Z-PACK TinMan Backplane Interconnects

A Mighty Performer at Every Step

To increase system performance within the interconnection channel, we redesigned a proven performer, the Z-PACK TinMan connector, to reduce the system characteristic impedance from 100 ohm to 85 ohm.

A reduction of impedance from 100 ohm to 85 ohm can improve overall system performance. It does so by incorporating thinner PC boards, increasing density with same board thickness, and making it easier to match the system impedance to the connector footprint impedance.The suite of Z-PACK TinMan 85 ohm connectors provides similar industry-leading performance, features, and benefits designed into the standard 100 ohm Z-PACK TinMan connector system, but in an 85 ohm impedance package. This connector was designed to provide 85 ohm nominal characteristic impedance through the entire connector, from PCB footprint to PCB footprint.  

A Complete Interconnect Solution with Design Options

As part of the complete Z-PACK TinMan connector product portfolio, the 85 ohm version offers protected right-angle and vertical receptacles for use on daughter-cards and mezzanine boards where handling damage can be a concern when plugging to a mating header. Ground contacts strategically positioned within each column of the connector, combined with unique contact lead frame arrangements, enable the Z-PACK TinMan 85 ohm connector to achieve low crosstalk and high throughput performance levels. A dual point of contact mating interface and compliant pin interface to the printed circuit board help provide reliability. 

12.5

Data rates up to 12.5 Gbps

85

Impedance reduction to 85 ohm for improved performance

DENSE

Up to 14 high-speed differential pairs per cm (80 DP per inch)

Z-PACK TinMan Connectors

Features and Benefits
  • Up to 12.5 Gbps performance
  • 85 ohm impedance for differential pair configuration
  • Density up to 14 high speed differential pairs per cm (80 DP per inch): 6-16 columns available
  • Modular system: 3, 4, 5 and 6 pairs per column, respectively fitting 16.25mm (.625"), 20.32mm (0.8") and 25.4mm (1") slot-pitch
  • High speed cable assemblies and hardware
  • Reliable, redundant contact design on every signal contact
  • Modular system offered in various column versions
  • Meets industry standard reliability requirements
  • Sequencing for ground and signal contacts

Five Pairs Version
  • 26 pairs per 10mm [66 differential pairs per inch] fitting within a 25.40 (1.00) card slot pitch
  • Right angle pin headers (coplanar)
  • Vertical receptacles (mezzanine)

Three Pairs Version
  • 16 pairs per 10mm [40 differential pairs per inch] fitting within a 16.25 (.625) card slot pitch
  • Right angle pin headers (coplanar)
Servers
Servers
Switches and Routers
Switches and Routers
Optical Transport
Optical Transport

Applications

Z-PACK TinMan High-Speed Backplane Interconnects
  • Servers
  • Switches and Routers
  • Optical Transport
Data Rate Comparisons for Z-PACK Backplane Connectors

Data Rate Comparisons for Z-PACK Backplane Connectors