Increase Power, Data and Bandwidth Speed Design with Open Architecture Solutions. Next-generation processors need next-generation connectivity to keep pace with the growing demand for bandwidth even as space, weight, and power savings become critical. TE Connectivity (TE) has been pushing the bandwidth envelope by adapting high-speed commercial technology and combining it with our expertise in rugged packaging. The results are board-level interconnects that give you more performance in harsh military and aerospace applications. We are also reducing size through higher contact densities and supporting RF and optical interconnects at the board level. And to allow compact, high-speed box-to-box connectivity, we have a full range of I/O connectors supporting rates to 10 Gb/s. We are meeting the demanding needs of battlespaces with ruggedized copper and fiber interconnect and cable assemblies. And we are helping to protect systems with lightweight shielding and EMI-immune datapaths. TE is focusing our technology to minimize size, weight and power consumption, to increase bandwidth, and to enable open architecture systems.
VITA 66: Optical Modules
The VITA 66 standard, for optics, gives you the choice of MT array connectors, ARINC 801 termini, or expanded beam (EB) contacts using a common module. With an aerospace pedigree, each style of termini offers different benefits in terms of density, ruggedness, reparability, and other characteristics.
VITA 67: RF Modules
VITA 67 RF modules from TE are modular systems designed specifically to allow backplane/daughtercard multi-contact mating within a robust platform to withstand the mechanical rigors of military and aerospace applications. They are also fully compatible with VPX packaging to make it easy and convenient to achieve RF connectivity within a well established architecture.
VITA 61: Mezalok
TE’s Mezalok connectors are rugged surface mount connectors featuring a quad redundant mini-box contact system having 500-mating-cycle durability. Engineered for high-speed reliability across the most adverse environments, the Mezalok connector enables 10+ Gb/s data rates coupled with a four-point redundant contact system based on the M55302 standard. The 114-position connectors are compliant with VITA 61 for XMC 2.0 applications.
VITA 62: MULTI-BEAM XLE Power Connectors
The MULTI-BEAM XLE power connector, specified for the VPX VITA 62 power supply standard, offers 50 A and 20 A contacts. The design is hot pluggable, features a vented housing for heat dissipation, tolerates mating misalignment, and has lower mating forces.
Fortis Zd Connectors
With high speeds and high reliability in demanding applications, the Fortis Zd connector family is designed to meet next-generation processing-intensive applications. The connectors support speeds of 12+ Gb/s in a design that saves weight and space.
Fortis LRM Connectors
The Fortis Zd LRM Connector System is an innovative modular connector system for rugged next-generation packaging, from avionics boxes to military ground vehicles. Optical and RF modules are based on VITA 66 and 67, featuring precision guide hardware and shell features that ensure reliable plug-in and excellent stability under extreme vibration.
VPX Compliant Solutions
As the latest standard architecture evolving from VMEbus, the VPX standard meets the
needs for data-intensive processing in the aerospace and defense industries, where both
ruggedness and high-speed performance are crucial. Supporting 6.25 Gb/s in a switched
fabric architecture, VPX systems are designed for flexible application of demanding highspeed protocols, such as 10G Ethernet, RapidIO, InfiniBand, and HyperTransport, in
ground, aerospace, and marine applications.
VPX systems are highly scalable and flexible, supporting both 3U and 6U formats to meet
the widest range of needs. The VPX backplane uses the TE 7-row MULTIGIG RT 2 connector
system to support both single-ended and differential signals.
As a widely used standard, VPX promotes interoperability, a healthy choice of suppliers,
and economies of scale that result from higher board volumes.
Not only does VPX accommodate new technologies, it has expanded beyond backplane/daughterboard signaling to embrace mezzanine application, power modules, and optical and RF connectivity—all with the goal of providing unmatched flexibility and capabilities for embedded computing.
High Speeds, Multimedia, Maximum Flexibility
TE’s portfolio of VPX systems gives you a complete array for high-speed data, optical, RF, power, and mezzanine connectivity. More choice means more flexibility in achieving
specific system architectures with standards based solutions. Get the high-speed signal
integrity advanced applications require in rugged, reliable connectors.
for Land, Sea, Air, and Space
• Avionics and Vetronics
• Communications Hubs and Processing
• Electronic Warfare and Countermeasure Management
• Two-Level Maintenance and ESD Sensitive Applications
• Mobile and Fixed Satellite Terminals and Ground Base Stations
• Power Supply and Distribution
• Radar Interface and Processing – RF and Digital
• Sensor Array Hubs and Data Processing
• Vehicle Mission Computers and Navigation
• Weapons Control and Targeting