3-1827253-6 Board-to-Board Headers & Receptacles
  • Connector Style Plug
  • Connector System Board-to-Board
  • Connector & Contact Terminates To Printed Circuit Board
  • Type COM Express
  • Row-to-Row Spacing 4.2
  • Series Free Height
  • Ground Component Type Grounding Contact
  • PCB Mounting Orientation Vertical
  • Boss Yes
  • Product Type Connector
  • Stackable Yes
  • Number of Positions 220
  • Board-to-Board Configuration Mezzanine
  • Number of Rows 2
  • Dielectric Withstanding Voltage 200
  • Insulation Resistance 220
  • Voltage 50
  • Insulation Resistance 2
  • Sealant No
  • Busbar Mating Area Plating Thickness 200
  • Hold-Down Post Plating Thickness 50 – 50
  • PCB Termination Area Plating Material Gold
  • Contact Shape Square
  • Contact Mating Area Plating Material Gold
  • Contact Mating Area Plating Thickness .2
  • Contact Current Rating (Max) .5
  • Solder Tail Contact Plating Thickness .05
  • Contact Layout Inline
  • Contact Base Material Copper Alloy
  • Contact Type Tab
  • Contact Plating Thickness .05 – .127
  • Termination Method to PC Board Surface Mount
  • Mating Alignment With
  • Mating Alignment Type Polarization
  • PCB Mount Retention With
  • PCB Mount Retention Type Solder Peg
  • PCB Mount Alignment With
  • PCB Mount Alignment Type Locating Posts
  • Centerline (Pitch) .5
  • Housing Material High Temperature Thermoplastic
  • Stack Height 5
  • Height 4.45
  • Mating Post Length 1
  • Operating Temperature Range -40 – 85
  • Assembly Process Feature None
  • Pick and Place Cover Without
  • Circuit Application Signal
  • For Use With Receptacle Assembly
  • UL Flammability Rating UL 94V-0
  • Packaging Method Hard Tray
  • Packaging Quantity 150
3-1827233-6 Board-to-Board Headers & Receptacles
  • Connector Style Plug
  • Connector System Board-to-Board
  • Connector & Contact Terminates To Printed Circuit Board
  • Type COM Express
  • Row-to-Row Spacing 4.2
  • Series Free Height
  • Ground Component Type Grounding Contact
  • PCB Mounting Orientation Vertical
  • Boss Yes
  • Product Type Connector
  • Stackable Yes
  • Number of Positions 440
  • Board-to-Board Configuration Mezzanine
  • Number of Rows 4
  • Post Entry Direction With
  • Dielectric Withstanding Voltage 200
  • Insulation Resistance 440
  • Voltage 50
  • Insulation Resistance 4
  • Sealant No
  • Busbar Mating Area Plating Thickness 200
  • Hold-Down Post Plating Thickness 50 – 50
  • PCB Termination Area Plating Material Tin
  • Contact Shape Square
  • Contact Mating Area Plating Material Gold
  • Contact Mating Area Plating Thickness .2
  • Contact Current Rating (Max) .5
  • Solder Tail Contact Plating Thickness 1
  • Contact Layout Matrix
  • Contact Base Material Copper Alloy
  • Contact Type Tab
  • Contact Plating Thickness .05 – .127
  • Termination Method to PC Board Surface Mount
  • Mating Alignment With
  • Mating Alignment Type Polarization
  • PCB Mount Retention With
  • PCB Mount Retention Type Solder Peg
  • PCB Mount Alignment With
  • PCB Mount Alignment Type Locating Posts
  • Centerline (Pitch) .5
  • Housing Material High Temperature Thermoplastic
  • Stack Height 5
  • Height 4.45
  • Mating Post Length 1
  • Operating Temperature Range -40 – 85
  • High Temperature Compatible Yes
  • Assembly Process Feature None
  • Pick and Place Cover With
  • Circuit Application Signal
  • For Use With Receptacle Assembly
  • UL Flammability Rating UL 94V-0
  • Packaging Method Hard Tray
  • Packaging Quantity 72
8-6318491-6 Board-to-Board Headers & Receptacles
  • Connector Style Plug
  • Connector System Board-to-Board
  • Connector & Contact Terminates To Printed Circuit Board
  • Type COM Express
  • Series Free Height
  • Ground Component Type Grounding Contact
  • PCB Mounting Orientation Vertical
  • Boss Yes
  • Product Type Connector
  • Stackable Yes
  • Number of Positions 220
  • Board-to-Board Configuration Mezzanine
  • Number of Rows 2
  • Dielectric Withstanding Voltage 200
  • Insulation Resistance 220
  • Voltage 50
  • Insulation Resistance 2
  • Sealant Yes
  • Busbar Mating Area Plating Thickness 200
  • Hold-Down Post Plating Thickness 50 – 50
  • PCB Termination Area Plating Material Tin
  • Contact Mating Area Plating Material Gold
  • Contact Mating Area Plating Thickness .2
  • Contact Current Rating (Max) .5
  • Solder Tail Contact Plating Thickness 1
  • Contact Layout Inline
  • Contact Base Material Copper Alloy
  • Contact Type Pin
  • Contact Plating Thickness 1
  • Termination Method to PC Board Surface Mount
  • Mating Alignment With
  • Mating Alignment Type Polarization
  • PCB Mount Retention With
  • PCB Mount Retention Type Solder Peg
  • PCB Mount Alignment With
  • PCB Mount Alignment Type Locating Posts
  • Centerline (Pitch) .5
  • Housing Material High Temperature Thermoplastic
  • Stack Height 8
  • Height 7.45
  • Mating Post Length 1
  • Operating Temperature Range -40 – 80
  • Pick and Place Cover Without
  • For Use With Receptacle Assembly
  • UL Flammability Rating UL 94V-0
  • Packaging Method Tray
  • Packaging Quantity 30
  • Comment This product was coated by flux-penetration-inhibiting agent.
9-1939756-6 Board-to-Board Headers & Receptacles
  • Connector Style Plug
  • Connector System Board-to-Board
  • Connector & Contact Terminates To Printed Circuit Board
  • Type COM Express
  • Row-to-Row Spacing 4.2
  • Series Free Height
  • Ground Component Type Grounding Contact
  • PCB Mounting Orientation Vertical
  • Boss Yes
  • Product Type Connector
  • Stackable Yes
  • Number of Positions 220
  • Board-to-Board Configuration Mezzanine
  • Number of Rows 2
  • Post Entry Direction With
  • Dielectric Withstanding Voltage 200
  • Insulation Resistance 220
  • Voltage 50
  • Insulation Resistance 2
  • Sealant No
  • Busbar Mating Area Plating Thickness 200
  • Hold-Down Post Plating Thickness 50 – 50
  • PCB Termination Area Plating Material Tin
  • Contact Shape Square
  • Contact Mating Area Plating Material Gold
  • Contact Mating Area Plating Thickness .76
  • Contact Current Rating (Max) .5
  • Solder Tail Contact Plating Thickness 1
  • Contact Layout Inline
  • Contact Base Material Copper Alloy
  • Contact Type Pin
  • Contact Plating Thickness 1
  • Termination Method to PC Board Surface Mount
  • Mating Alignment With
  • Mating Alignment Type Polarization
  • PCB Mount Retention With
  • PCB Mount Retention Type Solder Peg
  • PCB Mount Alignment With
  • PCB Mount Alignment Type Locating Posts
  • Centerline (Pitch) .5
  • Housing Material High Temperature Thermoplastic
  • Stack Height 8
  • Mating Post Length 1
  • Operating Temperature Range -40 – 85
  • Assembly Process Feature None
  • Pick and Place Cover With
  • For Use With Receptacle Assembly
  • UL Flammability Rating UL 94V-0
  • Packaging Method Hard Tray
  • Packaging Quantity 30
3-6318491-6 Board-to-Board Headers & Receptacles
  • Connector Style Plug
  • Connector System Board-to-Board
  • Connector & Contact Terminates To Printed Circuit Board
  • Type COM Express
  • Series Free Height
  • Ground Component Type Grounding Contact
  • PCB Mounting Orientation Vertical
  • Boss Yes
  • Product Type Connector
  • Stackable Yes
  • Number of Positions 220
  • Board-to-Board Configuration Mezzanine
  • Number of Rows 2
  • Dielectric Withstanding Voltage 200
  • Insulation Resistance 220
  • Voltage 50
  • Insulation Resistance 2
  • Sealant No
  • Busbar Mating Area Plating Thickness 200
  • Hold-Down Post Plating Thickness 50 – 50
  • PCB Termination Area Plating Material Tin
  • Contact Mating Area Plating Material Gold
  • Contact Mating Area Plating Thickness .2
  • Contact Current Rating (Max) .5
  • Solder Tail Contact Plating Thickness 1
  • Contact Layout Inline
  • Contact Base Material Copper Alloy
  • Contact Type Pin
  • Contact Plating Thickness 1
  • Termination Method to PC Board Surface Mount
  • Mating Alignment With
  • Mating Alignment Type Polarization
  • PCB Mount Retention With
  • PCB Mount Retention Type Solder Peg
  • PCB Mount Alignment With
  • PCB Mount Alignment Type Locating Posts
  • Centerline (Pitch) .5
  • Housing Material High Temperature Thermoplastic
  • Stack Height 8
  • Height 7.45
  • Mating Post Length 1
  • Operating Temperature Range -40 – 80
  • High Temperature Compatible Yes
  • Pick and Place Cover Without
  • Circuit Application Signal
  • For Use With Receptacle Assembly
  • UL Flammability Rating UL 94V-0
  • Packaging Method Hard Tray
  • Packaging Quantity 30
  • Comment This product was coated by flux-penetration-inhibiting agent.
3-1939756-6 Board-to-Board Headers & Receptacles
  • Connector Style Plug
  • Connector System Board-to-Board
  • Connector & Contact Terminates To Printed Circuit Board
  • Type COM Express
  • Row-to-Row Spacing 4.2
  • Series Free Height
  • Ground Component Type Grounding Contact
  • PCB Mounting Orientation Vertical
  • Boss Yes
  • Product Type Connector
  • Stackable Yes
  • Number of Positions 220
  • Board-to-Board Configuration Mezzanine
  • Number of Rows 2
  • Dielectric Withstanding Voltage 200
  • Insulation Resistance 220
  • Voltage 50
  • Insulation Resistance 2
  • Sealant No
  • Busbar Mating Area Plating Thickness 200
  • Hold-Down Post Plating Thickness 50 – 50
  • PCB Termination Area Plating Material Tin
  • Contact Shape Square
  • Contact Mating Area Plating Material Gold
  • Contact Mating Area Plating Thickness .76
  • Contact Current Rating (Max) .5
  • Solder Tail Contact Plating Thickness 1
  • Contact Layout Inline
  • Contact Base Material Copper Alloy
  • Contact Type Pin
  • Contact Plating Thickness 1
  • Termination Method to PC Board Surface Mount
  • Mating Alignment With
  • Mating Alignment Type Polarization
  • PCB Mount Retention With
  • PCB Mount Retention Type Solder Peg
  • PCB Mount Alignment With
  • PCB Mount Alignment Type Locating Posts
  • Centerline (Pitch) .5
  • Housing Material High Temperature Thermoplastic
  • Stack Height 8
  • Mating Post Length 1
  • Operating Temperature Range -40 – 85
  • Assembly Process Feature None
  • Pick and Place Cover Without
  • Circuit Application Signal
  • For Use With Receptacle Assembly
  • UL Flammability Rating UL 94V-0
  • Packaging Method Hard Tray
  • Packaging Quantity 30
9-6318491-6 Board-to-Board Headers & Receptacles
  • Connector Style Plug
  • Connector System Board-to-Board
  • Connector & Contact Terminates To Printed Circuit Board
  • Type COM Express
  • Series Free Height
  • Ground Component Type Grounding Contact
  • PCB Mounting Orientation Vertical
  • Boss Yes
  • Product Type Connector
  • Stackable Yes
  • Number of Positions 220
  • Board-to-Board Configuration Mezzanine
  • Number of Rows 2
  • Post Entry Direction With
  • Dielectric Withstanding Voltage 200
  • Insulation Resistance 220
  • Voltage 50
  • Insulation Resistance 2
  • Sealant No
  • Busbar Mating Area Plating Thickness 200
  • Hold-Down Post Plating Thickness 50 – 50
  • PCB Termination Area Plating Material Tin
  • Contact Mating Area Plating Material Gold
  • Contact Mating Area Plating Thickness .2
  • Contact Current Rating (Max) .5
  • Solder Tail Contact Plating Thickness 1
  • Contact Layout Inline
  • Contact Base Material Copper Alloy
  • Contact Type Pin
  • Contact Plating Thickness 1
  • Termination Method to PC Board Surface Mount
  • Mating Alignment With
  • Mating Alignment Type Polarization
  • PCB Mount Retention With
  • PCB Mount Retention Type Solder Peg
  • PCB Mount Alignment With
  • PCB Mount Alignment Type Locating Posts
  • Centerline (Pitch) .5
  • Housing Material High Temperature Thermoplastic
  • Stack Height 8
  • Height 7.45
  • Mating Post Length 1
  • Operating Temperature Range -40 – 80
  • Assembly Process Feature Vacuum Cover
  • Pick and Place Cover With
  • For Use With Receptacle Assembly
  • UL Flammability Rating UL 94V-0
  • Packaging Method Tray
  • Packaging Quantity 30
3-5353652-6 Board-to-Board Headers & Receptacles
  • Connector Style Plug
  • Connector System Board-to-Board
  • Connector & Contact Terminates To Printed Circuit Board
  • Type COM Express
  • Series Free Height
  • Ground Component Type Grounding Contact
  • PCB Mounting Orientation Vertical
  • Boss Yes
  • Product Type Connector
  • Stackable Yes
  • Number of Positions 440
  • Board-to-Board Configuration Mezzanine
  • Number of Rows 2
  • Post Entry Direction With
  • Dielectric Withstanding Voltage 200
  • Insulation Resistance 440
  • Voltage 50
  • Insulation Resistance 2
  • Sealant No
  • Busbar Mating Area Plating Thickness 200
  • Hold-Down Post Plating Thickness 50 – 50
  • PCB Termination Area Plating Material Tin
  • Contact Mating Area Plating Material Gold
  • Contact Mating Area Plating Thickness .2
  • Contact Current Rating (Max) .5
  • Solder Tail Contact Plating Thickness 1
  • Contact Layout Inline
  • Contact Base Material Copper Alloy
  • Contact Type Pin
  • Contact Plating Thickness 1
  • Termination Method to PC Board Surface Mount
  • Mating Alignment With
  • Mating Alignment Type Polarization
  • PCB Mount Retention With
  • PCB Mount Retention Type Solder Peg
  • PCB Mount Alignment With
  • PCB Mount Alignment Type Locating Posts
  • Centerline (Pitch) .5
  • Housing Material High Temperature Thermoplastic
  • Stack Height 8
  • Height 8
  • Mating Post Length 1
  • Operating Temperature Range -40 – 85
  • High Temperature Compatible Yes
  • Assembly Process Feature Vacuum Cover
  • Pick and Place Cover With
  • Circuit Application Signal
  • For Use With Receptacle
  • UL Flammability Rating UL 94V-0
  • Packaging Method Hard Tray
  • Packaging Quantity 18
3-1827231-6 Board-to-Board Headers & Receptacles
  • Connector Style Receptacle
  • Connector System Board-to-Board
  • Connector & Contact Terminates To Printed Circuit Board
  • Type COM Express
  • Row-to-Row Spacing 3.6
  • Series Free Height
  • Ground Component Type Grounding Contact
  • PCB Mounting Orientation Vertical
  • Boss Yes
  • Product Type Connector
  • Stackable Yes
  • Number of Positions 440
  • Board-to-Board Configuration Mezzanine
  • Number of Rows 4
  • Post Entry Direction With
  • Dielectric Withstanding Voltage 200
  • Insulation Resistance 440
  • Voltage 50
  • Insulation Resistance 4
  • Sealant No
  • Busbar Mating Area Plating Thickness 200
  • Hold-Down Post Plating Thickness 50 – 50
  • PCB Termination Area Plating Material Tin
  • Contact Mating Area Plating Material Gold
  • Contact Mating Area Plating Thickness .2
  • Contact Current Rating (Max) .5
  • Solder Tail Contact Plating Thickness 1
  • Contact Layout Matrix
  • Contact Base Material Copper Alloy
  • Contact Type Socket
  • Contact Plating Thickness .05 – .127
  • Termination Method to PC Board Surface Mount
  • Mating Alignment With
  • Mating Alignment Type Polarization
  • PCB Mount Retention With
  • PCB Mount Retention Type Solder Peg
  • PCB Mount Alignment With
  • PCB Mount Alignment Type Locating Posts
  • Centerline (Pitch) .5
  • Housing Material High Temperature Thermoplastic
  • Stack Height 4
  • Height 3.25
  • Mating Post Length 1
  • Operating Temperature Range -40 – 85
  • Assembly Process Feature None
  • Pick and Place Cover With
  • Circuit Application Signal
  • For Use With Plug Assembly
  • UL Flammability Rating UL 94V-0
  • Packaging Method Hard Tray
  • Packaging Quantity 90
3-6318490-6 Board-to-Board Headers & Receptacles
  • Connector Style Receptacle
  • Connector System Board-to-Board
  • Connector & Contact Terminates To Printed Circuit Board
  • Type COM Express
  • Series Free Height
  • Ground Component Type Grounding Contact
  • PCB Mounting Orientation Vertical
  • Boss Yes
  • Product Type Connector
  • Stackable No
  • Number of Positions 220
  • Board-to-Board Configuration Mezzanine
  • Number of Rows 2
  • Dielectric Withstanding Voltage 200
  • Insulation Resistance 220
  • Voltage 50
  • Insulation Resistance 2
  • Sealant No
  • Busbar Mating Area Plating Thickness 200
  • Hold-Down Post Plating Thickness 50 – 50
  • PCB Termination Area Plating Material Tin
  • Contact Mating Area Plating Material Gold
  • Contact Mating Area Plating Thickness .2
  • Contact Current Rating (Max) .5
  • Solder Tail Contact Plating Thickness 1
  • Contact Layout Inline
  • Contact Base Material Copper Alloy
  • Contact Type Socket
  • Contact Plating Thickness .05 – .127
  • Termination Method to PC Board Surface Mount
  • Mating Alignment With
  • Mating Alignment Type Polarization
  • PCB Mount Retention With
  • PCB Mount Retention Type Solder Peg
  • PCB Mount Alignment With
  • PCB Mount Alignment Type Locating Posts
  • Centerline (Pitch) .5
  • Housing Material High Temperature Thermoplastic
  • Stack Height 4
  • Height 4
  • Mating Post Length 1
  • Operating Temperature Range -40 – 80
  • High Temperature Compatible Yes
  • Pick and Place Cover Without
  • Circuit Application Signal
  • For Use With Plug
  • UL Flammability Rating UL 94V-0
  • Packaging Method Hard Tray
  • Packaging Quantity 210