It is intended for high volume applications where small size, light weight, low cost, and compatibility with automated assembly equipment are required. Offset and span are calibrated at room temperature for OEMs requiring higher accuracies. The pressure sensor is available with a gage or absolute pressure sensing chip that is attached to a surface mountable ceramic substrate. A plastic cap is attached to the ceramic substrate, protecting the chip and providing the pressure port. The devices are shipped in plastic anti-static shipping tubes for use with automated production equipment. The drawing shows a standard tube version. Ports are also available with a narrow hole or a large hole to interface with the pressure media.
Please carefully read the disclaimer before using any of this data. Your use of this data constitutes your acceptance of the terms and conditions set forth below. If you do not agree to those terms and conditions, please click on the I Disagree link.
This information has been provided to your free of charge for your use but remains the sole property of TE Connectivity Corporation (''TE'') or SnapEDA, Inc. or Ultra Librarian/EMA Design Automation, Inc. (collectively, "Company"). While Company has used reasonable efforts to ensure its accuracy, Company does not guarantee that it is error-free, not makes any other representation, warranty, or guarantee that the information is completely accurate or up-to-date. In many cases, the CAD data has been simplified to remove proprietary detail while maintaining critical interface geometric detail for use by customers. Company expressly disclaims all implied warranties regarding this information, including but not limited to any implied warranties or merchantability or fitness for a particular purpose.