1827341-4 SO DIMM Sockets
  • DRAM Type Double Data Rate (DDR) 2
  • Connector System Cable-to-Board
  • Profile Standard
  • Row-to-Row Spacing 6.2
  • Sealable No
  • Connector & Contact Terminates To Printed Circuit Board
  • Center Post Without
  • Product Type Socket
  • Module Orientation Right Angle
  • Number of Positions 200
  • Number of Rows 2
  • Keying Standard
  • Number of Keys 1
  • Center Key Offset Left
  • Number of Bays 2
  • DRAM Voltage 1.8
  • SGRAM Voltage 1.8
  • Ejector Type Locking
  • Module Key Type Offset Left
  • Retention Post Location Center
  • Ejector Location Both Ends
  • Contact Base Material Copper Alloy
  • PCB Contact Termination Area Plating Material Gold
  • Contact Underplating Material Nickel
  • Contact Mating Area Plating Material Gold
  • Contact Current Rating (Max) .5
  • Socket Type Memory Card
  • Socket Style SO DIMM
  • Insertion Style Cam-In
  • PCB Mount Retention Type Solder Tail (Pin)
  • PCB Mount Retention With
  • PCB Mounting Style Surface Mount
  • Connector Mounting Type Board Mount
  • Centerline (Pitch) .6
  • Housing Material LCP (Liquid Crystal Polymer)
  • Housing Color Black
  • Stack Height 8
  • Operating Temperature Range -55 – 85
  • Circuit Application Power
  • UL Flammability Rating UL 94V-0
  • Packaging Method Box & Tray
  • Packaging Quantity 20
1717468-3 SO DIMM Sockets
  • DRAM Type Double Data Rate (DDR)
  • Connector System Cable-to-Board
  • Profile Standard
  • Row-to-Row Spacing 6.2
  • Sealable No
  • Connector & Contact Terminates To Printed Circuit Board
  • Product Type Socket
  • Module Orientation Right Angle
  • Number of Positions 200
  • Number of Rows 2
  • Keying Standard
  • Number of Keys 1
  • Center Key None
  • Number of Bays 2
  • DRAM Voltage 2.5
  • SGRAM Voltage 2.5
  • Ejector Type Locking
  • Module Key Type SGRAM
  • Latch Material Stainless Steel
  • Ejector Location Both Ends
  • Contact Base Material Copper Alloy
  • PCB Contact Termination Area Plating Material Brass Alloy
  • Contact Mating Area Plating Material Gold Flash
  • Contact Current Rating (Max) .5
  • Socket Type Memory Card
  • Socket Style SO DIMM
  • Insertion Style Cam-In
  • PCB Mount Retention Type Solder Peg
  • PCB Mount Retention With
  • PCB Mounting Style Surface Mount
  • Connector Mounting Type Board Mount
  • Centerline (Pitch) .6
  • Housing Material High Temperature Thermoplastic
  • Housing Color Black
  • Stack Height 6.5
  • Operating Temperature Range -55 – 85
  • Circuit Application Power
  • UL Flammability Rating UL 94V-0
  • Packaging Method Semi-Hard Tray Assembly
  • Packaging Quantity 20
1717254-1 SO DIMM Sockets
  • DRAM Type Double Data Rate (DDR)
  • Connector System Cable-to-Board
  • Profile Standard
  • Row-to-Row Spacing 6.2
  • Sealable No
  • Connector & Contact Terminates To Printed Circuit Board
  • Product Type Socket
  • Module Orientation Right Angle
  • Number of Positions 200
  • Number of Rows 2
  • Keying Standard
  • Number of Keys 1
  • Center Key None
  • Number of Bays 2
  • DRAM Voltage 2.5
  • SGRAM Voltage 2.5
  • Ejector Type Locking
  • Module Key Type SGRAM
  • Latch Plating Material Tin
  • Latch Material Stainless Steel
  • Ejector Location Both Ends
  • Contact Base Material Copper Alloy
  • PCB Contact Termination Area Plating Material Brass Alloy
  • Contact Mating Area Plating Material Gold Flash
  • Contact Current Rating (Max) .5
  • Socket Type Memory Card
  • Socket Style SO DIMM
  • Insertion Style Cam-In
  • PCB Mount Retention Type Solder Peg
  • PCB Mount Retention With
  • PCB Mounting Style Surface Mount
  • Connector Mounting Type Board Mount
  • Centerline (Pitch) .6
  • Housing Material High Temperature Thermoplastic
  • Housing Color Black
  • Stack Height 5.2
  • Operating Temperature Range -55 – 85
  • Circuit Application Power
  • UL Flammability Rating UL 94V-0
  • Packaging Method Tape & Reel
  • Packaging Quantity 150
5-1612773-1 SO DIMM Sockets
  • DRAM Type Double Data Rate (DDR)
  • Connector System Cable-to-Board
  • Profile Standard
  • Row-to-Row Spacing 6.2
  • Sealable No
  • Connector & Contact Terminates To Printed Circuit Board
  • Product Type Socket
  • Module Orientation Right Angle
  • Number of Positions 200
  • Number of Rows 2
  • Keying Reverse
  • Number of Keys 1
  • Center Key None
  • Number of Bays 2
  • DRAM Voltage 2.5
  • SGRAM Voltage 2.5
  • Ejector Type Locking
  • Module Key Type SGRAM
  • Latch Plating Material Tin
  • Latch Material Stainless Steel
  • Ejector Location Both Ends
  • Contact Base Material Copper Alloy
  • PCB Contact Termination Area Plating Material Brass Alloy
  • Contact Mating Area Plating Material Gold Flash
  • Contact Current Rating (Max) .5
  • Socket Type Memory Card
  • Socket Style SO DIMM
  • Insertion Style Cam-In
  • PCB Mount Retention Type Solder Peg
  • PCB Mount Retention With
  • PCB Mounting Style Surface Mount
  • Connector Mounting Type Board Mount
  • Centerline (Pitch) .6
  • Housing Material High Temperature Thermoplastic
  • Housing Color Gray
  • Stack Height 6.5
  • Operating Temperature Range -55 – 85
  • Circuit Application Power
  • UL Flammability Rating UL 94V-0
  • Packaging Method Semi-Hard Tray Assembly
  • Packaging Quantity 20
1612618-1 SO DIMM Sockets
  • DRAM Type Double Data Rate (DDR)
  • Connector System Cable-to-Board
  • Profile Ultra High
  • Row-to-Row Spacing 6.2
  • Sealable No
  • Connector & Contact Terminates To Printed Circuit Board
  • Product Type Socket
  • Module Orientation Right Angle
  • Number of Positions 200
  • Number of Rows 2
  • Keying Standard
  • Number of Keys 1
  • Center Key None
  • Number of Bays 2
  • DRAM Voltage 2.5
  • SGRAM Voltage 2.5
  • Ejector Type Locking
  • Module Key Type SGRAM
  • Latch Plating Material Tin
  • Latch Material Stainless Steel
  • Ejector Location Both Ends
  • Contact Base Material Copper Alloy
  • PCB Contact Termination Area Plating Material Brass Alloy
  • Contact Mating Area Plating Material Gold Flash
  • Contact Current Rating (Max) .5
  • Socket Type Memory Card
  • Socket Style SO DIMM
  • Insertion Style Cam-In
  • PCB Mount Retention Type Solder Peg
  • PCB Mount Retention With
  • PCB Mounting Style Surface Mount
  • Connector Mounting Type Board Mount
  • Centerline (Pitch) .6
  • Housing Material High Temperature Thermoplastic
  • Housing Color Black
  • Stack Height 9.2
  • Operating Temperature Range -55 – 85
  • Circuit Application Power
  • UL Flammability Rating UL 94V-0
  • Packaging Method Semi-Hard Tray Assembly
  • Packaging Quantity 20
  • Comment Semi-Hard Tray with 20 sockets PN 1279284-1
1565691-1 SO DIMM Sockets
  • DRAM Type Double Data Rate (DDR)
  • Connector System Cable-to-Board
  • Profile Low
  • Row-to-Row Spacing 5.6
  • Sealable No
  • Connector & Contact Terminates To Printed Circuit Board
  • Product Type Socket
  • Module Orientation Right Angle
  • Number of Positions 200
  • Number of Rows 2
  • Keying Standard
  • Number of Keys 1
  • Center Key None
  • Number of Bays 2
  • DRAM Voltage 2.5
  • SGRAM Voltage 2.5
  • Ejector Type Locking
  • Module Key Type SGRAM
  • Latch Material Stainless Steel
  • Ejector Location Both Ends
  • Contact Base Material Copper Alloy
  • PCB Contact Termination Area Plating Material Brass Alloy
  • Contact Mating Area Plating Material Gold Flash
  • Contact Current Rating (Max) .5
  • Socket Type Memory Card
  • Socket Style SO DIMM
  • Insertion Style Cam-In
  • PCB Mount Retention Type Solder Peg
  • PCB Mount Retention With
  • PCB Mounting Style Surface Mount
  • Connector Mounting Type Board Mount
  • Centerline (Pitch) .6
  • Housing Material High Temperature Thermoplastic
  • Housing Color Black
  • Stack Height 4
  • Operating Temperature Range -55 – 85
  • Circuit Application Power
  • UL Flammability Rating UL 94V-0
  • Packaging Method Semi-Hard Tray Assembly
  • Packaging Quantity 20
1612507-3 SO DIMM Sockets
  • DRAM Type Double Data Rate (DDR)
  • Connector System Cable-to-Board
  • Profile Standard
  • Row-to-Row Spacing 6.2
  • Sealable No
  • Connector & Contact Terminates To Printed Circuit Board
  • Product Type Socket
  • Module Orientation Right Angle
  • Number of Positions 200
  • Number of Rows 2
  • Keying Standard
  • Number of Keys 1
  • Center Key None
  • Number of Bays 2
  • DRAM Voltage 2.5
  • SGRAM Voltage 2.5
  • Ejector Type Locking
  • Module Key Type SGRAM
  • Latch Plating Material Tin
  • Latch Material Stainless Steel
  • Ejector Location Both Ends
  • Retention Post Material Copper Alloy
  • Contact Base Material Copper Alloy
  • PCB Contact Termination Area Plating Material Brass Alloy
  • Contact Mating Area Plating Material Gold Flash
  • Contact Current Rating (Max) .5
  • Socket Type Memory Card
  • Socket Style SO DIMM
  • Insertion Style Cam-In
  • PCB Mount Retention Type Solder Tail (Pin)
  • PCB Mount Retention With
  • PCB Mounting Style Surface Mount
  • Connector Mounting Type Board Mount
  • Centerline (Pitch) .6
  • Housing Material High Temperature Thermoplastic
  • Housing Color Black
  • Stack Height 5.2
  • Operating Temperature Range -55 – 85
  • Circuit Application Power
  • UL Flammability Rating UL 94V-0
  • Packaging Method Hard Tray
  • Packaging Quantity 16
  • Comment Solder peg plating, tin.
1612559-1 SO DIMM Sockets
  • DRAM Type Double Data Rate (DDR)
  • Connector System Cable-to-Board
  • Profile Standard
  • Row-to-Row Spacing 5.6
  • Sealable No
  • Connector & Contact Terminates To Printed Circuit Board
  • Product Type Socket
  • Module Orientation Right Angle
  • Number of Positions 200
  • Number of Rows 2
  • Keying Standard
  • Number of Keys 1
  • Center Key None
  • Number of Bays 2
  • DRAM Voltage 2.5
  • SGRAM Voltage 2.5
  • Ejector Type Locking
  • Module Key Type SGRAM
  • Latch Material Stainless Steel
  • Ejector Location Both Ends
  • Contact Base Material Copper Alloy
  • PCB Contact Termination Area Plating Material Brass Alloy
  • Contact Mating Area Plating Material Gold Flash
  • Contact Current Rating (Max) .5
  • Socket Type Memory Card
  • Socket Style SO DIMM
  • Insertion Style Cam-In
  • PCB Mount Retention Type Solder Peg
  • PCB Mount Retention With
  • PCB Mounting Style Surface Mount
  • Connector Mounting Type Board Mount
  • Centerline (Pitch) .6
  • Housing Material High Temperature Thermoplastic
  • Stack Height 4
  • Operating Temperature Range -55 – 85
  • Circuit Application Power
  • UL Flammability Rating UL 94V-0
  • Packaging Method Reel
  • Packaging Quantity 200