Beyond Connected. TE Innovations at DesignCon 2016.

Industry Tradeshow

DesignCon 2016 Expo

January 20-21, 2016

Santa Clara Convention Center
Santa Clara, CA

Booth 811

TE understands the unique challenges technology designers face when trying to keep up with the rapid changes in the marketplace. TE’s portfolio of advanced, reliable connectors and other components offer solutions for speed, density, power and connectivity and are driving the next generation of data center applications. See below for links to videos of our demonstrations highlighting performance and next-generation solutions for data centers and the latest products delivering the speed, scalability, space-savings, reduced thermals, power and reach that you need for your next project.

Featured Products and Demos

  • The new microQSFP high-speed I/O solutions with demonstrations on thermal performance, RU faceplate density and data throughput capabilities.
  • The advanced family of STRADA Whisper high speed backplane connectors, with an expanded range of configurations including direct plug orthogonal, mezzanine, and cables all delivering at 56Gbps and beyond.
  • New Sliver Internal Interconnect Cabled Connectors that enable extended reach at 25Gbps for on-board or embedded applications.