Low Profile with Peak Performance: Built for Speed.
Our new, low profile, single-sided double-data-rate 3 (DDR3) small outline dual in-line memory module (SODIMM) connector delivers peak performance with high-speed data applications.
February 04, 2013
TE Connectivity (TE) announces a new low profile single sided DDR3 (Double-Data-Rate 3) SODIMM (Small Outline Dual In-line Memory Module) connector that delivers peak performance with high-speed data applications.
Designed to accept the new DDR3 single sided SODIMM, the connector ensures durable connectivity to optimize device functionality, speed and usability. It features a 35 percent reduction in height, as compared with similar low profile products, which in turn reduces the height of the end-product by 5 to 10 percent. It also reduces motherboard shadow areas by nearly 156 mm2, or 312 mm2 for common dual-socket implementation. The DDR3 SODIMM connector accepts modules that meet JEDEC MO268 industry standards and is offered in both standard and reverse types. This product's benefits include:
- Reduces connector height by 35 percent
- Reduces layout space by 6 percent
- Helps reduce device height by 5 to 10 percent
- Offers ultra low profile for new mobile computing form factors
of the low-profile DDR3 SODIMM
- 0.6 mm pitch
- 204 position
- Connector height: 2.6mm
- Single side of memory supported
- STD and RVS type offered
- Angled insertion
- Ultraportable and Notebook Devices
- Desktops and All-in-One PCs
TE Connectivity (NYSE: TEL) is a $12 billion global technology leader. Our connectivity and sensor solutions are essential in today’s increasingly connected world. We collaborate with engineers to transform their concepts into creations – redefining what’s possible using intelligent, efficient and high-performing TE products and solutions proven in harsh environments. Our 72,000 people, including over 7,000 engineers, partner with customers in close to 150 countries across a wide range of industries. We believe EVERY CONNECTION COUNTS.