2013311-3 SO DIMM Sockets
  • DRAM Type Double Data Rate (DDR) 3
  • Connector System Cable-to-Board
  • Profile Reverse
  • Row-to-Row Spacing 8.2
  • Sealable No
  • Connector & Contact Terminates To Printed Circuit Board
  • Product Type Socket
  • Module Orientation Right Angle
  • Number of Positions 204
  • Number of Rows 2
  • Keying Reverse
  • Number of Keys 1
  • Center Key Offset Right
  • Number of Bays 2
  • DRAM Voltage 1.5
  • SGRAM Voltage 1.5
  • Ejector Type Locking
  • Module Key Type SGRAM
  • Latch Plating Material Tin
  • Latch Material Stainless Steel
  • Ejector Location Both Ends
  • Solder Tail Contact Plating Material Gold
  • Contact Mating Area Plating Material Gold
  • Contact Mating Area Plating Thickness .76
  • Contact Current Rating (Max) .5
  • Contact Base Material Copper Alloy
  • Socket Type Memory Card
  • Socket Style SO DIMM
  • Insertion Style Cam-In
  • PCB Mounting Style Surface Mount
  • Connector Mounting Type Board Mount
  • PCB Mount Retention With
  • PCB Mount Retention Type Solder Peg
  • Centerline (Pitch) .6
  • Housing Material High Temperature Thermoplastic
  • Housing Color Black
  • Stack Height 9.2
  • Operating Temperature Range -55 – 85
  • Circuit Application Power
  • UL Flammability Rating UL 94V-0
  • Packaging Method Semi-Hard Tray Assembly
  • Packaging Quantity 20
  • Comment With floating peg.
2-2013022-1 SO DIMM Sockets
  • DRAM Type Double Data Rate (DDR) 3
  • Connector System Cable-to-Board
  • Profile Standard
  • Row-to-Row Spacing 8.2
  • Sealable No
  • Connector & Contact Terminates To Printed Circuit Board
  • Product Type Socket
  • Module Orientation Right Angle
  • Number of Positions 204
  • Number of Rows 2
  • Keying Standard
  • Number of Keys 1
  • Center Key Offset Left
  • Number of Bays 2
  • DRAM Voltage 1.5
  • SGRAM Voltage 1.5
  • Ejector Type Locking
  • Module Key Type SGRAM
  • Latch Plating Material Tin
  • Latch Material Stainless Steel
  • Ejector Location Both Ends
  • Solder Tail Contact Plating Material Gold Flash
  • Contact Mating Area Plating Material Gold Flash
  • Contact Current Rating (Max) .5
  • Contact Base Material Copper Alloy
  • Socket Type Memory Card
  • Socket Style SO DIMM
  • Insertion Style Cam-In
  • PCB Mounting Style Surface Mount
  • Connector Mounting Type Board Mount
  • PCB Mount Retention With
  • PCB Mount Retention Type Solder Tail (Pin)
  • Centerline (Pitch) .6
  • Housing Material High Temperature Thermoplastic
  • Housing Color Black
  • Stack Height 4
  • Operating Temperature Range -55 – 85
  • Circuit Application Power
  • UL Flammability Rating UL 94V-0
  • Packaging Method Emboss on Reel
  • Packaging Quantity 200
  • Comment Without floating peg.
2-2013289-1 SO DIMM Sockets
  • DRAM Type Double Data Rate (DDR) 3
  • Connector System Cable-to-Board
  • Profile Standard
  • Row-to-Row Spacing 8.2
  • Sealable No
  • Connector & Contact Terminates To Printed Circuit Board
  • Product Type Socket
  • Module Orientation Right Angle
  • Number of Positions 204
  • Number of Rows 2
  • Keying Standard
  • Number of Keys 1
  • Center Key Offset Left
  • Number of Bays 2
  • DRAM Voltage 1.5
  • SGRAM Voltage 1.5
  • Ejector Type Locking
  • Module Key Type SGRAM
  • Latch Plating Material Tin
  • Latch Material Stainless Steel
  • Ejector Location Both Ends
  • Solder Tail Contact Plating Material Gold
  • Contact Mating Area Plating Material Gold Flash
  • Contact Current Rating (Max) .5
  • Contact Base Material Copper Alloy
  • Socket Type Memory Card
  • Socket Style SO DIMM
  • Insertion Style Cam-In
  • PCB Mounting Style Surface Mount
  • Connector Mounting Type Board Mount
  • PCB Mount Retention With
  • PCB Mount Retention Type Solder Peg
  • Centerline (Pitch) .6
  • Housing Material High Temperature Thermoplastic
  • Housing Color Black
  • Stack Height 5.2
  • Operating Temperature Range -55 – 85
  • Circuit Application Power
  • UL Flammability Rating UL 94V-0
  • Packaging Method Emboss on Reel
  • Packaging Quantity 200
  • Comment With floating peg.
2013289-1 SO DIMM Sockets
  • DRAM Type Double Data Rate (DDR) 3
  • Connector System Cable-to-Board
  • Profile Standard
  • Row-to-Row Spacing 8.2
  • Sealable No
  • Connector & Contact Terminates To Printed Circuit Board
  • Product Type Socket
  • Module Orientation Right Angle
  • Number of Positions 204
  • Number of Rows 2
  • Keying Standard
  • Number of Keys 1
  • Center Key Offset Left
  • Number of Bays 2
  • DRAM Voltage 1.5
  • SGRAM Voltage 1.5
  • Ejector Type Locking
  • Module Key Type SGRAM
  • Latch Plating Material Tin
  • Latch Material Stainless Steel
  • Ejector Location Both Ends
  • Solder Tail Contact Plating Material Gold
  • Contact Mating Area Plating Material Gold Flash
  • Contact Current Rating (Max) .5
  • Contact Base Material Copper Alloy
  • Socket Type Memory Card
  • Socket Style SO DIMM
  • Insertion Style Cam-In
  • PCB Mounting Style Surface Mount
  • Connector Mounting Type Board Mount
  • PCB Mount Retention With
  • PCB Mount Retention Type Solder Peg
  • Centerline (Pitch) .6
  • Housing Material High Temperature Thermoplastic
  • Housing Color Black
  • Stack Height 5.2
  • Operating Temperature Range -55 – 85
  • Circuit Application Power
  • UL Flammability Rating UL 94V-0
  • Packaging Method Semi-Hard Tray Assembly
  • Packaging Quantity 20
  • Comment With floating peg.
2-2013310-2 SO DIMM Sockets
  • DRAM Type Double Data Rate (DDR) 3
  • Connector System Cable-to-Board
  • Profile Standard
  • Row-to-Row Spacing 8.2
  • Sealable No
  • Connector & Contact Terminates To Printed Circuit Board
  • Product Type Socket
  • Module Orientation Right Angle
  • Number of Positions 204
  • Number of Rows 2
  • Keying Standard
  • Number of Keys 1
  • Center Key Offset Left
  • Number of Bays 2
  • DRAM Voltage 1.5
  • SGRAM Voltage 1.5
  • Ejector Type Locking
  • Module Key Type SGRAM
  • Latch Plating Material Tin
  • Latch Material Stainless Steel
  • Ejector Location Both Ends
  • Solder Tail Contact Plating Material Gold
  • Contact Mating Area Plating Material Gold
  • Contact Mating Area Plating Thickness .254
  • Contact Current Rating (Max) .5
  • Contact Base Material Copper Alloy
  • Socket Type Memory Card
  • Socket Style SO DIMM
  • Insertion Style Cam-In
  • PCB Mounting Style Surface Mount
  • Connector Mounting Type Board Mount
  • PCB Mount Retention With
  • PCB Mount Retention Type Solder Peg
  • Centerline (Pitch) .6
  • Housing Material High Temperature Thermoplastic
  • Housing Color Black
  • Stack Height 9.2
  • Operating Temperature Range -55 – 85
  • Circuit Application Power
  • UL Flammability Rating UL 94V-0
  • Packaging Method Emboss on Reel
  • Packaging Quantity 150
  • Comment With floating peg.
2-2013289-3 SO DIMM Sockets
  • DRAM Type Double Data Rate (DDR) 3
  • Connector System Cable-to-Board
  • Profile Standard
  • Row-to-Row Spacing 8.2
  • Sealable No
  • Connector & Contact Terminates To Printed Circuit Board
  • Product Type Socket
  • Module Orientation Right Angle
  • Number of Positions 204
  • Number of Rows 2
  • Keying Standard
  • Number of Keys 1
  • Center Key Offset Left
  • Number of Bays 2
  • DRAM Voltage 1.5
  • SGRAM Voltage 1.5
  • Ejector Type Locking
  • Module Key Type SGRAM
  • Latch Plating Material Tin
  • Latch Material Stainless Steel
  • Ejector Location Both Ends
  • Solder Tail Contact Plating Material Gold
  • Contact Mating Area Plating Material Gold
  • Contact Mating Area Plating Thickness .76
  • Contact Current Rating (Max) .5
  • Contact Base Material Copper Alloy
  • Socket Type Memory Card
  • Socket Style SO DIMM
  • Insertion Style Cam-In
  • PCB Mounting Style Surface Mount
  • Connector Mounting Type Board Mount
  • PCB Mount Retention With
  • PCB Mount Retention Type Solder Peg
  • Centerline (Pitch) .6
  • Housing Material High Temperature Thermoplastic
  • Housing Color Black
  • Stack Height 5.2
  • Operating Temperature Range -55 – 85
  • Circuit Application Power
  • UL Flammability Rating UL 94V-0
  • Packaging Method Emboss on Reel
  • Packaging Quantity 200
  • Comment With floating peg.
2-2013290-1 SO DIMM Sockets
  • DRAM Type Double Data Rate (DDR) 3
  • Connector System Cable-to-Board
  • Profile Reverse
  • Row-to-Row Spacing 8.2
  • Sealable No
  • Connector & Contact Terminates To Printed Circuit Board
  • Product Type Socket
  • Module Orientation Right Angle
  • Number of Positions 204
  • Number of Rows 2
  • Keying Reverse
  • Number of Keys 1
  • Center Key Offset Right
  • Number of Bays 2
  • DRAM Voltage 1.5
  • SGRAM Voltage 1.5
  • Ejector Type Locking
  • Module Key Type SGRAM
  • Latch Plating Material Tin
  • Latch Material Stainless Steel
  • Ejector Location Both Ends
  • Solder Tail Contact Plating Material Gold
  • Contact Mating Area Plating Material Gold Flash
  • Contact Current Rating (Max) .5
  • Contact Base Material Copper Alloy
  • Socket Type Memory Card
  • Socket Style SO DIMM
  • Insertion Style Cam-In
  • PCB Mounting Style Surface Mount
  • Connector Mounting Type Board Mount
  • PCB Mount Retention With
  • PCB Mount Retention Type Solder Peg
  • Centerline (Pitch) .6
  • Housing Material High Temperature Thermoplastic
  • Housing Color Black
  • Stack Height 5.2
  • Operating Temperature Range -55 – 85
  • Circuit Application Power
  • UL Flammability Rating UL 94V-0
  • Packaging Method Emboss on Reel
  • Packaging Quantity 200
  • Comment With floating peg.
2-2013287-1 SO DIMM Sockets
  • DRAM Type Double Data Rate (DDR) 3
  • Connector System Cable-to-Board
  • Profile Reverse
  • Row-to-Row Spacing 8.2
  • Sealable No
  • Connector & Contact Terminates To Printed Circuit Board
  • Product Type Socket
  • Module Orientation Right Angle
  • Number of Positions 204
  • Number of Rows 2
  • Keying Reverse
  • Number of Keys 1
  • Center Key Offset Right
  • Number of Bays 2
  • DRAM Voltage 1.5
  • SGRAM Voltage 1.5
  • Ejector Type Locking
  • Module Key Type SGRAM
  • Latch Plating Material Tin
  • Latch Material Stainless Steel
  • Ejector Location Both Ends
  • Solder Tail Contact Plating Material Gold
  • Contact Mating Area Plating Material Gold Flash
  • Contact Current Rating (Max) .5
  • Contact Base Material Copper Alloy
  • Socket Type Memory Card
  • Socket Style SO DIMM
  • Insertion Style Cam-In
  • PCB Mounting Style Surface Mount
  • Connector Mounting Type Board Mount
  • PCB Mount Retention With
  • PCB Mount Retention Type Solder Tail (Pin)
  • Centerline (Pitch) .6
  • Housing Material High Temperature Thermoplastic
  • Housing Color Black
  • Stack Height 4
  • Operating Temperature Range -55 – 85
  • Circuit Application Power
  • UL Flammability Rating UL 94V-0
  • Packaging Method Emboss on Reel
  • Packaging Quantity 200
  • Comment Without floating peg.
2-2013290-2 SO DIMM Sockets
  • DRAM Type Double Data Rate (DDR) 3
  • Connector System Cable-to-Board
  • Profile Reverse
  • Row-to-Row Spacing 8.2
  • Sealable No
  • Connector & Contact Terminates To Printed Circuit Board
  • Product Type Socket
  • Module Orientation Right Angle
  • Number of Positions 204
  • Number of Rows 2
  • Keying Reverse
  • Number of Keys 1
  • Center Key Offset Right
  • Number of Bays 2
  • DRAM Voltage 1.5
  • SGRAM Voltage 1.5
  • Ejector Type Locking
  • Module Key Type SGRAM
  • Latch Plating Material Tin
  • Latch Material Stainless Steel
  • Ejector Location Both Ends
  • Solder Tail Contact Plating Material Gold
  • Contact Mating Area Plating Material Gold
  • Contact Mating Area Plating Thickness .254
  • Contact Current Rating (Max) .5
  • Contact Base Material Copper Alloy
  • Socket Type Memory Card
  • Socket Style SO DIMM
  • Insertion Style Cam-In
  • PCB Mounting Style Surface Mount
  • Connector Mounting Type Board Mount
  • PCB Mount Retention With
  • PCB Mount Retention Type Solder Peg
  • Centerline (Pitch) .6
  • Housing Material High Temperature Thermoplastic
  • Housing Color Black
  • Stack Height 5.2
  • Operating Temperature Range -55 – 85
  • Circuit Application Power
  • UL Flammability Rating UL 94V-0
  • Packaging Method Emboss on Reel
  • Packaging Quantity 200
  • Comment With floating peg.
2-2013289-2 SO DIMM Sockets
  • DRAM Type Double Data Rate (DDR) 3
  • Connector System Cable-to-Board
  • Profile Standard
  • Row-to-Row Spacing 8.2
  • Sealable No
  • Connector & Contact Terminates To Printed Circuit Board
  • Product Type Socket
  • Module Orientation Right Angle
  • Number of Positions 204
  • Number of Rows 2
  • Keying Standard
  • Number of Keys 1
  • Center Key Offset Left
  • Number of Bays 2
  • DRAM Voltage 1.5
  • SGRAM Voltage 1.5
  • Ejector Type Locking
  • Module Key Type SGRAM
  • Latch Plating Material Tin
  • Latch Material Stainless Steel
  • Ejector Location Both Ends
  • Solder Tail Contact Plating Material Gold
  • Contact Mating Area Plating Material Gold
  • Contact Mating Area Plating Thickness .254
  • Contact Current Rating (Max) .5
  • Contact Base Material Copper Alloy
  • Socket Type Memory Card
  • Socket Style SO DIMM
  • Insertion Style Cam-In
  • PCB Mounting Style Surface Mount
  • Connector Mounting Type Board Mount
  • PCB Mount Retention With
  • PCB Mount Retention Type Solder Peg
  • Centerline (Pitch) .6
  • Housing Material High Temperature Thermoplastic
  • Housing Color Black
  • Stack Height 5.2
  • Operating Temperature Range -55 – 85
  • Circuit Application Power
  • UL Flammability Rating UL 94V-0
  • Packaging Method Emboss on Reel
  • Packaging Quantity 200
  • Comment With floating peg.