5390213-1 DIMM Sockets
  • DRAM Type Non-Buffered
  • Connector System Board-to-Board
  • Row-to-Row Spacing 1.9
  • Sealable No
  • Connector & Contact Terminates To Printed Circuit Board
  • Profile Standard
  • Center Post Without
  • Product Type Socket
  • Number of Positions 100
  • Module Orientation Vertical
  • Number of Bays 3
  • Number of Rows 2
  • Number of Keys 2
  • Center Key None
  • DRAM Voltage 3.3
  • Ejector Type Standard
  • Retention Post Location Both Ends
  • Module Key Type Key1= Offset Right / Key2= Center
  • Ejector Location Both Ends
  • Retention Post Material Phosphor Bronze
  • Solder Tail Contact Plating Material Matte Tin
  • Contact Current Rating (Max) .5
  • Contact Base Material Phosphor Bronze
  • Socket Type Memory Card
  • Socket Style DIMM 2P
  • Solder Tail Contact Plating Thickness 3.81 – 6.35
  • Contact Mating Area Plating Thickness .38
  • Contact Mating Area Plating Material Gold
  • Insertion Style Direct Insert
  • Termination Post Length 2.6
  • Locating Posts With
  • PCB Mounting Style Through Hole
  • Connector Mounting Type Board Mount
  • Mounting Angle Vertical
  • PCB Mount Retention With
  • PCB Mount Retention Type Boardlocks
  • Centerline (Pitch) 1.27
  • Housing Color Black
  • Housing Material Glass-Filled High Temperature Nylon
  • Height above PC Board 23.82
  • Operating Temperature Range -55 – 85
  • Circuit Application Signal
  • UL Flammability Rating UL 94V-0
  • Packaging Method Box & Tube
  • Packaging Quantity 44
3-1489841-2 DIMM Sockets
  • DRAM Type Double Data Rate (DDR) 2
  • Connector System Board-to-Board
  • Row-to-Row Spacing 1.9
  • Sealable No
  • Connector & Contact Terminates To Printed Circuit Board
  • Center Post With
  • Product Type Socket
  • Number of Positions 240
  • Module Orientation Vertical
  • Number of Bays 2
  • Number of Rows 2
  • Keying Standard
  • Number of Keys 1
  • Center Key Center
  • DRAM Voltage 1.8
  • Ejector Type Standard
  • Retention Post Location Both Ends
  • Latch Color Blue
  • Module Key Type Center
  • Latch Material High Temperature Thermoplastic
  • Ejector Location Both Ends
  • Ejector Material High Temperature Thermoplastic
  • Retention Post Material Stainless Steel
  • Ejector Material Color Natural
  • Solder Tail Contact Plating Material Matte Tin over Nickel
  • Contact Current Rating (Max) .5
  • Contact Base Material Copper Alloy
  • Socket Type Memory Card
  • Socket Style DIMM
  • Solder Tail Contact Plating Thickness 3
  • Contact Mating Area Plating Thickness .38
  • Contact Mating Area Plating Material Gold
  • Insertion Style Direct Insert
  • Termination Post Length 3.18
  • Locating Posts With
  • PCB Mounting Style Through Hole
  • Connector Mounting Type Board Mount
  • Mounting Angle Vertical
  • Boardlock Material Stainless Steel
  • PCB Mount Retention With
  • PCB Mount Retention Type Retention Clip/Post
  • Centerline (Pitch) 1
  • Housing Color Natural
  • Housing Material High Temperature Nylon
  • Center Retention Hole Diameter 1.5
  • Height above PC Board 23.1
  • Operating Temperature Range -55 – 85
  • Circuit Application Signal
  • UL Flammability Rating UL 94V-0
  • Packaging Method Box & Tray
  • Packaging Quantity 64
1658912-3 DIMM Sockets
  • DRAM Type Double Data Rate (DDR) 2
  • Connector System Board-to-Board
  • Row-to-Row Spacing 1.9
  • Sealable No
  • Connector & Contact Terminates To Printed Circuit Board
  • Profile Low
  • Center Post With
  • Product Type Socket
  • Number of Positions 240
  • Module Orientation 25°
  • Number of Bays 2
  • Number of Rows 2
  • Keying Standard
  • Number of Keys 1
  • Center Key Center
  • DRAM Voltage 1.8
  • Ejector Type Standard
  • Retention Post Location Both Ends
  • Latch Color Natural
  • Module Key Type Center
  • Latch Material High Temperature Thermoplastic
  • Ejector Location Both Ends
  • Ejector Material High Temperature Thermoplastic
  • Retention Post Material Copper Alloy
  • Ejector Material Color Natural
  • Solder Tail Contact Plating Material Matte Tin over Nickel
  • Contact Current Rating (Max) .5
  • Contact Base Material Copper Alloy
  • Socket Type Memory Card
  • Socket Style DIMM
  • Solder Tail Contact Plating Thickness 3
  • Contact Mating Area Plating Thickness .76
  • Contact Mating Area Plating Material Gold
  • Insertion Style Direct Insert
  • Termination Post Length 4
  • Locating Posts Without
  • PCB Mounting Style Through Hole
  • Connector Mounting Type Board Mount
  • Mounting Angle Right Angle
  • Boardlock Material Copper Alloy
  • PCB Mount Retention With
  • PCB Mount Retention Type Boardlocks
  • Centerline (Pitch) 1
  • Housing Color Black
  • Housing Material High Temperature Thermoplastic
  • Center Retention Hole Diameter 1.8 x 2.45
  • Height above PC Board 16.2
  • Operating Temperature Range -55 – 105
  • Circuit Application Signal
  • UL Flammability Rating UL 94V-0
  • Packaging Method Box & Tray
  • Packaging Quantity 32
5390170-6 DIMM Sockets
  • DRAM Type Non-Buffered
  • Connector System Board-to-Board
  • Row-to-Row Spacing 1.6
  • Sealable No
  • Connector & Contact Terminates To Printed Circuit Board
  • Profile Low
  • Center Post With
  • Product Type Socket
  • Number of Positions 168
  • Module Orientation 25°
  • Number of Bays 3
  • Number of Rows 2
  • Number of Keys 2
  • Center Key Center
  • DRAM Voltage 3.3
  • Ejector Type Standard
  • Retention Post Location Center
  • Module Key Type Key1= Offset Right / Key2= Center
  • Latch Material High Temperature Nylon
  • Ejector Location Both Ends
  • Ejector Material High Temperature Nylon
  • Retention Post Material Phosphor Bronze
  • Solder Tail Contact Plating Material Tin over Nickel
  • Contact Current Rating (Max) .5
  • Contact Base Material Phosphor Bronze
  • Socket Type Memory Card
  • Socket Style DIMM 2P
  • Solder Tail Contact Plating Thickness 3.81
  • Contact Mating Area Plating Thickness .76
  • Contact Mating Area Plating Material Gold
  • Insertion Style Direct Insert
  • Termination Post Length 2.6
  • PCB Mounting Style Through Hole
  • Connector Mounting Type Board Mount
  • Polarization Left
  • Mounting Angle Right Angle
  • PCB Mount Retention With
  • PCB Mount Retention Type Boardlocks
  • Centerline (Pitch) 1.27
  • Housing Color Black
  • Housing Material High Temperature Nylon
  • Center Retention Hole Diameter 2.4
  • Height above PC Board 12.15
  • Operating Temperature Range -55 – 85
  • Circuit Application Signal
  • UL Flammability Rating UL 94V-0
  • Packaging Method Box & Tray
  • Packaging Quantity 32
6376118-6 DIMM Sockets
  • DRAM Type Single Data Rate (M3)
  • Connector System Board-to-Board
  • Row-to-Row Spacing 1.6
  • Sealable No
  • Connector & Contact Terminates To Printed Circuit Board
  • Profile Standard
  • Product Type Socket
  • Number of Positions 90
  • Module Orientation Vertical
  • Number of Bays 2
  • Number of Rows 2
  • Number of Keys 1
  • Center Key Offset Left
  • Ejector Type Locking
  • Retention Post Location None
  • Module Key Type Offset Right
  • Ejector Location Left End Only
  • Ejector Material High Temperature Thermoplastic
  • Retention Post Material Stainless Steel
  • Ejector Material Color Silver
  • Solder Tail Contact Plating Material Matte Tin over Nickel
  • Contact Current Rating (Max) .5
  • Contact Base Material Copper Alloy
  • Socket Type Memory Card
  • Socket Style DIMM
  • Solder Tail Contact Plating Thickness 3
  • Contact Mating Area Plating Material Gold
  • Insertion Style Cam-In
  • Termination Post Length 2.6
  • Locating Posts Without
  • PCB Mounting Style Surface Mount
  • Connector Mounting Type Board Mount
  • Polarization Left
  • Mounting Angle Vertical
  • Boardlock Material Stainless Steel
  • PCB Mount Retention With
  • PCB Mount Retention Type Boardlocks
  • Centerline (Pitch) 1.27
  • Housing Color Gray
  • Housing Material Thermoplastic
  • Height above PC Board 30.4
  • Operating Temperature Range -55 – 85
  • Circuit Application Signal
  • UL Flammability Rating UL 94V-0
  • Packaging Method Box & Tray
  • Packaging Quantity 80
1658912-2 DIMM Sockets
  • DRAM Type Double Data Rate (DDR) 2
  • Connector System Board-to-Board
  • Row-to-Row Spacing 1.9
  • Sealable No
  • Connector & Contact Terminates To Printed Circuit Board
  • Profile Low
  • Center Post With
  • Product Type Socket
  • Number of Positions 240
  • Module Orientation 25°
  • Number of Bays 2
  • Number of Rows 2
  • Keying Standard
  • Number of Keys 1
  • Center Key Center
  • DRAM Voltage 1.8
  • Ejector Type Standard
  • Retention Post Location Both Ends
  • Latch Color Natural
  • Module Key Type Center
  • Latch Material High Temperature Thermoplastic
  • Ejector Location Both Ends
  • Ejector Material High Temperature Thermoplastic
  • Retention Post Material Copper Alloy
  • Ejector Material Color Natural
  • Solder Tail Contact Plating Material Matte Tin over Nickel
  • Contact Current Rating (Max) .5
  • Contact Base Material Copper Alloy
  • Socket Type Memory Card
  • Socket Style DIMM
  • Solder Tail Contact Plating Thickness 3
  • Contact Mating Area Plating Thickness .76
  • Contact Mating Area Plating Material Gold
  • Insertion Style Direct Insert
  • Termination Post Length 3.18
  • Locating Posts Without
  • PCB Mounting Style Through Hole
  • Connector Mounting Type Board Mount
  • Mounting Angle Right Angle
  • Boardlock Material Copper Alloy
  • PCB Mount Retention With
  • PCB Mount Retention Type Boardlocks
  • Centerline (Pitch) 1
  • Housing Color Black
  • Housing Material High Temperature Thermoplastic
  • Center Retention Hole Diameter 1.8 x 2.45
  • Height above PC Board 16.2
  • Operating Temperature Range -55 – 105
  • Circuit Application Signal
  • UL Flammability Rating UL 94V-0
  • Packaging Method Box & Tray
  • Packaging Quantity 32
4-1932000-8 DIMM Sockets
  • DRAM Type Double Data Rate (DDR) 3
  • Connector System Board-to-Board
  • Row-to-Row Spacing 1.9
  • Sealable No
  • Connector & Contact Terminates To Printed Circuit Board
  • Product Type Socket
  • Number of Positions 240
  • Module Orientation Vertical
  • Ejector Type Standard
  • Contact Current Rating (Max) .75
  • PCB Mounting Style Through Hole
  • Connector Mounting Type Board Mount
  • Polarization Left
  • PCB Mount Retention Type Boardlocks
  • Centerline (Pitch) 1
  • Operating Temperature Range -55 – 155
  • Circuit Application Signal
  • Packaging Method Box & Tray
2308107-8 DIMM Sockets  1
  • DRAM Type Double Data Rate (DDR) 4
  • Connector System Board-to-Bus Bar
  • Sealable No
  • Connector & Contact Terminates To Printed Circuit Board
  • Profile Standard
  • Center Post Without
  • Product Type Socket
  • Number of Positions 288
  • Module Orientation Vertical
  • Number of Rows 2
  • Keying Standard
  • Number of Keys 1
  • Center Key Offset Right
  • DRAM Voltage 1.2
  • Ejector Type Standard
  • Latch Color Natural
  • Module Key Type Offset Right
  • Latch Material High Temperature Thermoplastic
  • Ejector Location Both Ends
  • Ejector Material High Temperature Thermoplastic
  • Ejector Material Color Natural
  • Contact Current Rating (Max) .75
  • Contact Base Material Copper Alloy
  • Socket Type Memory Card
  • Socket Style DIMM
  • Contact Mating Area Plating Thickness .38
  • Contact Mating Area Plating Material Gold
  • Insertion Style Direct Insert
  • PCB Mounting Style Through Hole
  • Connector Mounting Type Board Mount
  • Boardlock Material Stainless Steel
  • PCB Mount Retention With
  • PCB Mount Retention Type Boardlock
  • Centerline (Pitch) .85
  • Housing Color Green
  • Housing Material High Temperature Thermoplastic
  • Operating Temperature Range -55 – 105
  • Circuit Application Signal
  • UL Flammability Rating UL 94V-0
  • Packaging Method Soft Tray
1-1932680-1 DIMM Sockets
  • DRAM Type Double Data Rate (DDR) 3
  • Connector System Board-to-Board
  • Row-to-Row Spacing 1.9
  • Sealable No
  • Connector & Contact Terminates To Printed Circuit Board
  • Center Post Without
  • Product Type Socket
  • Number of Positions 240
  • Module Orientation Vertical
  • Number of Bays 2
  • Number of Rows 2
  • Keying Standard
  • Number of Keys 1
  • Center Key Offset Left
  • DRAM Voltage 1.5
  • Ejector Type Rotary
  • Retention Post Location Both Ends
  • Latch Color Natural
  • Module Key Type Offset Left
  • Latch Material Thermoplastic
  • Ejector Location Both Ends
  • Ejector Material Thermoplastic
  • Retention Post Material Copper Alloy
  • Ejector Material Color Natural
  • Solder Tail Contact Plating Material Matte Tin
  • Contact Current Rating (Max) .5
  • Contact Base Material Copper Alloy
  • Socket Type Memory Card
  • Socket Style DIMM
  • Solder Tail Contact Plating Thickness 2.54
  • Contact Mating Area Plating Thickness .76
  • Contact Mating Area Plating Material Gold
  • Insertion Style Direct Insert
  • Termination Post Length 3.18
  • Locating Posts Without
  • PCB Mounting Style Through Hole
  • Connector Mounting Type Board Mount
  • Mounting Angle Vertical
  • Boardlock Material Copper Alloy
  • PCB Mount Retention With
  • PCB Mount Retention Type Boardlocks
  • Centerline (Pitch) 2
  • Housing Color Black
  • Housing Material High Temperature Nylon
  • Center Retention Hole Diameter 2.45
  • Height above PC Board 21
  • Operating Temperature Range -40 – 85
  • Circuit Application Signal
  • UL Flammability Rating UL 94V-0
  • Packaging Method Soft Tray
  • Packaging Quantity 54
1-1932000-0 DIMM Sockets
  • DRAM Type Double Data Rate (DDR) 3
  • Connector System Board-to-Board
  • Row-to-Row Spacing 1.9
  • Sealable No
  • Connector & Contact Terminates To Printed Circuit Board
  • Center Post With
  • Product Type Socket
  • Number of Positions 240
  • Module Orientation Vertical
  • Number of Bays 2
  • Number of Rows 2
  • Keying Standard
  • Number of Keys 1
  • Center Key Center
  • DRAM Voltage 1.5
  • Ejector Type Standard
  • Retention Post Location Center
  • Latch Color Natural
  • Module Key Type Offset Left
  • Latch Material Thermoplastic
  • Ejector Location Both Ends
  • Ejector Material High Temperature Nylon
  • Retention Post Material Brass
  • Ejector Material Color Natural
  • Solder Tail Contact Plating Material Matte Tin over Nickel
  • Contact Current Rating (Max) .75
  • Contact Base Material Copper Alloy
  • Socket Type Memory Card
  • Socket Style DIMM
  • Solder Tail Contact Plating Thickness 3
  • Contact Mating Area Plating Thickness .38
  • Contact Mating Area Plating Material Gold
  • Insertion Style Direct Insert
  • Termination Post Length 2.67
  • PCB Mounting Style Through Hole
  • Connector Mounting Type Board Mount
  • Mounting Angle Vertical
  • Boardlock Material Brass
  • PCB Mount Retention With
  • PCB Mount Retention Type Retention Clip/Post
  • Centerline (Pitch) 1
  • Housing Color Black
  • Housing Material High Temperature Nylon
  • Center Retention Hole Diameter 1.8
  • Height above PC Board 23.1
  • Operating Temperature Range -55 – 155
  • Circuit Application Signal
  • UL Flammability Rating UL 94V-0
  • Packaging Method Tray
  • Packaging Quantity 50