Discover Tyco Electronics latest solutions for high performance computing (HPC) at Super Computing 2010.
November 15-18, 2010
Ernest N. Morial Convention Center
New Orleans, LA
TE has a broad portfolio of backplane interconnects to address your board-to-board design needs.
Our I/O products provide the bandwidth and port density for today’s data center and telecom requirements.
From board-to-board power modules to high-voltage energy applications, our power product families may help you solve your power interconnection challenges.
TE' mezzanine (stacking) connector families offer a broad range of options to meet height, density, power and data rate requirements.
TE has a broad range of products that meet the latest high speed cable standards.
We offer a wide array of optical cable products including active cables, modules and chip-to-chip assemblies.
Our cables are designed for all levels of computing and mass storage.