 28
  • Board-to-Board Configuration Vertical
  • Number of Rows 2
  • Impedance 50 Ω
  • Dielectric Withstanding Voltage 675
  • Insulation Resistance 28
  • Voltage 125
  • Insulation Resistance 2
  • Busbar Mating Area Plating Thickness 675
  • Hold-Down Post Plating Thickness 125 – 125
  • Cover Material Polyamide
  • PCB Termination Area Plating Material Gold over Nickel
  • Contact Configuration Single Beam
  • Contact Shape Square
  • Contact Mating Area Plating Material Select Gold
  • Contact Mating Area Plating Thickness .25
  • Contact Current Rating (Max) 1.25
  • Solder Tail Contact Plating Thickness .25
  • Ground Contact Material Phosphor Bronze
  • Contact Base Material Phosphor Bronze
  • Contact Type Pin
  • Termination Method to PC Board Surface Mount
  • Mating Alignment With
  • Mating Alignment Type Guide Post
  • PCB Mount Retention Without
  • PCB Mount Alignment With
  • PCB Mount Alignment Type Locating Posts
  • Connector Mounting Type Board Mount
  • Boardlock Plating Material Phosphor Bronze
  • Centerline (Pitch) .8
  • Housing Material LCP (Liquid Crystal Polymer)
  • Stack Height 19
  • Height 18.36
  • Operating Temperature Range -65 – 125
  • Assembly Process Feature None
  • Pick and Place Cover Without
  • Circuit Application Signal
  • For Use With Receptacle Assembly
  • Packaging Method Box & Tray
  • Packaging Quantity 36
  • Comment Use of stand offs recommended. Contact Product Engineering for recommendations.
3-1658017-2 Board-to-Board Headers & Receptacles
  • Connector Style Plug
  • Connector System Board-to-Board
  • Sealable No
  • Connector & Contact Terminates To Printed Circuit Board
  • Row-to-Row Spacing 4.02
  • Series MICTOR SB
  • PCB Mounting Orientation Vertical
  • Connector Type Connector Assembly
  • Boss Yes
  • Product Type Connector
  • Selectively Loaded Differential Load
  • Stackable No
  • Number of Positions 56
  • Board-to-Board Configuration Vertical
  • Number of Rows 2
  • Impedance 50 Ω
  • Dielectric Withstanding Voltage 675
  • Insulation Resistance 56
  • Voltage 125
  • Insulation Resistance 2
  • Busbar Mating Area Plating Thickness 675
  • Hold-Down Post Plating Thickness 125 – 125
  • Cover Material Polyamide
  • PCB Termination Area Plating Material Gold over Nickel
  • Contact Configuration Single Beam
  • Contact Shape Square
  • Contact Mating Area Plating Material Select Gold
  • Contact Mating Area Plating Thickness .25
  • Contact Current Rating (Max) 1.25
  • Solder Tail Contact Plating Thickness .25
  • Ground Contact Material Phosphor Bronze
  • Contact Base Material Phosphor Bronze
  • Contact Type Pin
  • Termination Method to PC Board Surface Mount
  • Mating Alignment With
  • Mating Alignment Type Guide Post
  • PCB Mount Retention Without
  • PCB Mount Alignment With
  • PCB Mount Alignment Type Locating Posts
  • Connector Mounting Type Board Mount
  • Boardlock Plating Material Phosphor Bronze
  • Centerline (Pitch) .8
  • Housing Material LCP (Liquid Crystal Polymer)
  • Stack Height 19
  • Height 18.36
  • Operating Temperature Range -65 – 125
  • Assembly Process Feature None
  • Pick and Place Cover Without
  • Circuit Application Signal
  • For Use With Receptacle Assembly
  • Packaging Method Box & Tray
  • Packaging Quantity 36
  • Comment Use of stand offs recommended. Contact Product Engineering for recommendations.
3-1658017-3 Board-to-Board Headers & Receptacles
  • Connector Style Plug
  • Connector System Board-to-Board
  • Sealable No
  • Connector & Contact Terminates To Printed Circuit Board
  • Row-to-Row Spacing 4.02
  • Series MICTOR SB
  • PCB Mounting Orientation Vertical
  • Connector Type Connector Assembly
  • Boss Yes
  • Product Type Connector
  • Selectively Loaded Differential Load
  • Stackable No
  • Number of Positions 84
  • Board-to-Board Configuration Vertical
  • Number of Rows 2
  • Impedance 50 Ω
  • Dielectric Withstanding Voltage 675
  • Insulation Resistance 84
  • Voltage 125
  • Insulation Resistance 2
  • Busbar Mating Area Plating Thickness 675
  • Hold-Down Post Plating Thickness 125 – 125
  • Cover Material Polyamide
  • PCB Termination Area Plating Material Gold over Nickel
  • Contact Configuration Single Beam
  • Contact Shape Square
  • Contact Mating Area Plating Material Select Gold
  • Contact Mating Area Plating Thickness .25
  • Contact Current Rating (Max) 1.25
  • Solder Tail Contact Plating Thickness .25
  • Ground Contact Material Phosphor Bronze
  • Contact Base Material Phosphor Bronze
  • Contact Type Pin
  • Termination Method to PC Board Surface Mount
  • Mating Alignment With
  • Mating Alignment Type Guide Post
  • PCB Mount Retention Without
  • PCB Mount Alignment With
  • PCB Mount Alignment Type Locating Posts
  • Connector Mounting Type Board Mount
  • Boardlock Plating Material Phosphor Bronze
  • Centerline (Pitch) .8
  • Housing Material LCP (Liquid Crystal Polymer)
  • Stack Height 19
  • Height 18.36
  • Operating Temperature Range -65 – 125
  • Assembly Process Feature None
  • Pick and Place Cover Without
  • Circuit Application Signal
  • For Use With Receptacle Assembly
  • Packaging Method Box & Tray
  • Packaging Quantity 18
  • Comment Use of stand offs recommended. Contact Product Engineering for recommendations.
3-1658017-4 Board-to-Board Headers & Receptacles
  • Connector Style Plug
  • Connector System Board-to-Board
  • Sealable No
  • Connector & Contact Terminates To Printed Circuit Board
  • Row-to-Row Spacing 4.02
  • Series MICTOR SB
  • PCB Mounting Orientation Vertical
  • Connector Type Connector Assembly
  • Boss Yes
  • Product Type Connector
  • Selectively Loaded Differential Load
  • Stackable No
  • Number of Positions 112
  • Board-to-Board Configuration Vertical
  • Number of Rows 2
  • Impedance 50 Ω
  • Dielectric Withstanding Voltage 675
  • Insulation Resistance 112
  • Voltage 125
  • Insulation Resistance 2
  • Busbar Mating Area Plating Thickness 675
  • Hold-Down Post Plating Thickness 125 – 125
  • Cover Material Polyamide
  • PCB Termination Area Plating Material Gold over Nickel
  • Contact Configuration Single Beam
  • Contact Shape Square
  • Contact Mating Area Plating Material Select Gold
  • Contact Mating Area Plating Thickness .25
  • Contact Current Rating (Max) 1.25
  • Solder Tail Contact Plating Thickness .25
  • Ground Contact Material Phosphor Bronze
  • Contact Base Material Phosphor Bronze
  • Contact Type Pin
  • Termination Method to PC Board Surface Mount
  • Mating Alignment With
  • Mating Alignment Type Guide Post
  • PCB Mount Retention Without
  • PCB Mount Alignment With
  • PCB Mount Alignment Type Locating Posts
  • Connector Mounting Type Board Mount
  • Boardlock Plating Material Phosphor Bronze
  • Centerline (Pitch) .8
  • Housing Material LCP (Liquid Crystal Polymer)
  • Stack Height 19
  • Height 18.36
  • Operating Temperature Range -65 – 125
  • Assembly Process Feature None
  • Pick and Place Cover Without
  • Circuit Application Signal
  • For Use With Receptacle Assembly
  • Packaging Method Box & Tray
  • Packaging Quantity 18
  • Comment Use of stand offs recommended. Contact Product Engineering for recommendations.
3-1658017-5 Board-to-Board Headers & Receptacles
  • Connector Style Plug
  • Connector System Board-to-Board
  • Sealable No
  • Connector & Contact Terminates To Printed Circuit Board
  • Row-to-Row Spacing 4.02
  • Series MICTOR SB
  • PCB Mounting Orientation Vertical
  • Connector Type Connector Assembly
  • Boss Yes
  • Product Type Connector
  • Selectively Loaded Differential Load
  • Stackable No
  • Number of Positions 140
  • Board-to-Board Configuration Vertical
  • Number of Rows 2
  • Impedance 50 Ω
  • Dielectric Withstanding Voltage 675
  • Insulation Resistance 140
  • Voltage 125
  • Insulation Resistance 2
  • Busbar Mating Area Plating Thickness 675
  • Hold-Down Post Plating Thickness 125 – 125
  • Cover Material Polyamide
  • PCB Termination Area Plating Material Gold over Nickel
  • Contact Configuration Single Beam
  • Contact Shape Square
  • Contact Mating Area Plating Material Select Gold
  • Contact Mating Area Plating Thickness .25
  • Contact Current Rating (Max) 1.25
  • Solder Tail Contact Plating Thickness .25
  • Ground Contact Material Phosphor Bronze
  • Contact Base Material Phosphor Bronze
  • Contact Type Pin
  • Termination Method to PC Board Surface Mount
  • Mating Alignment With
  • Mating Alignment Type Guide Post
  • PCB Mount Retention Without
  • PCB Mount Alignment With
  • PCB Mount Alignment Type Locating Posts
  • Connector Mounting Type Board Mount
  • Boardlock Plating Material Phosphor Bronze
  • Centerline (Pitch) .8
  • Housing Material LCP (Liquid Crystal Polymer)
  • Stack Height 19
  • Height 18.36
  • Operating Temperature Range -65 – 125
  • Assembly Process Feature None
  • Pick and Place Cover Without
  • Circuit Application Signal
  • For Use With Receptacle Assembly
  • Packaging Method Box & Tray
  • Packaging Quantity 20
  • Comment Use of stand offs recommended. Contact Product Engineering for recommendations.
3-1658018-1 Board-to-Board Headers & Receptacles
  • Connector Style Plug
  • Connector System Board-to-Board
  • Sealable No
  • Connector & Contact Terminates To Printed Circuit Board
  • Row-to-Row Spacing 4.02
  • Series MICTOR SB
  • PCB Mounting Orientation Vertical
  • Connector Type Connector Assembly
  • Boss Yes
  • Product Type Connector
  • Selectively Loaded Differential Load
  • Stackable No
  • Number of Positions 28
  • Board-to-Board Configuration Vertical
  • Number of Rows 2
  • Impedance 50 Ω
  • Dielectric Withstanding Voltage 675
  • Insulation Resistance 28
  • Voltage 125
  • Insulation Resistance 2
  • Busbar Mating Area Plating Thickness 675
  • Hold-Down Post Plating Thickness 125 – 125
  • Cover Material Polyamide
  • PCB Termination Area Plating Material Gold over Nickel
  • Contact Configuration Single Beam
  • Contact Shape Square
  • Contact Mating Area Plating Material Select Gold
  • Contact Mating Area Plating Thickness .25
  • Contact Current Rating (Max) 1.25
  • Solder Tail Contact Plating Thickness .25
  • Ground Contact Material Phosphor Bronze
  • Contact Base Material Phosphor Bronze
  • Contact Type Pin
  • Termination Method to PC Board Surface Mount
  • Mating Alignment With
  • Mating Alignment Type Guide Post
  • PCB Mount Retention Without
  • PCB Mount Alignment With
  • PCB Mount Alignment Type Locating Posts
  • Connector Mounting Type Board Mount
  • Boardlock Plating Material Phosphor Bronze
  • Centerline (Pitch) .8
  • Housing Material LCP (Liquid Crystal Polymer)
  • Stack Height 22
  • Height 21.36
  • Operating Temperature Range -65 – 125
  • Assembly Process Feature None
  • Pick and Place Cover Without
  • Circuit Application Signal
  • For Use With Receptacle Assembly
  • Packaging Method Box & Tray
  • Packaging Quantity 36
  • Comment Use of stand offs recommended. Contact Product Engineering for recommendations.
3-1658018-2 Board-to-Board Headers & Receptacles
  • Connector Style Plug
  • Connector System Board-to-Board
  • Sealable No
  • Connector & Contact Terminates To Printed Circuit Board
  • Row-to-Row Spacing 4.02
  • Series MICTOR SB
  • PCB Mounting Orientation Vertical
  • Connector Type Connector Assembly
  • Boss Yes
  • Product Type Connector
  • Selectively Loaded Differential Load
  • Stackable No
  • Number of Positions 56
  • Board-to-Board Configuration Vertical
  • Number of Rows 2
  • Impedance 50 Ω
  • Dielectric Withstanding Voltage 675
  • Insulation Resistance 56
  • Voltage 125
  • Insulation Resistance 2
  • Busbar Mating Area Plating Thickness 675
  • Hold-Down Post Plating Thickness 125 – 125
  • Cover Material Polyamide
  • PCB Termination Area Plating Material Gold over Nickel
  • Contact Configuration Single Beam
  • Contact Shape Square
  • Contact Mating Area Plating Material Select Gold
  • Contact Mating Area Plating Thickness .25
  • Contact Current Rating (Max) 1.25
  • Solder Tail Contact Plating Thickness .25
  • Ground Contact Material Phosphor Bronze
  • Contact Base Material Phosphor Bronze
  • Contact Type Pin
  • Termination Method to PC Board Surface Mount
  • Mating Alignment With
  • Mating Alignment Type Guide Post
  • PCB Mount Retention Without
  • PCB Mount Alignment With
  • PCB Mount Alignment Type Locating Posts
  • Connector Mounting Type Board Mount
  • Boardlock Plating Material Phosphor Bronze
  • Centerline (Pitch) .8
  • Housing Material LCP (Liquid Crystal Polymer)
  • Stack Height 22
  • Height 21.36
  • Operating Temperature Range -65 – 125
  • Assembly Process Feature None
  • Pick and Place Cover Without
  • Circuit Application Signal
  • For Use With Receptacle Assembly
  • Packaging Method Box & Tray
  • Packaging Quantity 36
  • Comment Use of stand offs recommended. Contact Product Engineering for recommendations.
3-1658018-3 Board-to-Board Headers & Receptacles
  • Connector Style Plug
  • Connector System Board-to-Board
  • Sealable No
  • Connector & Contact Terminates To Printed Circuit Board
  • Row-to-Row Spacing 4.02
  • Series MICTOR SB
  • PCB Mounting Orientation Vertical
  • Connector Type Connector Assembly
  • Boss Yes
  • Product Type Connector
  • Selectively Loaded Differential Load
  • Stackable No
  • Number of Positions 84
  • Board-to-Board Configuration Vertical
  • Number of Rows 2
  • Impedance 50 Ω
  • Dielectric Withstanding Voltage 675
  • Insulation Resistance 84
  • Voltage 125
  • Insulation Resistance 2
  • Busbar Mating Area Plating Thickness 675
  • Hold-Down Post Plating Thickness 125 – 125
  • Cover Material Polyamide
  • PCB Termination Area Plating Material Gold over Nickel
  • Contact Configuration Single Beam
  • Contact Shape Square
  • Contact Mating Area Plating Material Select Gold
  • Contact Mating Area Plating Thickness .25
  • Contact Current Rating (Max) 1.25
  • Solder Tail Contact Plating Thickness .25
  • Ground Contact Material Phosphor Bronze
  • Contact Base Material Phosphor Bronze
  • Contact Type Pin
  • Termination Method to PC Board Surface Mount
  • Mating Alignment With
  • Mating Alignment Type Guide Post
  • PCB Mount Retention Without
  • PCB Mount Alignment With
  • PCB Mount Alignment Type Locating Posts
  • Connector Mounting Type Board Mount
  • Boardlock Plating Material Phosphor Bronze
  • Centerline (Pitch) .8
  • Housing Material LCP (Liquid Crystal Polymer)
  • Stack Height 22
  • Height 21.36
  • Operating Temperature Range -65 – 125
  • Assembly Process Feature None
  • Pick and Place Cover Without
  • Circuit Application Signal
  • For Use With Receptacle Assembly
  • Packaging Method Box & Tray
  • Packaging Quantity 18
  • Comment Use of stand offs recommended. Contact Product Engineering for recommendations.
3-1658018-4 Board-to-Board Headers & Receptacles
  • Connector Style Plug
  • Connector System Board-to-Board
  • Sealable No
  • Connector & Contact Terminates To Printed Circuit Board
  • Row-to-Row Spacing 4.02
  • Series MICTOR SB
  • PCB Mounting Orientation Vertical
  • Connector Type Connector Assembly
  • Boss Yes
  • Product Type Connector
  • Selectively Loaded Differential Load
  • Stackable No
  • Number of Positions 112
  • Board-to-Board Configuration Vertical
  • Number of Rows 2
  • Impedance 50 Ω
  • Dielectric Withstanding Voltage 675
  • Insulation Resistance 112
  • Voltage 125
  • Insulation Resistance 2
  • Busbar Mating Area Plating Thickness 675
  • Hold-Down Post Plating Thickness 125 – 125
  • Cover Material Polyamide
  • PCB Termination Area Plating Material Gold over Nickel
  • Contact Configuration Single Beam
  • Contact Shape Square
  • Contact Mating Area Plating Material Select Gold
  • Contact Mating Area Plating Thickness .25
  • Contact Current Rating (Max) 1.25
  • Solder Tail Contact Plating Thickness .25
  • Ground Contact Material Phosphor Bronze
  • Contact Base Material Phosphor Bronze
  • Contact Type Pin
  • Termination Method to PC Board Surface Mount
  • Mating Alignment With
  • Mating Alignment Type Guide Post
  • PCB Mount Retention Without
  • PCB Mount Alignment With
  • PCB Mount Alignment Type Locating Posts
  • Connector Mounting Type Board Mount
  • Boardlock Plating Material Phosphor Bronze
  • Centerline (Pitch) .8
  • Housing Material LCP (Liquid Crystal Polymer)
  • Stack Height 22
  • Height 21.36
  • Operating Temperature Range -65 – 125
  • Assembly Process Feature None
  • Pick and Place Cover Without
  • Circuit Application Signal
  • For Use With Receptacle Assembly
  • Packaging Method Box & Tray
  • Packaging Quantity 18
  • Comment Use of stand offs recommended. Contact Product Engineering for recommendations.