January 29, 2016
DesignCon 2016 Technology Wrap-Up
DesignCon 2016 featured 33 interconnect manufacturers, all concentrating on ever-higher speeds and improved signal integrity. TE Connectivity introduced the new microQSFP module and cage in the latest effort to increase signal density on the I/O panel. A supporting MSA includes leading suppliers of networking and interconnect products.
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