TE Connectivity has injection moulding equipment that can provide over-moulding of a variety of materials onto cable assemblies and other applications such as printed circuit boards. Our molding presses have “shot weights” ranging from between 10g and 300g to provide the optimum over-moulding performance, giving us the ability to satisfy most customer requirements.
The over-moulding process allows for the moulding of a custom designed grommet or strain relief onto a cable assembly to allow for fitting to the product case or housing. Other assemblies may require a moulded back shell and combined strain relief which can be moulded over any number of common or irregular shaped connections. Branch out points in a wiring harness may also be over-moulded to give mechanical strength and a seal against moisture and other contaminants.
For the majority of products, over-molding would satisfy all the mechanical and sealing requirements, plus it has the added advantage of providing an aesthetically pleasing finish. The TE Connectivity Christchurch team has developed considerable expertise in moulding military grade compounds over printed circuit board components to encapsulate and environmentally seal them from moisture and dirt whilst offering a degree of protection from other hazards.
At the design phase of a new wire harness or cable assembly, the use of over-moulding can be designed in. There are a number of moulding compounds available and the specifications of these can be determined at the time of design to select the most suitable for the customer’s particular product and the product’s end application. A client’s company logo and other information can be moulded onto the product.
We are able to accept drawings in most engineering formats, including DWG, DXF, IGES, STEP and DWF. For those customers who do not have drawings our design team can create them for you.