2-5353512-0 Board-to-Board Headers & Receptacles  1
  • Connector Style Receptacle
  • Connector System Board-to-Board
  • Sealable No
  • Connector & Contact Terminates To Printed Circuit Board
  • Series Fine Stack
  • PCB Mounting Orientation Vertical
  • Boss No
  • Product Type Connector
  • Stackable Yes
  • Number of Positions 20
  • Board-to-Board Configuration Mezzanine
  • Number of Rows 2
  • Dielectric Withstanding Voltage 500
  • Insulation Resistance 100
  • Voltage 250
  • Insulation Resistance 2
  • Busbar Mating Area Plating Thickness 500
  • Hold-Down Post Plating Thickness 250 – 250
  • PCB Termination Area Plating Material Gold
  • Contact Mating Area Plating Material Gold
  • Contact Mating Area Plating Thickness .2
  • Contact Current Rating (Max) .3
  • Solder Tail Contact Plating Thickness .05
  • Contact Base Material Copper Alloy
  • Contact Type Socket
  • Contact Layout Inline
  • Termination Method to PC Board Surface Mount
  • Mating Alignment With
  • Mating Alignment Type Keyed
  • PCB Mount Retention Without
  • PCB Mount Retention Type None
  • PCB Mount Alignment Without
  • PCB Mount Alignment Type None
  • Connector Mounting Type Board Mount
  • Centerline (Pitch) .5
  • Housing Material High heat-resisted resin
  • Stack Height 1.5
  • Operating Temperature Range -30 – 105
  • High Temperature Compatible Yes
  • Assembly Process Feature Pick and Place Cover
  • Pick and Place Cover With
  • Circuit Application Signal
  • For Use With Plug
  • UL Flammability Rating UL 94V-0
  • Packaging Method Tape & Reel
  • Packaging Quantity 1500
2-5353515-0 Board-to-Board Headers & Receptacles  1
  • Connector Style Tab
  • Connector System Board-to-Board
  • Sealable No
  • Connector & Contact Terminates To Printed Circuit Board
  • Series Fine Stack
  • PCB Mounting Orientation Vertical
  • Boss No
  • Product Type Connector
  • Stackable Yes
  • Number of Positions 20
  • Board-to-Board Configuration Mezzanine
  • Number of Rows 2
  • Dielectric Withstanding Voltage 500
  • Insulation Resistance 100
  • Voltage 250
  • Insulation Resistance 2
  • Busbar Mating Area Plating Thickness 500
  • Hold-Down Post Plating Thickness 250 – 250
  • PCB Termination Area Plating Material Gold
  • Contact Mating Area Plating Material Gold
  • Contact Mating Area Plating Thickness .2
  • Contact Current Rating (Max) .3
  • Solder Tail Contact Plating Thickness .05
  • Contact Base Material Copper Alloy
  • Contact Type Tab
  • Contact Layout Inline
  • Termination Method to PC Board Surface Mount
  • Mating Alignment With
  • Mating Alignment Type Keyed
  • PCB Mount Retention Without
  • PCB Mount Retention Type None
  • PCB Mount Alignment Without
  • PCB Mount Alignment Type None
  • Connector Mounting Type Board Mount
  • Centerline (Pitch) .5
  • Housing Material High heat-resisted resin
  • Stack Height 1.5
  • Operating Temperature Range -30 – 105
  • High Temperature Compatible Yes
  • Assembly Process Feature Pick and Place Cover
  • Pick and Place Cover With
  • Circuit Application Signal
  • For Use With Receptacle
  • UL Flammability Rating UL 94V-0
  • Packaging Method Tape & Reel
  • Packaging Quantity 1500
8-5353164-6 Board-to-Board Headers & Receptacles  1
  • Connector Style Plug
  • Connector System Board-to-Board
  • Sealable No
  • Connector & Contact Terminates To Printed Circuit Board
  • Series Fine Stack
  • PCB Mounting Orientation Vertical
  • Boss No
  • Product Type Connector
  • Stackable Yes
  • Number of Positions 80
  • Board-to-Board Configuration Mezzanine
  • Number of Rows 2
  • Dielectric Withstanding Voltage 500
  • Insulation Resistance 100
  • Voltage 250
  • Insulation Resistance 2
  • Busbar Mating Area Plating Thickness 500
  • Hold-Down Post Plating Thickness 250 – 250
  • PCB Termination Area Plating Material Gold
  • Contact Mating Area Plating Material Gold
  • Contact Mating Area Plating Thickness .76
  • Contact Current Rating (Max) .3
  • Solder Tail Contact Plating Thickness .05
  • Contact Base Material Copper Alloy
  • Contact Type Tab
  • Contact Layout Inline
  • Termination Method to PC Board Surface Mount
  • Mating Alignment Without
  • Mating Alignment Type Not polarized
  • PCB Mount Retention Without
  • PCB Mount Retention Type None
  • PCB Mount Alignment Without
  • PCB Mount Alignment Type None
  • Connector Mounting Type Board Mount
  • Centerline (Pitch) .5
  • Housing Material LCP (Liquid Crystal Polymer)
  • Stack Height 1.5
  • Operating Temperature Range -30 – 105
  • High Temperature Compatible Yes
  • Assembly Process Feature Pick and Place Cover
  • Pick and Place Cover With
  • Circuit Application Signal
  • For Use With Receptacle
  • UL Flammability Rating UL 94V-0
  • Packaging Method Tape & Reel
  • Packaging Quantity 1500
8-5353159-0 Board-to-Board Headers & Receptacles  1
  • Connector Style Receptacle
  • Connector System Board-to-Board
  • Sealable No
  • Connector & Contact Terminates To Printed Circuit Board
  • Series Fine Stack
  • PCB Mounting Orientation Vertical
  • Boss No
  • Product Type Connector
  • Stackable Yes
  • Number of Positions 80
  • Board-to-Board Configuration Mezzanine
  • Number of Rows 2
  • Dielectric Withstanding Voltage 500
  • Insulation Resistance 100
  • Voltage 250
  • Insulation Resistance 2
  • Busbar Mating Area Plating Thickness 500
  • Hold-Down Post Plating Thickness 250 – 250
  • PCB Termination Area Plating Material Gold
  • Contact Mating Area Plating Material Gold
  • Contact Mating Area Plating Thickness .2
  • Contact Current Rating (Max) .3
  • Solder Tail Contact Plating Thickness .05
  • Contact Base Material Copper Alloy
  • Contact Type Socket
  • Contact Layout Inline
  • Termination Method to PC Board Surface Mount
  • Mating Alignment With
  • Mating Alignment Type Polarized
  • PCB Mount Retention Without
  • PCB Mount Retention Type None
  • PCB Mount Alignment Without
  • PCB Mount Alignment Type None
  • Connector Mounting Type Board Mount
  • Centerline (Pitch) .5
  • Housing Material High heat-resisted resin
  • Stack Height 1.5
  • Operating Temperature Range -30 – 105
  • High Temperature Compatible Yes
  • Assembly Process Feature Pick and Place Cover
  • Pick and Place Cover With
  • Circuit Application Signal
  • For Use With Plug
  • UL Flammability Rating UL 94V-0
  • Packaging Method Tape & Reel
  • Packaging Quantity 1500
4-5353512-0 Board-to-Board Headers & Receptacles  1
  • Connector Style Receptacle
  • Connector System Board-to-Board
  • Sealable No
  • Connector & Contact Terminates To Printed Circuit Board
  • Series Fine Stack
  • PCB Mounting Orientation Vertical
  • Boss No
  • Product Type Connector
  • Stackable Yes
  • Number of Positions 40
  • Board-to-Board Configuration Mezzanine
  • Number of Rows 2
  • Dielectric Withstanding Voltage 500
  • Insulation Resistance 100
  • Voltage 250
  • Insulation Resistance 2
  • Busbar Mating Area Plating Thickness 500
  • Hold-Down Post Plating Thickness 250 – 250
  • PCB Termination Area Plating Material Gold
  • Contact Mating Area Plating Material Gold
  • Contact Mating Area Plating Thickness .2
  • Contact Current Rating (Max) .3
  • Solder Tail Contact Plating Thickness .05
  • Contact Base Material Copper Alloy
  • Contact Type Socket
  • Contact Layout Inline
  • Termination Method to PC Board Surface Mount
  • Mating Alignment With
  • Mating Alignment Type Keyed
  • PCB Mount Retention Without
  • PCB Mount Retention Type None
  • PCB Mount Alignment Without
  • PCB Mount Alignment Type None
  • Connector Mounting Type Board Mount
  • Centerline (Pitch) .5
  • Housing Material High heat-resisted resin
  • Stack Height 1.5
  • Operating Temperature Range -30 – 105
  • High Temperature Compatible Yes
  • Assembly Process Feature Pick and Place Cover
  • Pick and Place Cover With
  • Circuit Application Signal
  • For Use With Plug
  • UL Flammability Rating UL 94V-0
  • Packaging Method Tape & Reel
  • Packaging Quantity 1500
4-5353515-0 Board-to-Board Headers & Receptacles  1
  • Connector Style Plug
  • Connector System Board-to-Board
  • Sealable No
  • Connector & Contact Terminates To Printed Circuit Board
  • Series Fine Stack
  • PCB Mounting Orientation Vertical
  • Boss No
  • Product Type Connector
  • Stackable Yes
  • Number of Positions 40
  • Board-to-Board Configuration Mezzanine
  • Number of Rows 2
  • Dielectric Withstanding Voltage 500
  • Insulation Resistance 100
  • Voltage 250
  • Insulation Resistance 2
  • Busbar Mating Area Plating Thickness 500
  • Hold-Down Post Plating Thickness 250 – 250
  • PCB Termination Area Plating Material Gold
  • Contact Mating Area Plating Material Gold
  • Contact Mating Area Plating Thickness .2
  • Contact Current Rating (Max) .3
  • Solder Tail Contact Plating Thickness .05
  • Contact Base Material Copper Alloy
  • Contact Type Tab
  • Contact Layout Inline
  • Termination Method to PC Board Surface Mount
  • Mating Alignment With
  • Mating Alignment Type Keyed
  • PCB Mount Retention Without
  • PCB Mount Retention Type None
  • PCB Mount Alignment Without
  • PCB Mount Alignment Type None
  • Connector Mounting Type Board Mount
  • Centerline (Pitch) .5
  • Housing Material High heat-resisted resin
  • Stack Height 1.5
  • Operating Temperature Range -30 – 105
  • High Temperature Compatible Yes
  • Assembly Process Feature Pick and Place Cover
  • Pick and Place Cover With
  • Circuit Application Signal
  • For Use With Receptacle
  • UL Flammability Rating UL 94V-0
  • Packaging Method Tape & Reel
  • Packaging Quantity 1500
3-5353512-0 Board-to-Board Headers & Receptacles  1
  • Connector Style Receptacle
  • Connector System Board-to-Board
  • Sealable No
  • Connector & Contact Terminates To Printed Circuit Board
  • Series Fine Stack
  • PCB Mounting Orientation Vertical
  • Boss No
  • Product Type Connector
  • Stackable Yes
  • Number of Positions 30
  • Board-to-Board Configuration Mezzanine
  • Number of Rows 2
  • Dielectric Withstanding Voltage 500
  • Insulation Resistance 100
  • Voltage 250
  • Insulation Resistance 2
  • Busbar Mating Area Plating Thickness 500
  • Hold-Down Post Plating Thickness 250 – 250
  • PCB Termination Area Plating Material Gold
  • Contact Mating Area Plating Material Gold
  • Contact Mating Area Plating Thickness .2
  • Contact Current Rating (Max) .3
  • Solder Tail Contact Plating Thickness .05
  • Contact Base Material Copper Alloy
  • Contact Type Socket
  • Contact Layout Inline
  • Termination Method to PC Board Surface Mount
  • Mating Alignment With
  • Mating Alignment Type Keyed
  • PCB Mount Retention Without
  • PCB Mount Retention Type None
  • PCB Mount Alignment Without
  • PCB Mount Alignment Type None
  • Connector Mounting Type Board Mount
  • Centerline (Pitch) .5
  • Housing Material High heat-resisted resin
  • Stack Height 1.5
  • Operating Temperature Range -30 – 105
  • High Temperature Compatible Yes
  • Assembly Process Feature Pick and Place Cover
  • Pick and Place Cover With
  • Circuit Application Signal
  • For Use With Plug
  • UL Flammability Rating UL 94V-0
  • Packaging Method Tape & Reel
  • Packaging Quantity 1500
3-5353515-0 Board-to-Board Headers & Receptacles  1
  • Connector Style Plug
  • Connector System Board-to-Board
  • Sealable No
  • Connector & Contact Terminates To Printed Circuit Board
  • Series Fine Stack
  • PCB Mounting Orientation Vertical
  • Boss No
  • Product Type Connector
  • Stackable Yes
  • Number of Positions 30
  • Board-to-Board Configuration Mezzanine
  • Number of Rows 2
  • Dielectric Withstanding Voltage 500
  • Insulation Resistance 100
  • Voltage 250
  • Insulation Resistance 2
  • Busbar Mating Area Plating Thickness 500
  • Hold-Down Post Plating Thickness 250 – 250
  • PCB Termination Area Plating Material Gold
  • Contact Mating Area Plating Material Gold
  • Contact Mating Area Plating Thickness .2
  • Contact Current Rating (Max) .3
  • Solder Tail Contact Plating Thickness .05
  • Contact Base Material Copper Alloy
  • Contact Type Tab
  • Contact Layout Inline
  • Termination Method to PC Board Surface Mount
  • Mating Alignment With
  • Mating Alignment Type Keyed
  • PCB Mount Retention Without
  • PCB Mount Retention Type None
  • PCB Mount Alignment Without
  • PCB Mount Alignment Type None
  • Connector Mounting Type Board Mount
  • Centerline (Pitch) .5
  • Housing Material High heat-resisted resin
  • Stack Height 1.5
  • Operating Temperature Range -30 – 105
  • High Temperature Compatible Yes
  • Assembly Process Feature Pick and Place Cover
  • Pick and Place Cover With
  • Circuit Application Signal
  • For Use With Receptacle
  • UL Flammability Rating UL 94V-0
  • Packaging Method Tape & Reel
  • Packaging Quantity 1500
7-5353159-5 Board-to-Board Headers & Receptacles  1
  • Connector Style Receptacle
  • Connector System Board-to-Board
  • Sealable No
  • Connector & Contact Terminates To Printed Circuit Board
  • Series Fine Stack
  • PCB Mounting Orientation Vertical
  • Boss No
  • Product Type Connector
  • Stackable Yes
  • Number of Positions 70
  • Board-to-Board Configuration Mezzanine
  • Number of Rows 2
  • Dielectric Withstanding Voltage 500
  • Insulation Resistance 100
  • Voltage 250
  • Insulation Resistance 2
  • Busbar Mating Area Plating Thickness 500
  • Hold-Down Post Plating Thickness 250 – 250
  • PCB Termination Area Plating Material Gold
  • Contact Mating Area Plating Material Gold
  • Contact Mating Area Plating Thickness .76
  • Contact Current Rating (Max) .3
  • Solder Tail Contact Plating Thickness .05
  • Contact Base Material Copper Alloy
  • Contact Type Socket
  • Contact Layout Inline
  • Termination Method to PC Board Surface Mount
  • Mating Alignment With
  • Mating Alignment Type Polarized
  • PCB Mount Retention Without
  • PCB Mount Retention Type None
  • PCB Mount Alignment Without
  • PCB Mount Alignment Type None
  • Connector Mounting Type Board Mount
  • Centerline (Pitch) .5
  • Housing Material High heat-resisted resin
  • Stack Height 1.5
  • Operating Temperature Range -30 – 105
  • High Temperature Compatible Yes
  • Assembly Process Feature Pick and Place Cover
  • Pick and Place Cover With
  • Circuit Application Signal
  • For Use With Plug
  • UL Flammability Rating UL 94V-0
  • Packaging Method Tape & Reel
  • Packaging Quantity 1500
1-2199071-4 Board-to-Board Headers & Receptacles  1
  • Connector Style Plug
  • Connector System Board-to-Board
  • Sealable No
  • Connector & Contact Terminates To Printed Circuit Board
  • Number of Positions 14
  • Board-to-Board Configuration Mezzanine
  • Insulation Resistance 14
  • Mating Alignment Without
  • PCB Mount Retention Without
  • PCB Mount Alignment Without
  • Pick and Place Cover Without
  • Circuit Application Signal