Low Profile with Peak Performance: Built for Speed.
Our new, low profile, single-sided double-data-rate 3 (DDR3) small outline dual in-line memory module (SODIMM) connector delivers peak performance with high-speed data applications.
February 04, 2013
TE Connectivity (TE) announces a new low profile single sided DDR3 (Double-Data-Rate 3) SODIMM (Small Outline Dual In-line Memory Module) connector that delivers peak performance with high-speed data applications.
Designed to accept the new DDR3 single sided SODIMM, the connector ensures durable connectivity to optimize device functionality, speed and usability. It features a 35 percent reduction in height, as compared with similar low profile products, which in turn reduces the height of the end-product by 5 to 10 percent. It also reduces motherboard shadow areas by nearly 156 mm2, or 312 mm2 for common dual-socket implementation. The DDR3 SODIMM connector accepts modules that meet JEDEC MO268 industry standards and is offered in both standard and reverse types. This product's benefits include:
- Reduces connector height by 35 percent
- Reduces layout space by 6 percent
- Helps reduce device height by 5 to 10 percent
- Offers ultra low profile for new mobile computing form factors
of the low-profile DDR3 SODIMM
- 0.6 mm pitch
- 204 position
- Connector height: 2.6mm
- Single side of memory supported
- STD and RVS type offered
- Angled insertion
- Ultraportable and Notebook Devices
- Desktops and All-in-One PCs
TE Connectivity (NYSE: TEL) is a $12 billion global technology leader. Our commitment to innovation enables advancements in transportation, industrial applications, medical technology, energy, data communications, and the home. TE’s unmatched breadth of connectivity and sensor solutions, proven in the harshest of environments, helps build a safer, greener, smarter and more connected world. With 75,000 people – including more than 7,000 engineers – working alongside customers in nearly 150 countries, we help ensure that EVERY CONNECTION COUNTS – www.TE.com