1717254-1 SO DIMM Sockets
  • DRAM Type Double Data Rate (DDR)
  • Connector System Cable-to-Board
  • Profile Standard
  • Row-to-Row Spacing 6.2
  • Sealable No
  • Connector & Contact Terminates To Printed Circuit Board
  • Product Type Socket
  • Module Orientation Right Angle
  • Number of Positions 200
  • Number of Rows 2
  • Keying Standard
  • Number of Bays 2
  • Number of Keys 1
  • Center Key None
  • DRAM Voltage 2.5
  • SGRAM Voltage 2.5
  • Ejector Type Locking
  • Module Key Type SGRAM
  • Latch Plating Material Tin
  • Latch Material Stainless Steel
  • Ejector Location Both Ends
  • Solder Tail Contact Plating Material Gold Flash
  • Contact Mating Area Plating Material Gold Flash
  • Contact Current Rating (Max) .5
  • Contact Base Material Copper Alloy
  • Socket Type Memory Card
  • Socket Style SO DIMM
  • Insertion Style Cam-In
  • PCB Mounting Style Surface Mount
  • Connector Mounting Type Board Mount
  • PCB Mount Retention With
  • PCB Mount Retention Type Solder Peg
  • Centerline (Pitch) .6
  • Housing Color Black
  • Housing Material High Temperature Thermoplastic
  • Stack Height 5.2
  • Operating Temperature Range -55 – 85
  • Circuit Application Power
  • UL Flammability Rating UL 94V-0
  • Packaging Method Tape & Reel
  • Packaging Quantity 150
4-1932000-8 DIMM Sockets
  • DRAM Type Double Data Rate (DDR) 3
  • Connector System Board-to-Board
  • Row-to-Row Spacing 1.9
  • Sealable No
  • Connector & Contact Terminates To Printed Circuit Board
  • Product Type Socket
  • Number of Positions 240
  • Module Orientation Vertical
  • Ejector Type Standard
  • Contact Current Rating (Max) .75
  • PCB Mounting Style Through Hole
  • Connector Mounting Type Board Mount
  • Polarization Left
  • PCB Mount Retention Type Boardlocks
  • Centerline (Pitch) 1
  • Operating Temperature Range -55 – 155
  • Circuit Application Signal
  • Packaging Method Box & Tray
1-1932680-1 DIMM Sockets
  • DRAM Type Double Data Rate (DDR) 3
  • Connector System Board-to-Board
  • Row-to-Row Spacing 1.9
  • Sealable No
  • Connector & Contact Terminates To Printed Circuit Board
  • Center Post Without
  • Product Type Socket
  • Number of Positions 240
  • Module Orientation Vertical
  • Number of Bays 2
  • Number of Rows 2
  • Keying Standard
  • Number of Keys 1
  • Center Key Offset Left
  • DRAM Voltage 1.5
  • Ejector Type Rotary
  • Retention Post Location Both Ends
  • Latch Color Natural
  • Module Key Type Offset Left
  • Latch Material Thermoplastic
  • Ejector Location Both Ends
  • Ejector Material Thermoplastic
  • Retention Post Material Copper Alloy
  • Ejector Material Color Natural
  • Solder Tail Contact Plating Material Matte Tin
  • Contact Current Rating (Max) .5
  • Contact Base Material Copper Alloy
  • Socket Style DIMM
  • Solder Tail Contact Plating Thickness 2.54
  • Contact Mating Area Plating Thickness .76
  • Contact Mating Area Plating Material Gold
  • Socket Type Memory Card
  • Insertion Style Direct Insert
  • Termination Post Length 3.18
  • Locating Posts Without
  • PCB Mounting Style Through Hole
  • Connector Mounting Type Board Mount
  • Mounting Angle Vertical
  • PCB Mount Retention With
  • PCB Mount Retention Type Boardlocks
  • Boardlock Material Copper Alloy
  • Centerline (Pitch) 2
  • Housing Color Black
  • Housing Material High Temperature Nylon
  • Center Retention Hole Diameter 2.45
  • Height above PC Board 21
  • Operating Temperature Range -40 – 85
  • Circuit Application Signal
  • UL Flammability Rating UL 94V-0
  • Packaging Method Soft Tray
  • Packaging Quantity 54
1-1932000-0 DIMM Sockets
  • DRAM Type Double Data Rate (DDR) 3
  • Connector System Board-to-Board
  • Row-to-Row Spacing 1.9
  • Sealable No
  • Connector & Contact Terminates To Printed Circuit Board
  • Center Post With
  • Product Type Socket
  • Number of Positions 240
  • Module Orientation Vertical
  • Number of Bays 2
  • Number of Rows 2
  • Keying Standard
  • Number of Keys 1
  • Center Key Center
  • DRAM Voltage 1.5
  • Ejector Type Standard
  • Retention Post Location Center
  • Latch Color Natural
  • Module Key Type Offset Left
  • Latch Material Thermoplastic
  • Ejector Location Both Ends
  • Ejector Material High Temperature Nylon
  • Retention Post Material Brass
  • Ejector Material Color Natural
  • Solder Tail Contact Plating Material Matte Tin over Nickel
  • Contact Current Rating (Max) .75
  • Contact Base Material Copper Alloy
  • Socket Style DIMM
  • Solder Tail Contact Plating Thickness 3
  • Contact Mating Area Plating Thickness .38
  • Contact Mating Area Plating Material Gold
  • Socket Type Memory Card
  • Insertion Style Direct Insert
  • Termination Post Length 2.67
  • PCB Mounting Style Through Hole
  • Connector Mounting Type Board Mount
  • Mounting Angle Vertical
  • PCB Mount Retention With
  • PCB Mount Retention Type Retention Clip/Post
  • Boardlock Material Brass
  • Centerline (Pitch) 1
  • Housing Color Black
  • Housing Material High Temperature Nylon
  • Center Retention Hole Diameter 1.8
  • Height above PC Board 23.1
  • Operating Temperature Range -55 – 155
  • Circuit Application Signal
  • UL Flammability Rating UL 94V-0
  • Packaging Method Tray
  • Packaging Quantity 50
1-1932000-1 DIMM Sockets
  • DRAM Type Double Data Rate (DDR) 3
  • Connector System Board-to-Board
  • Row-to-Row Spacing 1.9
  • Sealable No
  • Connector & Contact Terminates To Printed Circuit Board
  • Center Post With
  • Product Type Socket
  • Number of Positions 240
  • Module Orientation Vertical
  • Number of Bays 2
  • Number of Rows 2
  • Keying Standard
  • Number of Keys 1
  • Center Key Center
  • DRAM Voltage 1.5
  • Ejector Type Standard
  • Retention Post Location Center
  • Latch Color Natural
  • Module Key Type Offset Left
  • Latch Material Thermoplastic
  • Ejector Location Both Ends
  • Ejector Material High Temperature Nylon
  • Retention Post Material Brass
  • Ejector Material Color Natural
  • Solder Tail Contact Plating Material Matte Tin over Nickel
  • Contact Current Rating (Max) .75
  • Contact Base Material Copper Alloy
  • Socket Style DIMM
  • Solder Tail Contact Plating Thickness 3
  • Contact Mating Area Plating Thickness .38
  • Contact Mating Area Plating Material Gold
  • Socket Type Memory Card
  • Insertion Style Direct Insert
  • Termination Post Length 3.18
  • PCB Mounting Style Through Hole
  • Connector Mounting Type Board Mount
  • Mounting Angle Vertical
  • PCB Mount Retention With
  • PCB Mount Retention Type Retention Clip/Post
  • Boardlock Material Brass
  • Centerline (Pitch) 1
  • Housing Color Black
  • Housing Material High Temperature Nylon
  • Center Retention Hole Diameter 1.8
  • Height above PC Board 23.1
  • Operating Temperature Range -55 – 155
  • Circuit Application Signal
  • UL Flammability Rating UL 94V-0
  • Packaging Method Tray
  • Packaging Quantity 50
1932000-1 DIMM Sockets
  • DRAM Type Double Data Rate (DDR) 3
  • Connector System Board-to-Board
  • Row-to-Row Spacing 1.9
  • Sealable No
  • Connector & Contact Terminates To Printed Circuit Board
  • Center Post With
  • Product Type Socket
  • Number of Positions 240
  • Module Orientation Vertical
  • Number of Bays 2
  • Number of Rows 2
  • Keying Standard
  • Number of Keys 1
  • Center Key Center
  • DRAM Voltage 1.5
  • Ejector Type Standard
  • Retention Post Location Center
  • Latch Color Natural
  • Module Key Type Offset Left
  • Latch Material Thermoplastic
  • Ejector Location Both Ends
  • Ejector Material High Temperature Nylon
  • Retention Post Material Brass
  • Ejector Material Color Natural
  • Solder Tail Contact Plating Material Matte Tin over Nickel
  • Contact Current Rating (Max) .75
  • Contact Base Material Copper Alloy
  • Socket Style DIMM
  • Solder Tail Contact Plating Thickness 3
  • Contact Mating Area Plating Thickness .08
  • Contact Mating Area Plating Material Gold Flash
  • Socket Type Memory Card
  • Insertion Style Direct Insert
  • Termination Post Length 2.67
  • PCB Mounting Style Through Hole
  • Connector Mounting Type Board Mount
  • Mounting Angle Vertical
  • PCB Mount Retention With
  • PCB Mount Retention Type Retention Clip/Post
  • Boardlock Material Brass
  • Centerline (Pitch) 1
  • Housing Color Natural
  • Housing Material High Temperature Nylon
  • Center Retention Hole Diameter 1.8
  • Height above PC Board 23.1
  • Operating Temperature Range -55 – 155
  • Circuit Application Signal
  • UL Flammability Rating UL 94V-0
  • Packaging Method Tray
  • Packaging Quantity 50
4-1932000-6 DIMM Sockets
  • DRAM Type Double Data Rate (DDR) 3
  • Connector System Board-to-Board
  • Row-to-Row Spacing 1.9
  • Sealable No
  • Connector & Contact Terminates To Printed Circuit Board
  • Product Type Socket
  • Number of Positions 240
  • Module Orientation Vertical
  • Ejector Type Standard
  • Contact Current Rating (Max) .75
  • PCB Mounting Style Through Hole
  • Connector Mounting Type Board Mount
  • Polarization Left
  • PCB Mount Retention Type Boardlocks
  • Centerline (Pitch) 1
  • Operating Temperature Range -55 – 155
  • Circuit Application Signal
  • Packaging Method Box & Tray
4-1932000-7 DIMM Sockets
  • DRAM Type Double Data Rate (DDR) 3
  • Connector System Board-to-Board
  • Row-to-Row Spacing 1.9
  • Sealable No
  • Connector & Contact Terminates To Printed Circuit Board
  • Product Type Socket
  • Number of Positions 240
  • Module Orientation Vertical
  • Ejector Type Standard
  • Contact Current Rating (Max) .75
  • PCB Mounting Style Through Hole
  • Connector Mounting Type Board Mount
  • Polarization Left
  • PCB Mount Retention Type Boardlocks
  • Centerline (Pitch) 1
  • Operating Temperature Range -55 – 155
  • Circuit Application Signal
  • Packaging Method Box & Tray
1932680-6 DIMM Sockets
  • DRAM Type Double Data Rate (DDR) 3
  • Connector System Board-to-Board
  • Row-to-Row Spacing 1.9
  • Sealable No
  • Connector & Contact Terminates To Printed Circuit Board
  • Center Post Without
  • Product Type Socket
  • Number of Positions 240
  • Module Orientation Vertical
  • Number of Bays 2
  • Number of Rows 2
  • Keying Standard
  • Number of Keys 1
  • Center Key Offset Left
  • DRAM Voltage 1.5
  • Ejector Type Rotary
  • Retention Post Location Both Ends
  • Latch Color Natural
  • Module Key Type Offset Left
  • Latch Material Thermoplastic
  • Ejector Location Both Ends
  • Ejector Material Thermoplastic
  • Retention Post Material Copper Alloy
  • Ejector Material Color Natural
  • Solder Tail Contact Plating Material Matte Tin
  • Contact Current Rating (Max) .5
  • Contact Base Material Copper Alloy
  • Socket Style DIMM
  • Solder Tail Contact Plating Thickness 2.54
  • Contact Mating Area Plating Thickness .38
  • Contact Mating Area Plating Material Gold
  • Socket Type Memory Card
  • Insertion Style Direct Insert
  • Termination Post Length 3.18
  • Locating Posts Without
  • PCB Mounting Style Through Hole
  • Connector Mounting Type Board Mount
  • Mounting Angle Vertical
  • PCB Mount Retention With
  • PCB Mount Retention Type Boardlocks
  • Boardlock Material Copper Alloy
  • Centerline (Pitch) 2
  • Housing Color Black
  • Housing Material High Temperature Nylon
  • Center Retention Hole Diameter 2.45
  • Height above PC Board 21
  • Operating Temperature Range -40 – 85
  • Circuit Application Signal
  • UL Flammability Rating UL 94V-0
  • Packaging Method Soft Tray
  • Packaging Quantity 54
1932680-8 DIMM Sockets
  • DRAM Type Double Data Rate (DDR) 3
  • Connector System Board-to-Board
  • Row-to-Row Spacing 1.9
  • Sealable No
  • Connector & Contact Terminates To Printed Circuit Board
  • Center Post Without
  • Product Type Socket
  • Number of Positions 240
  • Module Orientation Vertical
  • Number of Bays 2
  • Number of Rows 2
  • Keying Standard
  • Number of Keys 1
  • Center Key Offset Left
  • DRAM Voltage 1.5
  • Ejector Type Rotary
  • Retention Post Location Both Ends
  • Latch Color Natural
  • Module Key Type Offset Left
  • Latch Material Thermoplastic
  • Ejector Location Both Ends
  • Ejector Material Thermoplastic
  • Retention Post Material Copper Alloy
  • Ejector Material Color Natural
  • Solder Tail Contact Plating Material Matte Tin
  • Contact Current Rating (Max) .5
  • Contact Base Material Copper Alloy
  • Socket Style DIMM
  • Solder Tail Contact Plating Thickness 2.54
  • Contact Mating Area Plating Thickness .38
  • Contact Mating Area Plating Material Gold
  • Socket Type Memory Card
  • Insertion Style Direct Insert
  • Termination Post Length 3.18
  • Locating Posts Without
  • PCB Mounting Style Through Hole
  • Connector Mounting Type Board Mount
  • Mounting Angle Vertical
  • PCB Mount Retention With
  • PCB Mount Retention Type Boardlocks
  • Boardlock Material Copper Alloy
  • Centerline (Pitch) 2
  • Housing Color Blue
  • Housing Material High Temperature Nylon
  • Center Retention Hole Diameter 2.45
  • Height above PC Board 21
  • Operating Temperature Range -40 – 85
  • Circuit Application Signal
  • UL Flammability Rating UL 94V-0
  • Packaging Method Soft Tray
  • Packaging Quantity 54