149013-1 Board-to-Board Headers & Receptacles
  • Connector Assembly Type PCB Mount Header
  • Connector System Board-to-Board
  • Row-to-Row Spacing 2.54
  • Sealable No
  • Connector & Contact Terminates To Printed Circuit Board
  • Connector Type Connector Assembly
  • Product Type Connector
  • Stackable Yes
  • PCB Mount Orientation Vertical
  • Number of Positions 40
  • Board-to-Board Configuration Vertical
  • Number of Rows 2
  • Insulation Resistance 40
  • Voltage 30
  • Insulation Resistance 2
  • Busbar Mating Area Plating Thickness 30
  • Busbar Termination Area Plating Material Tin-Lead with Nickel underplated
  • Busbar Material Phosphor Bronze
  • Cover Material Phosphor Bronze
  • Busbar Mating Area Plating Material Gold
  • Contact Base Material Phosphor Bronze
  • PCB Contact Termination Area Plating Material Tin-Lead
  • Contact Mating Area Plating Material Gold
  • Contact Mating Area Plating Thickness .76
  • Contact Type Pin
  • Contact Current Rating (Max) 10.5
  • PCB Contact Termination Area Plating Thickness .63 – 1.91
  • Termination Method to Printed Circuit Board Through Hole - Press-Fit
  • Termination Post Length 3.69
  • PCB Mount Retention Type Action/Compliant Tail
  • Mating Alignment With
  • Mating Alignment Type Polarization
  • PCB Mount Retention With
  • PCB Mount Alignment With
  • Connector Mounting Type Board Mount
  • PCB Mount Alignment Type Locating Posts
  • Centerline (Pitch) 1.27
  • Housing Material High Temperature Thermoplastic
  • Stack Height 18.75
  • Height 16.46
  • Operating Temperature Range -65 – 125
  • Flame Retardant Yes
  • Pick and Place Cover Without
  • Circuit Application Signal
  • Packaging Method Tube
  • Packaging Quantity 19
149013-4 Board-to-Board Headers & Receptacles
  • Connector Assembly Type PCB Mount Header
  • Connector System Board-to-Board
  • Row-to-Row Spacing 2.54
  • Sealable No
  • Connector & Contact Terminates To Printed Circuit Board
  • Connector Type Connector Assembly
  • Product Type Connector
  • Stackable Yes
  • PCB Mount Orientation Vertical
  • Number of Positions 100
  • Board-to-Board Configuration Vertical
  • Number of Rows 2
  • Insulation Resistance 100
  • Voltage 30
  • Insulation Resistance 2
  • Busbar Mating Area Plating Thickness 30
  • Busbar Termination Area Plating Material Tin-Lead with Nickel underplated
  • Busbar Material Phosphor Bronze
  • Cover Material Phosphor Bronze
  • Busbar Mating Area Plating Material Gold
  • Contact Base Material Phosphor Bronze
  • PCB Contact Termination Area Plating Material Tin-Lead
  • Contact Mating Area Plating Material Gold
  • Contact Mating Area Plating Thickness .76
  • Contact Type Pin
  • Contact Current Rating (Max) 10.5
  • PCB Contact Termination Area Plating Thickness .63 – 1.91
  • Termination Method to Printed Circuit Board Through Hole - Press-Fit
  • Termination Post Length 3.69
  • PCB Mount Retention Type Action/Compliant Tail
  • Mating Alignment With
  • Mating Alignment Type Polarization
  • PCB Mount Retention With
  • PCB Mount Alignment With
  • Connector Mounting Type Board Mount
  • PCB Mount Alignment Type Locating Posts
  • Centerline (Pitch) 1.27
  • Housing Material High Temperature Thermoplastic
  • Stack Height 18.75
  • Height 16.46
  • Operating Temperature Range -65 – 125
  • Flame Retardant Yes
  • Pick and Place Cover Without
  • Circuit Application Signal
  • Packaging Method Tube
  • Packaging Quantity 8
149014-1 Board-to-Board Headers & Receptacles
  • Connector Assembly Type PCB Mount Header
  • Connector System Board-to-Board
  • Row-to-Row Spacing 2.54
  • Sealable No
  • Connector & Contact Terminates To Printed Circuit Board
  • Product Type Connector
  • Stackable Yes
  • Number of Positions 40
  • Board-to-Board Configuration Vertical
  • Number of Rows 2
  • Insulation Resistance 40
  • Voltage 30
  • Insulation Resistance 2
  • Busbar Mating Area Plating Thickness 30
  • Busbar Termination Area Plating Material Tin-Lead with Nickel underplated
  • Busbar Material Phosphor Bronze
  • Cover Material Phosphor Bronze
  • Busbar Mating Area Plating Material Gold
  • Contact Base Material Phosphor Bronze
  • PCB Contact Termination Area Plating Material Tin-Lead
  • Contact Mating Area Plating Material Gold
  • Contact Mating Area Plating Thickness .76
  • Contact Type Pin
  • Contact Current Rating (Max) 10.5
  • PCB Contact Termination Area Plating Thickness .63 – 1.91
  • Termination Method to Printed Circuit Board Through Hole - Press-Fit
  • Termination Post Length 4.83
  • PCB Mount Retention Type Action/Compliant Tail
  • Mating Alignment With
  • Mating Alignment Type Polarization
  • PCB Mount Retention With
  • PCB Mount Alignment With
  • Connector Mounting Type Board Mount
  • PCB Mount Alignment Type Locating Posts
  • Centerline (Pitch) 1.27
  • Housing Material High Temperature Thermoplastic
  • Stack Height 18.75
  • Height 16.46
  • Operating Temperature Range -65 – 125
  • Flame Retardant Yes
  • Pick and Place Cover Without
  • Circuit Application Signal
  • Packaging Method Tube
  • Packaging Quantity 19
5149013-1 Board-to-Board Headers & Receptacles
  • Connector Assembly Type PCB Mount Header
  • Connector System Board-to-Board
  • Row-to-Row Spacing 2.54
  • Sealable No
  • Connector & Contact Terminates To Printed Circuit Board
  • Connector Type Connector Assembly
  • Boss No
  • Product Type Connector
  • Stackable Yes
  • PCB Mount Orientation Vertical
  • Number of Positions 40
  • Board-to-Board Configuration Vertical
  • Number of Rows 2
  • Insulation Resistance 40
  • Voltage 30
  • Insulation Resistance 2
  • Busbar Mating Area Plating Thickness 30
  • Busbar Termination Area Plating Material Tin with Nickel Underplated
  • Busbar Material Phosphor Bronze
  • Cover Material Phosphor Bronze
  • Busbar Termination Area Plating Material Finish Matte
  • Busbar Mating Area Plating Material Gold
  • Contact Base Material Phosphor Bronze
  • PCB Contact Termination Area Plating Material Tin
  • Solder Tail Contact Plating Material Finish Matte
  • Contact Shape Square
  • Contact Mating Area Plating Material Gold
  • Contact Mating Area Plating Thickness .76
  • Contact Type Tab
  • Contact Current Rating (Max) 10.5
  • Contact Layout Staggered
  • PCB Contact Termination Area Plating Thickness 2.54 – 7.62
  • Termination Method to Printed Circuit Board Through Hole - Press-Fit
  • PCB Mount Retention Type Action/Compliant Tail
  • Mating Alignment With
  • Mating Alignment Type Guides
  • PCB Mount Retention With
  • PCB Mount Alignment With
  • Connector Mounting Type Board Mount
  • PCB Mount Alignment Type Post Polarization
  • Centerline (Pitch) 1.27
  • Housing Material Matte
  • Stack Height 18.75
  • Mating Post Length 4.83
  • Height 16.46
  • Operating Temperature Range -65 – 125
  • Flame Retardant Yes
  • Assembly Process Feature Board Standoff
  • Pick and Place Cover Without
  • Circuit Application Signal
  • For Use With Receptacle Assembly
  • Packaging Method Tube
  • Packaging Quantity 19
5149013-4 Board-to-Board Headers & Receptacles
  • Connector Assembly Type PCB Mount Header
  • Connector System Board-to-Board
  • Row-to-Row Spacing 2.54
  • Sealable No
  • Connector & Contact Terminates To Printed Circuit Board
  • Connector Type Connector Assembly
  • Boss No
  • Product Type Connector
  • Stackable Yes
  • PCB Mount Orientation Vertical
  • Number of Positions 100
  • Board-to-Board Configuration Vertical
  • Number of Rows 2
  • Insulation Resistance 100
  • Voltage 30
  • Insulation Resistance 2
  • Busbar Mating Area Plating Thickness 30
  • Busbar Termination Area Plating Material Tin with Nickel Underplated
  • Busbar Material Phosphor Bronze
  • Cover Material Phosphor Bronze
  • Busbar Termination Area Plating Material Finish Matte
  • Busbar Mating Area Plating Material Gold
  • Contact Base Material Phosphor Bronze
  • PCB Contact Termination Area Plating Material Tin
  • Solder Tail Contact Plating Material Finish Matte
  • Contact Shape Square
  • Contact Mating Area Plating Material Gold
  • Contact Mating Area Plating Thickness .76
  • Contact Type Tab
  • Contact Current Rating (Max) 10.5
  • Contact Layout Staggered
  • PCB Contact Termination Area Plating Thickness 2.54 – 7.62
  • Termination Method to Printed Circuit Board Through Hole - Press-Fit
  • PCB Mount Retention Type Action/Compliant Tail
  • Mating Alignment With
  • Mating Alignment Type Guides
  • PCB Mount Retention With
  • PCB Mount Alignment With
  • Connector Mounting Type Board Mount
  • PCB Mount Alignment Type Post Polarization
  • Centerline (Pitch) 1.27
  • Housing Material Matte
  • Stack Height 18.75
  • Mating Post Length 4.83
  • Height 16.46
  • Operating Temperature Range -65 – 125
  • Flame Retardant Yes
  • Assembly Process Feature Board Standoff
  • Pick and Place Cover Without
  • Circuit Application Signal
  • For Use With Receptacle Assembly
  • Packaging Method Tube
  • Packaging Quantity 8
5149013-6 Board-to-Board Headers & Receptacles
  • Connector Assembly Type PCB Mount Header
  • Connector System Board-to-Board
  • Row-to-Row Spacing 2.54
  • Sealable No
  • Connector & Contact Terminates To Printed Circuit Board
  • Connector Type Connector Assembly
  • Boss No
  • Product Type Connector
  • Stackable Yes
  • PCB Mount Orientation Vertical
  • Number of Positions 140
  • Board-to-Board Configuration Vertical
  • Number of Rows 2
  • Insulation Resistance 140
  • Voltage 30
  • Insulation Resistance 2
  • Busbar Mating Area Plating Thickness 30
  • Busbar Termination Area Plating Material Tin with Nickel Underplated
  • Busbar Material Phosphor Bronze
  • Cover Material Phosphor Bronze
  • Busbar Termination Area Plating Material Finish Matte
  • Busbar Mating Area Plating Material Gold
  • Contact Base Material Phosphor Bronze
  • PCB Contact Termination Area Plating Material Tin
  • Solder Tail Contact Plating Material Finish Matte
  • Contact Shape Square
  • Contact Mating Area Plating Material Gold
  • Contact Mating Area Plating Thickness .76
  • Contact Type Tab
  • Contact Current Rating (Max) 10.5
  • Contact Layout Staggered
  • PCB Contact Termination Area Plating Thickness 2.54 – 7.62
  • Termination Method to Printed Circuit Board Through Hole - Press-Fit
  • PCB Mount Retention Type Action/Compliant Tail
  • Mating Alignment With
  • Mating Alignment Type Guides
  • PCB Mount Retention With
  • PCB Mount Alignment With
  • Connector Mounting Type Board Mount
  • PCB Mount Alignment Type Post Polarization
  • Centerline (Pitch) 1.27
  • Housing Material Matte
  • Stack Height 18.75
  • Mating Post Length 4.83
  • Height 16.46
  • Operating Temperature Range -65 – 125
  • Flame Retardant Yes
  • Assembly Process Feature Board Standoff
  • Pick and Place Cover Without
  • Circuit Application Signal
  • For Use With Receptacle Assembly
  • Packaging Method Tube
  • Packaging Quantity 6
5149014-1 Board-to-Board Headers & Receptacles
  • Connector Assembly Type PCB Mount Header
  • Connector System Board-to-Board
  • Row-to-Row Spacing 2.54
  • Sealable No
  • Connector & Contact Terminates To Printed Circuit Board
  • Connector Type Connector Assembly
  • Boss No
  • Product Type Connector
  • Stackable Yes
  • PCB Mount Orientation Vertical
  • Number of Positions 40
  • Board-to-Board Configuration Vertical
  • Number of Rows 2
  • Insulation Resistance 40
  • Voltage 30
  • Insulation Resistance 2
  • Busbar Mating Area Plating Thickness 30
  • Busbar Termination Area Plating Material Tin with Nickel Underplated
  • Busbar Material Phosphor Bronze
  • Cover Material Phosphor Bronze
  • Busbar Termination Area Plating Material Finish Matte
  • Busbar Mating Area Plating Material Gold
  • Contact Base Material Phosphor Bronze
  • PCB Contact Termination Area Plating Material Tin
  • Solder Tail Contact Plating Material Finish Matte
  • Contact Shape Square
  • Contact Mating Area Plating Material Gold
  • Contact Mating Area Plating Thickness .76
  • Contact Type Tab
  • Contact Current Rating (Max) 10.5
  • Contact Mating Area Plating Material Finish Matte
  • Contact Layout Staggered
  • PCB Contact Termination Area Plating Thickness 2.54 – 7.62
  • Termination Method to Printed Circuit Board Through Hole - Press-Fit
  • PCB Mount Retention Type Action/Compliant Tail
  • Mating Alignment With
  • Mating Alignment Type Polarization
  • PCB Mount Retention With
  • PCB Mount Alignment With
  • Connector Mounting Type Board Mount
  • PCB Mount Alignment Type Post Polarization
  • Centerline (Pitch) 1.27
  • Housing Material Matte
  • Stack Height 18.75
  • Mating Post Length 4.83
  • Height 16.46
  • Tail Length .76
  • Operating Temperature Range -65 – 125
  • Flame Retardant Yes
  • Assembly Process Feature Board Standoff
  • Pick and Place Cover Without
  • Circuit Application Signal
  • For Use With Receptacle Assembly
  • Packaging Method Tube
  • Packaging Quantity 19
5149014-6 Board-to-Board Headers & Receptacles
  • Connector Assembly Type PCB Mount Header
  • Connector System Board-to-Board
  • Row-to-Row Spacing 2.54
  • Sealable No
  • Connector & Contact Terminates To Printed Circuit Board
  • Connector Type Connector Assembly
  • Boss No
  • Product Type Connector
  • Stackable Yes
  • PCB Mount Orientation Vertical
  • Number of Positions 140
  • Board-to-Board Configuration Vertical
  • Number of Rows 2
  • Insulation Resistance 140
  • Voltage 30
  • Insulation Resistance 2
  • Busbar Mating Area Plating Thickness 30
  • Busbar Termination Area Plating Material Tin with Nickel Underplated
  • Busbar Material Phosphor Bronze
  • Cover Material Phosphor Bronze
  • Busbar Termination Area Plating Material Finish Matte
  • Busbar Mating Area Plating Material Gold
  • Contact Base Material Phosphor Bronze
  • PCB Contact Termination Area Plating Material Tin
  • Solder Tail Contact Plating Material Finish Matte
  • Contact Shape Square
  • Contact Mating Area Plating Material Gold
  • Contact Mating Area Plating Thickness .76
  • Contact Type Tab
  • Contact Current Rating (Max) 10.5
  • Contact Mating Area Plating Material Finish Matte
  • Contact Layout Staggered
  • PCB Contact Termination Area Plating Thickness 2.54 – 7.62
  • Termination Method to Printed Circuit Board Through Hole - Press-Fit
  • PCB Mount Retention Type Action/Compliant Tail
  • Mating Alignment With
  • Mating Alignment Type Polarization
  • PCB Mount Retention With
  • PCB Mount Alignment With
  • Connector Mounting Type Board Mount
  • PCB Mount Alignment Type Post Polarization
  • Centerline (Pitch) 1.27
  • Housing Material Matte
  • Stack Height 18.75
  • Mating Post Length 4.83
  • Height 16.46
  • Tail Length .76
  • Operating Temperature Range -65 – 125
  • Flame Retardant Yes
  • Assembly Process Feature Board Standoff
  • Pick and Place Cover Without
  • Circuit Application Signal
  • For Use With Receptacle Assembly
  • Packaging Method Tube
  • Packaging Quantity 6