1-2198325-9 SFP/SFP+/zSFP+
SFF-8083 SFF-8432
  • Form Factor zSFP+
  • Product Type Cage Assembly with Integrated Connector
  • Cage Type Stacked
  • Included Heat Sink No
  • Integrated Lightpipes Yes
  • Connector System Cable-to-Board
  • Sealable No
  • Connector & Contact Terminates To Printed Circuit Board
  • Port Matrix Configuration 2 x 2
  • Lightpipe Configuration Three
  • Lightpipe Style Standard
  • Number of Ports 4
  • Number of Positions 80
  • Data Rate (Max) 32
  • Contact Mating Area Plating Material Gold or Gold Flash over Palladium Nickel
  • Tail Plating Material Tin
  • Contact Mating Area Plating Thickness .76
  • Termination Method to Printed Circuit Board Through Hole - Press-Fit
  • PCB Mounting Style Through Hole Press-Fit
  • Connector Mounting Type Board Mount
  • Cage Material Nickel Silver Alloy
  • Centerline (Pitch) .8
  • Tail Length 1.8
  • PCB Thickness (Recommended) 1.5
  • Operating Temperature Range -55 – 105
  • Application SFP+ Thermally Enhanced
  • Circuit Application Signal
  • Heat Sink Compatible No
  • For Use With zSFP+ SMT Connector
  • UL Flammability Rating UL 94V-0
  • Packaging Method Tray
  • EMI Containment Feature Type External Springs
  • Included Lightpipe Yes
2227728-1 SFP/SFP+/zSFP+
SFF-8083 SFF-8432
  • Form Factor zSFP+
  • Product Type Cage Assembly
  • Cage Type Ganged
  • Included Heat Sink No
  • Connector System Cable-to-Board
  • Sealable No
  • Connector & Contact Terminates To Printed Circuit Board
  • Port Matrix Configuration 1 x 2
  • Number of Ports 2
  • Data Rate (Max) 32
  • Termination Method to Printed Circuit Board Through Hole - Press-Fit
  • PCB Mounting Style Through Hole Press-Fit
  • Connector Mounting Type Board Mount
  • Cage Material Nickel Silver Alloy
  • Tail Length 2.05
  • PCB Thickness (Recommended) 2.25
  • Operating Temperature Range -55 – 105
  • Circuit Application Signal
  • Heat Sink Compatible No
  • For Use With zSFP+ SMT Connector
  • Packaging Method Tray
  • EMI Containment Feature Type External Springs
  • Included Lightpipe No
2057630-1 CFP/CFP2/CFP4
CFP
  • Product Line CFP
  • Form Factor CFP
  • Product Type Connector
  • Connector System Board-to-Board
  • Sealable No
  • Connector & Contact Terminates To Printed Circuit Board
  • Port Matrix Configuration 1 x 1
  • Number of Positions 148
  • Data Rate (Max) 100
  • Plating Material Gold
  • Termination Method to Printed Circuit Board Surface Mount
  • PCB Mounting Style Double-Sided (Belly-to-Belly)
  • Connector Mounting Type Board Mount
  • Centerline (Pitch) .8
  • PCB Thickness (Recommended) 2
  • Operating Temperature Range -55 – 85
  • Circuit Application Signal
  • Packaging Method Reel
2057629-1 CFP/CFP2/CFP4
CFP
  • Product Line CFP
  • Form Factor CFP
  • Product Type Connector
  • Connector System Board-to-Board
  • Sealable No
  • Connector & Contact Terminates To Printed Circuit Board
  • Port Matrix Configuration 1 x 1
  • Number of Positions 148
  • Data Rate (Max) 100
  • Plating Material Gold
  • Termination Method to Printed Circuit Board Straddle Mount
  • PCB Mounting Style Straddle Mount
  • Connector Mounting Type Board Mount
  • Centerline (Pitch) .8
  • PCB Thickness (Recommended) 1.44
  • Operating Temperature Range -55 – 85
  • Circuit Application Signal
  • For Use With CFP Assembly
  • Packaging Method Box & Tray
1-2198318-7 SFP/SFP+/zSFP+  1
SFF-8083 SFF-8432
  • Form Factor zSFP+
  • Product Type Cage Assembly with Integrated Connector
  • Cage Type Stacked
  • Included Heat Sink No
  • Integrated Lightpipes Yes
  • Connector System Cable-to-Board
  • Sealable No
  • Connector & Contact Terminates To Printed Circuit Board
  • Port Matrix Configuration 2 x 1
  • Lightpipe Configuration Three
  • Lightpipe Style Standard
  • Number of Ports 2
  • Number of Positions 40
  • Data Rate (Max) 32
  • Contact Mating Area Plating Material Gold or Gold Flash over Palladium Nickel
  • Tail Plating Material Tin
  • Contact Mating Area Plating Thickness .76
  • Termination Method to Printed Circuit Board Through Hole - Press-Fit
  • PCB Mounting Style Through Hole Press-Fit
  • Connector Mounting Type Board Mount
  • Cage Material Nickel Silver Alloy
  • Centerline (Pitch) .8
  • Tail Length 1.8
  • PCB Thickness (Recommended) 1.5
  • Operating Temperature Range -55 – 105
  • Application zSFP+ Thermally Enhanced
  • Circuit Application Signal
  • Heat Sink Compatible No
  • For Use With zSFP+ SMT Connector
  • UL Flammability Rating UL 94V-0
  • Packaging Method Tray
  • EMI Containment Feature Type Elastomeric Gasket
  • Included Lightpipe Yes
2198720-1 SFP/SFP+/zSFP+
SFF-8083 SFF-8432
  • Form Factor zSFP+
  • Product Type Cage Assembly
  • Cage Type Ganged
  • Included Heat Sink No
  • Connector System Cable-to-Board
  • Sealable Yes
  • Connector & Contact Terminates To Printed Circuit Board
  • Port Matrix Configuration 1 x 2
  • Number of Ports 2
  • Data Rate (Max) 32
  • Termination Method to Printed Circuit Board Through Hole - Press-Fit
  • PCB Mounting Style Through Hole Press-Fit
  • Connector Mounting Type Board Mount
  • Cage Material Nickel Silver Alloy
  • Tail Length 2.05
  • PCB Thickness (Recommended) 3
  • Operating Temperature Range -55 – 105
  • Circuit Application Signal
  • Heat Sink Compatible No
  • For Use With zSFP+ SMT Connector
  • Packaging Method Tray
  • EMI Containment Feature Type Elastomeric Gasket
  • Included Lightpipe No
2198722-1 SFP/SFP+/zSFP+
SFF-8083 SFF-8432
  • Form Factor zSFP+
  • Product Type Cage Assembly
  • Cage Type Ganged
  • Included Heat Sink No
  • Connector System Cable-to-Board
  • Sealable Yes
  • Connector & Contact Terminates To Printed Circuit Board
  • Port Matrix Configuration 1 x 4
  • Number of Ports 4
  • Data Rate (Max) 32
  • Termination Method to Printed Circuit Board Through Hole - Press-Fit
  • PCB Mounting Style Through Hole Press-Fit
  • Connector Mounting Type Board Mount
  • Cage Material Nickel Silver Alloy
  • Tail Length 2.05
  • PCB Thickness (Recommended) 3
  • Operating Temperature Range -55 – 105
  • Circuit Application Signal
  • Heat Sink Compatible No
  • For Use With zSFP+ SMT Connector
  • Packaging Method Tray
  • EMI Containment Feature Type Elastomeric Gasket
  • Included Lightpipe No
2227730-1 SFP/SFP+/zSFP+
SFF-8083 SFF-8432
  • Form Factor zSFP+
  • Product Type Cage Assembly
  • Cage Type Ganged
  • Included Heat Sink No
  • Connector System Cable-to-Board
  • Sealable No
  • Connector & Contact Terminates To Printed Circuit Board
  • Port Matrix Configuration 1 x 4
  • Number of Ports 4
  • Data Rate (Max) 32
  • Termination Method to Printed Circuit Board Through Hole - Press-Fit
  • PCB Mounting Style Through Hole Press-Fit
  • Connector Mounting Type Board Mount
  • Tail Length 2.05
  • PCB Thickness (Recommended) 2.25
  • Operating Temperature Range -55 – 105
  • Circuit Application Signal
  • Heat Sink Compatible No
  • For Use With zSFP+ SMT Connector
  • Packaging Method Tray
  • EMI Containment Feature Type External Springs
  • Included Lightpipe No
1-2149730-0 SFP/SFP+/zSFP+
SFF-8075 SFF-8083 SFF-8431 SFF-8432
  • Form Factor SFP+
  • Product Type Cage Assembly
  • Cage Type Ganged
  • Included Heat Sink Yes
  • Connector System Cable-to-Board
  • Sealable No
  • Connector & Contact Terminates To Printed Circuit Board
  • Port Matrix Configuration 1 x 4
  • Number of Ports 4
  • Data Rate (Max) 16
  • Heat Sink Style Fin
  • Heat Sink Height Class Networking Tall
  • Heat Sink Height 13.5
  • Termination Method to Printed Circuit Board Through Hole - Press-Fit
  • PCB Mounting Style Through Hole Press-Fit
  • Connector Mounting Type Board Mount
  • Cage Material Nickel Silver
  • Tail Length 2.05
  • PCB Thickness (Recommended) 2.25
  • Operating Temperature Range -55 – 105
  • Application SFP+ Enhanced
  • Circuit Application Signal
  • Heat Sink Compatible Yes
  • For Use With SFP+ SMT Connector
  • UL Flammability Rating UL 94V-0
  • Packaging Method Box & Tray
  • EMI Containment Feature Type External Springs
  • Included Lightpipe No
  • Comment With insulating tape.
1-2180324-7 SFP/SFP+/zSFP+
SFF-8083 SFF-8432
  • Form Factor zSFP+
  • Product Type Cage Assembly with Integrated Connector
  • Cage Type Stacked
  • Included Heat Sink No
  • Integrated Lightpipes Yes
  • Connector System Cable-to-Board
  • Sealable No
  • Connector & Contact Terminates To Printed Circuit Board
  • Port Matrix Configuration 2 x 4
  • Lightpipe Configuration Three
  • Lightpipe Style Standard
  • Number of Ports 8
  • Number of Positions 160
  • Data Rate (Max) 32
  • Contact Mating Area Plating Material Gold or Gold Flash over Palladium Nickel
  • Tail Plating Material Tin
  • Contact Mating Area Plating Thickness .76
  • Termination Method to Printed Circuit Board Through Hole - Press-Fit
  • PCB Mounting Style Through Hole Press-Fit
  • Connector Mounting Type Board Mount
  • Cage Material Nickel Silver Alloy
  • Centerline (Pitch) .8
  • Tail Length 1.8
  • PCB Thickness (Recommended) 1.5
  • Operating Temperature Range -55 – 105
  • Application zSFP+ Thermally Enhanced
  • Circuit Application Signal
  • Heat Sink Compatible No
  • For Use With zSFP+ SMT Connector
  • UL Flammability Rating UL 94V-0
  • Packaging Method Tray
  • EMI Containment Feature Type Elastomeric Gasket
  • Included Lightpipe Yes
1-2180324-8 SFP/SFP+/zSFP+
SFF-8083 SFF-8432
  • Form Factor zSFP+
  • Product Type Cage Assembly with Integrated Connector
  • Cage Type Stacked
  • Included Heat Sink No
  • Integrated Lightpipes Yes
  • Connector System Cable-to-Board
  • Sealable No
  • Connector & Contact Terminates To Printed Circuit Board
  • Port Matrix Configuration 2 x 4
  • Lightpipe Configuration Reversed Outer
  • Lightpipe Style Standard
  • Number of Ports 8
  • Number of Positions 160
  • Data Rate (Max) 32
  • Contact Mating Area Plating Material Gold or Gold Flash over Palladium Nickel
  • Tail Plating Material Tin
  • Contact Mating Area Plating Thickness .76
  • Termination Method to Printed Circuit Board Through Hole - Press-Fit
  • PCB Mounting Style Through Hole Press-Fit
  • Connector Mounting Type Board Mount
  • Cage Material Nickel Silver Alloy
  • Centerline (Pitch) .8
  • Tail Length 1.8
  • PCB Thickness (Recommended) 1.5
  • Operating Temperature Range -55 – 105
  • Application zSFP+ Thermally Enhanced
  • Circuit Application Signal
  • Heat Sink Compatible No
  • For Use With zSFP+ SMT Connector
  • UL Flammability Rating UL 94V-0
  • Packaging Method Tray
  • EMI Containment Feature Type Elastomeric Gasket
  • Included Lightpipe Yes
1-2180324-9 SFP/SFP+/zSFP+
SFF-8083 SFF-8432
  • Form Factor zSFP+
  • Product Type Cage Assembly with Integrated Connector
  • Cage Type Stacked
  • Included Heat Sink No
  • Integrated Lightpipes Yes
  • Connector System Cable-to-Board
  • Sealable No
  • Connector & Contact Terminates To Printed Circuit Board
  • Port Matrix Configuration 2 x 4
  • Lightpipe Configuration Three
  • Lightpipe Style Standard
  • Number of Ports 8
  • Number of Positions 160
  • Data Rate (Max) 32
  • Contact Mating Area Plating Material Gold or Gold Flash over Palladium Nickel
  • Tail Plating Material Tin
  • Contact Mating Area Plating Thickness .76
  • Termination Method to Printed Circuit Board Through Hole - Press-Fit
  • PCB Mounting Style Through Hole Press-Fit
  • Connector Mounting Type Board Mount
  • Cage Material Nickel Silver Alloy
  • Centerline (Pitch) .8
  • Tail Length 1.8
  • PCB Thickness (Recommended) 1.5
  • Operating Temperature Range -55 – 105
  • Application zSFP+ Thermally Enhanced
  • Circuit Application Signal
  • Heat Sink Compatible No
  • For Use With zSFP+ SMT Connector
  • UL Flammability Rating UL 94V-0
  • Packaging Method Tray
  • EMI Containment Feature Type External Springs
  • Included Lightpipe Yes
1-2198318-8 SFP/SFP+/zSFP+  1
SFF-8083 SFF-8432
  • Form Factor zSFP+
  • Product Type Cage Assembly with Integrated Connector
  • Cage Type Stacked
  • Included Heat Sink No
  • Integrated Lightpipes Yes
  • Connector System Cable-to-Board
  • Sealable No
  • Connector & Contact Terminates To Printed Circuit Board
  • Port Matrix Configuration 2 x 1
  • Lightpipe Configuration Reversed Outer
  • Lightpipe Style Standard
  • Number of Ports 2
  • Number of Positions 40
  • Data Rate (Max) 32
  • Contact Mating Area Plating Material Gold or Gold Flash over Palladium Nickel
  • Tail Plating Material Tin
  • Contact Mating Area Plating Thickness .76
  • Termination Method to Printed Circuit Board Through Hole - Press-Fit
  • PCB Mounting Style Through Hole Press-Fit
  • Connector Mounting Type Board Mount
  • Cage Material Nickel Silver Alloy
  • Centerline (Pitch) .8
  • Tail Length 1.8
  • PCB Thickness (Recommended) 1.5
  • Operating Temperature Range -55 – 105
  • Application zSFP+ Thermally Enhanced
  • Circuit Application Signal
  • Heat Sink Compatible No
  • For Use With zSFP+ SMT Connector
  • UL Flammability Rating UL 94V-0
  • Packaging Method Tray
  • EMI Containment Feature Type Elastomeric Gasket
  • Included Lightpipe Yes
1-2198318-9 SFP/SFP+/zSFP+  1
SFF-8083 SFF-8432
  • Form Factor zSFP+
  • Product Type Cage Assembly with Integrated Connector
  • Cage Type Stacked
  • Included Heat Sink No
  • Integrated Lightpipes Yes
  • Connector System Cable-to-Board
  • Sealable No
  • Connector & Contact Terminates To Printed Circuit Board
  • Port Matrix Configuration 2 x 1
  • Lightpipe Configuration Three
  • Lightpipe Style Standard
  • Number of Ports 2
  • Number of Positions 40
  • Data Rate (Max) 32
  • Contact Mating Area Plating Material Gold or Gold Flash over Palladium Nickel
  • Tail Plating Material Tin
  • Contact Mating Area Plating Thickness .76
  • Termination Method to Printed Circuit Board Through Hole - Press-Fit
  • PCB Mounting Style Through Hole Press-Fit
  • Connector Mounting Type Board Mount
  • Cage Material Nickel Silver Alloy
  • Centerline (Pitch) .8
  • Tail Length 1.8
  • PCB Thickness (Recommended) 1.5
  • Operating Temperature Range -55 – 105
  • Application zSFP+ Thermally Enhanced
  • Circuit Application Signal
  • Heat Sink Compatible No
  • For Use With zSFP+ SMT Connector
  • UL Flammability Rating UL 94V-0
  • Packaging Method Tray
  • EMI Containment Feature Type External Springs
  • Included Lightpipe Yes
1-2198325-7 SFP/SFP+/zSFP+
SFF-8083 SFF-8432
  • Form Factor zSFP+
  • Product Type Cage Assembly with Integrated Connector
  • Cage Type Stacked
  • Included Heat Sink No
  • Integrated Lightpipes Yes
  • Connector System Cable-to-Board
  • Sealable No
  • Connector & Contact Terminates To Printed Circuit Board
  • Port Matrix Configuration 2 x 2
  • Lightpipe Configuration Three
  • Lightpipe Style Standard
  • Number of Ports 4
  • Number of Positions 80
  • Data Rate (Max) 32
  • Contact Mating Area Plating Material Gold or Gold Flash over Palladium Nickel
  • Tail Plating Material Tin
  • Contact Mating Area Plating Thickness .76
  • Termination Method to Printed Circuit Board Through Hole - Press-Fit
  • PCB Mounting Style Through Hole Press-Fit
  • Connector Mounting Type Board Mount
  • Cage Material Nickel Silver Alloy
  • Centerline (Pitch) .8
  • Tail Length 1.8
  • PCB Thickness (Recommended) 1.5
  • Operating Temperature Range -55 – 105
  • Application SFP+ Thermally Enhanced
  • Circuit Application Signal
  • Heat Sink Compatible No
  • For Use With zSFP+ SMT Connector
  • UL Flammability Rating UL 94V-0
  • Packaging Method Tray
  • EMI Containment Feature Type Elastomeric Gasket
  • Included Lightpipe Yes
1-2198325-8 SFP/SFP+/zSFP+
SFF-8083 SFF-8432
  • Form Factor zSFP+
  • Product Type Cage Assembly with Integrated Connector
  • Cage Type Stacked
  • Included Heat Sink No
  • Integrated Lightpipes Yes
  • Connector System Cable-to-Board
  • Sealable No
  • Connector & Contact Terminates To Printed Circuit Board
  • Port Matrix Configuration 2 x 2
  • Lightpipe Configuration Reversed Outer
  • Lightpipe Style Standard
  • Number of Ports 4
  • Number of Positions 80
  • Data Rate (Max) 32
  • Contact Mating Area Plating Material Gold or Gold Flash over Palladium Nickel
  • Tail Plating Material Tin
  • Contact Mating Area Plating Thickness .76
  • Termination Method to Printed Circuit Board Through Hole - Press-Fit
  • PCB Mounting Style Through Hole Press-Fit
  • Connector Mounting Type Board Mount
  • Cage Material Nickel Silver Alloy
  • Centerline (Pitch) .8
  • Tail Length 1.8
  • PCB Thickness (Recommended) 1.5
  • Operating Temperature Range -55 – 105
  • Application SFP+ Thermally Enhanced
  • Circuit Application Signal
  • Heat Sink Compatible No
  • For Use With zSFP+ SMT Connector
  • UL Flammability Rating UL 94V-0
  • Packaging Method Tray
  • EMI Containment Feature Type Elastomeric Gasket
  • Included Lightpipe Yes
1-2198339-7 SFP/SFP+/zSFP+
SFF-8083 SFF-8432
  • Form Factor zSFP+
  • Product Type Cage Assembly with Integrated Connector
  • Cage Type Stacked
  • Included Heat Sink No
  • Integrated Lightpipes Yes
  • Connector System Cable-to-Board
  • Sealable No
  • Connector & Contact Terminates To Printed Circuit Board
  • Port Matrix Configuration 2 x 6
  • Lightpipe Configuration Three
  • Lightpipe Style Standard
  • Number of Ports 12
  • Number of Positions 240
  • Data Rate (Max) 32
  • Contact Mating Area Plating Material Gold or Gold Flash over Palladium Nickel
  • Tail Plating Material Tin
  • Contact Mating Area Plating Thickness .76
  • Termination Method to Printed Circuit Board Through Hole - Press-Fit
  • PCB Mounting Style Through Hole Press-Fit
  • Connector Mounting Type Board Mount
  • Cage Material Nickel Silver Alloy
  • Centerline (Pitch) .8
  • Tail Length 1.8
  • PCB Thickness (Recommended) 1.5
  • Operating Temperature Range -55 – 105
  • Application zSFP+ Thermally Enhanced
  • Circuit Application Signal
  • Heat Sink Compatible No
  • For Use With zSFP+ SMT Connector
  • UL Flammability Rating UL 94V-0
  • Packaging Method Tray
  • EMI Containment Feature Type Elastomeric Gasket
  • Included Lightpipe Yes
1-2198339-8 SFP/SFP+/zSFP+
SFF-8083 SFF-8432
  • Form Factor zSFP+
  • Product Type Cage Assembly with Integrated Connector
  • Cage Type Stacked
  • Included Heat Sink No
  • Integrated Lightpipes Yes
  • Connector System Cable-to-Board
  • Sealable No
  • Connector & Contact Terminates To Printed Circuit Board
  • Port Matrix Configuration 2 x 6
  • Lightpipe Configuration Reversed Outer
  • Lightpipe Style Standard
  • Number of Ports 12
  • Number of Positions 240
  • Data Rate (Max) 32
  • Contact Mating Area Plating Material Gold or Gold Flash over Palladium Nickel
  • Tail Plating Material Tin
  • Contact Mating Area Plating Thickness .76
  • Termination Method to Printed Circuit Board Through Hole - Press-Fit
  • PCB Mounting Style Through Hole Press-Fit
  • Connector Mounting Type Board Mount
  • Cage Material Nickel Silver Alloy
  • Centerline (Pitch) .8
  • Tail Length 1.8
  • PCB Thickness (Recommended) 1.5
  • Operating Temperature Range -55 – 105
  • Application zSFP+ Thermally Enhanced
  • Circuit Application Signal
  • Heat Sink Compatible No
  • For Use With zSFP+ SMT Connector
  • UL Flammability Rating UL 94V-0
  • Packaging Method Tray
  • EMI Containment Feature Type Elastomeric Gasket
  • Included Lightpipe Yes
1-2198339-9 SFP/SFP+/zSFP+
SFF-8083 SFF-8432
  • Form Factor zSFP+
  • Product Type Cage Assembly with Integrated Connector
  • Cage Type Stacked
  • Included Heat Sink No
  • Integrated Lightpipes Yes
  • Connector System Cable-to-Board
  • Sealable No
  • Connector & Contact Terminates To Printed Circuit Board
  • Port Matrix Configuration 2 x 6
  • Lightpipe Configuration Three
  • Lightpipe Style Standard
  • Number of Ports 12
  • Number of Positions 240
  • Data Rate (Max) 32
  • Contact Mating Area Plating Material Gold or Gold Flash over Palladium Nickel
  • Tail Plating Material Tin
  • Contact Mating Area Plating Thickness .76
  • Termination Method to Printed Circuit Board Through Hole - Press-Fit
  • PCB Mounting Style Through Hole Press-Fit
  • Connector Mounting Type Board Mount
  • Cage Material Nickel Silver Alloy
  • Centerline (Pitch) .8
  • Tail Length 1.8
  • PCB Thickness (Recommended) 1.5
  • Operating Temperature Range -55 – 105
  • Application zSFP+ Thermally Enhanced
  • Circuit Application Signal
  • Heat Sink Compatible No
  • For Use With zSFP+ SMT Connector
  • UL Flammability Rating UL 94V-0
  • Packaging Method Tray
  • EMI Containment Feature Type External Springs
  • Included Lightpipe Yes
1-2198346-7 SFP/SFP+/zSFP+
SFF-8083 SFF-8432
  • Form Factor zSFP+
  • Product Type Cage Assembly with Integrated Connector
  • Cage Type Stacked
  • Included Heat Sink No
  • Integrated Lightpipes Yes
  • Connector System Cable-to-Board
  • Sealable Yes
  • Connector & Contact Terminates To Printed Circuit Board
  • Port Matrix Configuration 2 x 6
  • Lightpipe Configuration Three
  • Lightpipe Style Standard
  • Number of Ports 12
  • Number of Positions 320
  • Data Rate (Max) 32
  • Contact Mating Area Plating Material Gold or Gold Flash over Palladium Nickel
  • Tail Plating Material Tin
  • Contact Mating Area Plating Thickness .76
  • Termination Method to Printed Circuit Board Through Hole - Press-Fit
  • PCB Mounting Style Through Hole Press-Fit
  • Cage Material Nickel Silver Alloy
  • Centerline (Pitch) .8
  • Tail Length 1.8
  • PCB Thickness (Recommended) 1.5
  • Operating Temperature Range -55 – 105
  • Application zSFP+ Thermally Enhanced
  • Circuit Application Signal
  • Heat Sink Compatible No
  • For Use With zSFP+ SMT Connector
  • UL Flammability Rating UL 94V-0
  • Packaging Method Tray
  • EMI Containment Feature Type Elastomeric Gasket
  • Included Lightpipe Yes