2069838-4 IC Socket Hardware
  • Accessory Type ILM Kit
  • Product Type ILM/Backplate Kit
  • Backplate Material Steel
  • Top Support Plate Material Stainless Steel
  • Spring Plate Assembly Material Stainless Steel
  • Socket Type LGA 1156
  • Operating Temperature Range -25 – 100
  • Packaging Method Box & Tray
2-2134533-1 IC Socket Hardware
  • Accessory Type ILM Kit
  • Product Type ILM/Backplate Kit
  • Backplate Material Steel
  • Top Support Plate Material Stainless Steel
  • Spring Plate Assembly Material Stainless Steel
  • Socket Type LGA 2011
  • Operating Temperature Range -25 – 100
  • Packaging Method Box & Tray
2069965-1 LGA Sockets
  • Connector System Board-to-Board
  • Connector & Contact Terminates To Printed Circuit Board
  • Product Type Socket
  • Number of Positions 1155
  • Grid Spacing .914 x .914
  • Plating Thickness 15
  • Plating Material Gold
  • Frame Style Square
  • Contact Base Material Copper Alloy
  • Socket Type LGA 1155
  • Contact Mating Area Plating Material Gold
  • Contact Mating Area Plating Thickness 15
  • Contact Current Rating (Max) .5
  • PCB Mounting Style Surface Mount Solder Ball
  • Connector Mounting Type Board Mount
  • Heat Sink Attachment Without
  • Centerline (Pitch) .9144
  • Housing Color Black
  • Housing Material High Temperature Thermoplastic
  • Operating Temperature Range -25 – 100
  • Circuit Application Signal
  • UL Flammability Rating UL 94V-0
  • Packaging Method Tray
  • Tray Color Black
  • Comment Lead-Free Solderball
2229339-2 IC Socket Hardware
  • Accessory Type ILM Assembly
  • Product Type Accessory
  • Top Support Plate Material Stainless Steel
  • Spring Plate Assembly Material Stainless Steel
  • Socket Type LGA 2011
  • Operating Temperature Range -25 – 100
  • Packaging Method Box & Tray
2286211-3 PCB Spring Contacts  1
  • Product Type Spring Finger
  • Preloaded Yes
  • Current Rating 2
  • Contact Plating Material Gold Flash
  • Contact Current Rating (Max) 4
  • Contact Plating Thickness .5
  • Uncompressed Height 2.4
  • Width 1.7
  • Operating Temperature Range -40 – 85
  • Circuit Application Signal
  • Packaging Method Tape & Reel
  • Packaging Quantity 5000
2069838-5 IC Socket Hardware
  • Accessory Type ILM Kit
  • Product Type ILM/Backplate Kit
  • Backplate Material Steel
  • Top Support Plate Material Stainless Steel
  • Spring Plate Assembly Material Stainless Steel
  • Socket Type LGA 1156
  • Operating Temperature Range -25 – 100
  • Packaging Method Box & Tray
1-1932680-1 DIMM Sockets
  • DRAM Type Double Data Rate (DDR) 3
  • Connector System Board-to-Board
  • Row-to-Row Spacing 1.9
  • Sealable No
  • Connector & Contact Terminates To Printed Circuit Board
  • Center Post Without
  • Product Type Socket
  • Number of Positions 240
  • Module Orientation Vertical
  • Number of Bays 2
  • Number of Rows 2
  • Keying Standard
  • Number of Keys 1
  • Center Key Offset Left
  • DRAM Voltage 1.5
  • Ejector Type Rotary
  • Retention Post Location Both Ends
  • Latch Color Natural
  • Module Key Type Offset Left
  • Latch Material Thermoplastic
  • Ejector Location Both Ends
  • Ejector Material Thermoplastic
  • Retention Post Material Copper Alloy
  • Ejector Material Color Natural
  • Contact Base Material Copper Alloy
  • PCB Contact Termination Area Plating Material Matte Tin
  • Contact Current Rating (Max) .5
  • Socket Style DIMM
  • Solder Tail Contact Plating Thickness 2.54
  • Contact Mating Area Plating Thickness .76
  • Contact Mating Area Plating Material Gold
  • Socket Type Memory Card
  • Insertion Style Direct Insert
  • Termination Post Length 3.18
  • PCB Mount Retention Type Boardlock
  • PCB Mount Retention With
  • Locating Posts Without
  • PCB Mounting Style Through Hole
  • Connector Mounting Type Board Mount
  • Mounting Angle Vertical
  • Boardlock Material Copper Alloy
  • Centerline (Pitch) 2
  • Housing Color Black
  • Housing Material High Temperature Nylon
  • Center Retention Hole Diameter 2.45
  • Height above PC Board 21
  • Operating Temperature Range -40 – 85
  • Circuit Application Signal
  • UL Flammability Rating UL 94V-0
  • Packaging Method Soft Tray
  • Packaging Quantity 54
2069838-7 IC Socket Hardware
  • Accessory Type ILM Kit
  • Product Type ILM/Backplate Kit
  • Backplate Material Steel
  • Top Support Plate Material Stainless Steel
  • Spring Plate Assembly Material Stainless Steel
  • Socket Type LGA 1156
  • Operating Temperature Range -25 – 100
  • Packaging Method Box & Tray
1932680-6 DIMM Sockets
  • DRAM Type Double Data Rate (DDR) 3
  • Connector System Board-to-Board
  • Row-to-Row Spacing 1.9
  • Sealable No
  • Connector & Contact Terminates To Printed Circuit Board
  • Center Post Without
  • Product Type Socket
  • Number of Positions 240
  • Module Orientation Vertical
  • Number of Bays 2
  • Number of Rows 2
  • Keying Standard
  • Number of Keys 1
  • Center Key Offset Left
  • DRAM Voltage 1.5
  • Ejector Type Rotary
  • Retention Post Location Both Ends
  • Latch Color Natural
  • Module Key Type Offset Left
  • Latch Material Thermoplastic
  • Ejector Location Both Ends
  • Ejector Material Thermoplastic
  • Retention Post Material Copper Alloy
  • Ejector Material Color Natural
  • Contact Base Material Copper Alloy
  • PCB Contact Termination Area Plating Material Matte Tin
  • Contact Current Rating (Max) .5
  • Socket Style DIMM
  • Solder Tail Contact Plating Thickness 2.54
  • Contact Mating Area Plating Thickness .38
  • Contact Mating Area Plating Material Gold
  • Socket Type Memory Card
  • Insertion Style Direct Insert
  • Termination Post Length 3.18
  • PCB Mount Retention Type Boardlock
  • PCB Mount Retention With
  • Locating Posts Without
  • PCB Mounting Style Through Hole
  • Connector Mounting Type Board Mount
  • Mounting Angle Vertical
  • Boardlock Material Copper Alloy
  • Centerline (Pitch) 2
  • Housing Color Black
  • Housing Material High Temperature Nylon
  • Center Retention Hole Diameter 2.45
  • Height above PC Board 21
  • Operating Temperature Range -40 – 85
  • Circuit Application Signal
  • UL Flammability Rating UL 94V-0
  • Packaging Method Soft Tray
  • Packaging Quantity 54
2-1932680-0 DIMM Sockets
  • DRAM Type Double Data Rate (DDR) 3
  • Connector System Board-to-Board
  • Row-to-Row Spacing .95
  • Sealable No
  • Connector & Contact Terminates To Printed Circuit Board
  • Center Post Without
  • Product Type Socket
  • Number of Positions 240
  • Module Orientation Vertical
  • Number of Bays 2
  • Number of Rows 2
  • Keying Standard
  • Number of Keys 1
  • Center Key Offset Left
  • DRAM Voltage 1.5
  • Ejector Type Rotary
  • Retention Post Location Both Ends
  • Latch Color Black
  • Module Key Type Offset Left
  • Latch Material Thermoplastic
  • Ejector Location Both Ends
  • Ejector Material Thermoplastic
  • Retention Post Material Copper Alloy
  • Ejector Material Color Black
  • Contact Base Material Copper Alloy
  • PCB Contact Termination Area Plating Material Matte Tin
  • Contact Current Rating (Max) .5
  • Socket Style DIMM
  • Solder Tail Contact Plating Thickness 2.54
  • Contact Mating Area Plating Thickness .76
  • Contact Mating Area Plating Material Gold
  • Socket Type Memory Card
  • Insertion Style Direct Insert
  • Termination Post Length 3.18
  • PCB Mount Retention Type Boardlock
  • PCB Mount Retention With
  • Locating Posts Without
  • PCB Mounting Style Through Hole
  • Connector Mounting Type Board Mount
  • Mounting Angle Vertical
  • Boardlock Material Copper Alloy
  • Centerline (Pitch) 2
  • Housing Color Black
  • Housing Material High Temperature Nylon
  • Center Retention Hole Diameter 2.45
  • Height above PC Board 21
  • Operating Temperature Range -40 – 85
  • Circuit Application Signal
  • UL Flammability Rating UL 94V-0
  • Packaging Method Soft Tray
  • Packaging Quantity 54
1-1932680-0 DIMM Sockets
  • DRAM Type Double Data Rate (DDR) 3
  • Connector System Board-to-Board
  • Row-to-Row Spacing .95
  • Sealable No
  • Connector & Contact Terminates To Printed Circuit Board
  • Center Post Without
  • Product Type Socket
  • Number of Positions 240
  • Module Orientation Vertical
  • Number of Bays 2
  • Number of Rows 2
  • Keying Standard
  • Number of Keys 1
  • Center Key Offset Left
  • DRAM Voltage 1.5
  • Ejector Type Rotary
  • Retention Post Location Both Ends
  • Latch Color Green
  • Module Key Type Offset Left
  • Latch Material Thermoplastic
  • Ejector Location Both Ends
  • Ejector Material Thermoplastic
  • Retention Post Material Copper Alloy
  • Ejector Material Color Green
  • Contact Base Material Copper Alloy
  • PCB Contact Termination Area Plating Material Matte Tin
  • Contact Current Rating (Max) .5
  • Socket Style DIMM
  • Solder Tail Contact Plating Thickness 2.54
  • Contact Mating Area Plating Thickness .51
  • Contact Mating Area Plating Material Gold
  • Socket Type Memory Card
  • Insertion Style Direct Insert
  • Termination Post Length 2.85
  • PCB Mount Retention Type Boardlock
  • PCB Mount Retention With
  • Locating Posts Without
  • PCB Mounting Style Through Hole
  • Connector Mounting Type Board Mount
  • Mounting Angle Vertical
  • Boardlock Material Copper Alloy
  • Centerline (Pitch) 2
  • Housing Color Black
  • Housing Material High Temperature Nylon
  • Center Retention Hole Diameter 2.45
  • Height above PC Board 21
  • Operating Temperature Range -40 – 85
  • Circuit Application Signal
  • UL Flammability Rating UL 94V-0
  • Packaging Method Soft Tray
  • Packaging Quantity 54
1-1932680-3 DIMM Sockets
  • DRAM Type Double Data Rate (DDR) 3
  • Connector System Board-to-Board
  • Row-to-Row Spacing 1.9
  • Sealable No
  • Connector & Contact Terminates To Printed Circuit Board
  • Center Post Without
  • Product Type Socket
  • Number of Positions 240
  • Module Orientation Vertical
  • Number of Bays 2
  • Number of Rows 2
  • Keying Standard
  • Number of Keys 1
  • Center Key Offset Left
  • DRAM Voltage 1.5
  • Ejector Type Rotary
  • Retention Post Location Both Ends
  • Latch Color Natural
  • Module Key Type Offset Left
  • Latch Material Thermoplastic
  • Ejector Location Both Ends
  • Ejector Material Thermoplastic
  • Retention Post Material Copper Alloy
  • Ejector Material Color Natural
  • Contact Base Material Copper Alloy
  • PCB Contact Termination Area Plating Material Matte Tin
  • Contact Current Rating (Max) .5
  • Socket Style DIMM
  • Solder Tail Contact Plating Thickness 2.54
  • Contact Mating Area Plating Thickness .51
  • Contact Mating Area Plating Material Gold
  • Socket Type Memory Card
  • Insertion Style Direct Insert
  • Termination Post Length 2.54
  • PCB Mount Retention Type Boardlock
  • PCB Mount Retention With
  • Locating Posts Without
  • PCB Mounting Style Through Hole
  • Connector Mounting Type Board Mount
  • Mounting Angle Vertical
  • Boardlock Material Copper Alloy
  • Centerline (Pitch) 2
  • Housing Color Black
  • Housing Material High Temperature Nylon
  • Center Retention Hole Diameter 2.45
  • Height above PC Board 21
  • Operating Temperature Range -40 – 85
  • Circuit Application Signal
  • UL Flammability Rating UL 94V-0
  • Packaging Method Soft Tray
  • Packaging Quantity 54
1-1932810-0 DIMM Sockets
  • DRAM Type Double Data Rate (DDR) 3
  • Connector System Board-to-Board
  • Row-to-Row Spacing 1.45
  • Sealable No
  • Connector & Contact Terminates To Printed Circuit Board
  • Center Post Without
  • Product Type Socket
  • Number of Positions 240
  • Module Orientation Vertical
  • Number of Bays 2
  • Number of Rows 2
  • Keying Standard
  • Number of Keys 1
  • Center Key Offset Left
  • DRAM Voltage 1.5
  • Ejector Type Rotary
  • Latch Color Green
  • Module Key Type Offset Left
  • Latch Material Thermoplastic
  • Ejector Location Both Ends
  • Ejector Material Thermoplastic
  • Ejector Material Color Green
  • Contact Base Material Copper Alloy
  • PCB Contact Termination Area Plating Material Matte Tin
  • Contact Current Rating (Max) .5
  • Socket Style DIMM
  • Solder Tail Contact Plating Thickness 2.54
  • Contact Mating Area Plating Thickness .51
  • Contact Mating Area Plating Material Gold
  • Socket Type Memory Card
  • Insertion Style Direct Insert
  • PCB Mount Retention Type Solder Peg
  • PCB Mount Retention With
  • PCB Mounting Style Surface Mount
  • Connector Mounting Type Board Mount
  • Polarization Left
  • Mounting Angle Right Angle
  • Centerline (Pitch) 1
  • Housing Color Black
  • Housing Material Thermoplastic
  • Center Retention Hole Diameter 2.45
  • Height above PC Board 21
  • Operating Temperature Range -40 – 85
  • Circuit Application Signal
  • UL Flammability Rating UL 94V-0
  • Packaging Method Hard Tray
  • Packaging Quantity 480
1-2229348-1 LGA Sockets
  • Product Type Accessory
  • Number of Positions 2011
  • Grid Spacing 1.016 x .8814
  • Plating Material Gold
  • Frame Style Square
  • Contact Base Material Copper Alloy
  • Socket Type LGA 2011
  • Contact Mating Area Plating Material No Plating
  • PCB Mounting Style Surface Mount Solder Ball
  • Heat Sink Attachment Without
  • Housing Color Without
  • Housing Material High Temperature Thermoplastic
  • UL Flammability Rating UL 94V-0
  • Packaging Method Tray
  • Tray Color Black
  • Comment Lead-Free Solderball
1932680-4 DIMM Sockets
  • DRAM Type Double Data Rate (DDR) 3
  • Connector System Board-to-Board
  • Row-to-Row Spacing 1.9
  • Sealable No
  • Connector & Contact Terminates To Printed Circuit Board
  • Center Post Without
  • Product Type Socket
  • Number of Positions 240
  • Module Orientation Vertical
  • Number of Bays 2
  • Number of Rows 2
  • Keying Standard
  • Number of Keys 1
  • Center Key Offset Left
  • DRAM Voltage 1.5
  • Ejector Type Rotary
  • Retention Post Location Both Ends
  • Latch Color Natural
  • Module Key Type Offset Left
  • Latch Material Thermoplastic
  • Ejector Location Both Ends
  • Ejector Material Thermoplastic
  • Retention Post Material Copper Alloy
  • Ejector Material Color Natural
  • Contact Base Material Copper Alloy
  • PCB Contact Termination Area Plating Material Matte Tin
  • Contact Current Rating (Max) .5
  • Socket Style DIMM
  • Solder Tail Contact Plating Thickness 2.54
  • Contact Mating Area Plating Thickness .51
  • Contact Mating Area Plating Material Gold
  • Socket Type Memory Card
  • Insertion Style Direct Insert
  • Termination Post Length 3.18
  • PCB Mount Retention Type Boardlock
  • PCB Mount Retention With
  • Locating Posts Without
  • PCB Mounting Style Through Hole
  • Connector Mounting Type Board Mount
  • Mounting Angle Vertical
  • Boardlock Material Copper Alloy
  • Centerline (Pitch) 2
  • Housing Color Black
  • Housing Material High Temperature Nylon
  • Center Retention Hole Diameter 2.45
  • Height above PC Board 21
  • Operating Temperature Range -40 – 85
  • Circuit Application Signal
  • UL Flammability Rating UL 94V-0
  • Packaging Method Soft Tray
  • Packaging Quantity 54
1932810-8 DIMM Sockets
  • DRAM Type Double Data Rate (DDR) 3
  • Connector System Board-to-Board
  • Row-to-Row Spacing 1.45
  • Sealable No
  • Connector & Contact Terminates To Printed Circuit Board
  • Center Post Without
  • Product Type Socket
  • Number of Positions 240
  • Module Orientation Vertical
  • Number of Bays 2
  • Number of Rows 2
  • Keying Standard
  • Number of Keys 1
  • Center Key Offset Left
  • DRAM Voltage 1.5
  • Ejector Type Rotary
  • Latch Color Natural
  • Module Key Type Offset Left
  • Latch Material Thermoplastic
  • Ejector Location Both Ends
  • Ejector Material Thermoplastic
  • Ejector Material Color Natural
  • Contact Base Material Copper Alloy
  • PCB Contact Termination Area Plating Material Matte Tin
  • Contact Current Rating (Max) .5
  • Socket Style DIMM
  • Solder Tail Contact Plating Thickness 2.54
  • Contact Mating Area Plating Thickness .51
  • Contact Mating Area Plating Material Gold
  • Socket Type Memory Card
  • Insertion Style Direct Insert
  • PCB Mount Retention Type Solder Peg
  • PCB Mount Retention With
  • PCB Mounting Style Surface Mount
  • Connector Mounting Type Board Mount
  • Polarization Left
  • Mounting Angle Right Angle
  • Centerline (Pitch) 1
  • Housing Color Black
  • Housing Material Thermoplastic
  • Center Retention Hole Diameter 2.45
  • Height above PC Board 21
  • Operating Temperature Range -40 – 85
  • Circuit Application Signal
  • UL Flammability Rating UL 94V-0
  • Packaging Method Hard Tray
  • Packaging Quantity 480
1932810-9 DIMM Sockets
  • DRAM Type Double Data Rate (DDR) 3
  • Connector System Board-to-Board
  • Row-to-Row Spacing 1.45
  • Sealable No
  • Connector & Contact Terminates To Printed Circuit Board
  • Center Post Without
  • Product Type Socket
  • Number of Positions 240
  • Module Orientation Vertical
  • Number of Bays 2
  • Number of Rows 2
  • Keying Standard
  • Number of Keys 1
  • Center Key Offset Left
  • DRAM Voltage 1.5
  • Ejector Type Rotary
  • Latch Color Black
  • Module Key Type Offset Left
  • Latch Material Thermoplastic
  • Ejector Location Both Ends
  • Ejector Material Thermoplastic
  • Ejector Material Color Black
  • Contact Base Material Copper Alloy
  • PCB Contact Termination Area Plating Material Matte Tin
  • Contact Current Rating (Max) .5
  • Socket Style DIMM
  • Solder Tail Contact Plating Thickness 2.54
  • Contact Mating Area Plating Thickness .51
  • Contact Mating Area Plating Material Gold
  • Socket Type Memory Card
  • Insertion Style Direct Insert
  • PCB Mount Retention Type Solder Peg
  • PCB Mount Retention With
  • PCB Mounting Style Surface Mount
  • Connector Mounting Type Board Mount
  • Polarization Left
  • Mounting Angle Right Angle
  • Centerline (Pitch) 1
  • Housing Color Black
  • Housing Material Thermoplastic
  • Center Retention Hole Diameter 2.45
  • Height above PC Board 21
  • Operating Temperature Range -40 – 85
  • Circuit Application Signal
  • UL Flammability Rating UL 94V-0
  • Packaging Method Hard Tray
  • Packaging Quantity 480
1939738-1 IC Socket Hardware
  • Accessory Type ILM
  • Product Type Accessory
  • Insulator Material Polycarbonate Film Plus Acrylic Adhesive Layer
  • Handle Type U Lever
  • Backplate Material Steel
  • Top Support Plate Material Stainless Steel
  • Spring Plate Assembly Material Stainless Steel
  • Socket Type LGA 1366
  • Operating Temperature Range -25 – 100
  • Packaging Method Bag/Box
2-2134533-2 IC Socket Hardware
  • Accessory Type ILM Kit
  • Product Type ILM/Backplate Kit
  • Backplate Material Steel
  • Top Support Plate Material Stainless Steel
  • Spring Plate Assembly Material Stainless Steel
  • Socket Type LGA 2011
  • Operating Temperature Range -25 – 100
  • Packaging Method Box & Tray
2201068-1 IC Socket Hardware
  • Accessory Type ILM Assembly
  • Product Type Accessory
  • Insulator Material Polycarbonate Film Plus Acrylic Adhesive Layer
  • Top Support Plate Material Stainless Steel
  • Spring Plate Assembly Material Stainless Steel
  • Socket Type LGA 2011
  • Operating Temperature Range -25 – 100
  • Packaging Method Box & Tray