Paris-air-show

Industry Tradeshow

Dubai Air Show 2017

Enabling the Next Generation Connected Aircraft
Interconnect Solutions for Military and Commercial Aerospace

November 12-16, 2017

DWC, DUBAI AIRSHOW SITE

United Arab Emirates

US pavilion - Booth #1478

Designing the Connected Aircraft for Smarter, Faster Connectivity. Today’s aircraft are more connected than ever before to make flight more efficient and safe. Pilots and ground crews require more information at faster speeds to manage increasingly complex aircraft systems. To meet these demands, TE Connectivity (TE) has developed technologies that provide reliable performance in harsh environments to make modern air travel faster, more efficient and enjoyable.

Work with TE to solve tough connectivity and packaging configurations challenges. By partnering with your design team early in the design review process, together we'll align the full power of TE subject matter expertise to your project goals. Take advantage of our broad, cross-industry knowledge and innovation.

  1. MiniMRP Avionics Packaging

MiniMRP Avionics is the next generation of integrated circuits, putting ever-increasing computing power into 40% smaller packages at lower costs.

Paris-air-show

Industry Tradeshow

Dubai Air Show 2017

Enabling the Next Generation Connected Aircraft
Interconnect Solutions for Military and Commercial Aerospace

November 12-16, 2017

DWC, DUBAI AIRSHOW SITE

United Arab Emirates

US pavilion - Booth #1478

Designing the Connected Aircraft for Smarter, Faster Connectivity. Today’s aircraft are more connected than ever before to make flight more efficient and safe. Pilots and ground crews require more information at faster speeds to manage increasingly complex aircraft systems. To meet these demands, TE Connectivity (TE) has developed technologies that provide reliable performance in harsh environments to make modern air travel faster, more efficient and enjoyable.

Work with TE to solve tough connectivity and packaging configurations challenges. By partnering with your design team early in the design review process, together we'll align the full power of TE subject matter expertise to your project goals. Take advantage of our broad, cross-industry knowledge and innovation.

  1. MiniMRP Avionics Packaging

MiniMRP Avionics is the next generation of integrated circuits, putting ever-increasing computing power into 40% smaller packages at lower costs.