The fine pitch Board-to-Board (BTB) and Board-to-Flex (BTF) connectors from TE are widely adopted by manufacturers as they can be used in a variety of products from mobile phones, tablet PCs, mobile media players, notebooks, ultraportable devices and other movable devices. The key advantages are its low costs, high reliability and durability for long term use, and its low profile and high design flexibility.
TE offers a range of battery pack interconnect solutions that are not only designed on both a 2.0 mm to 2.5 mm centerline but come with many positioning options. This portfolio of products supports the various requirements for design engineers and provides what is necessary for reliable connections between a main PCB and a battery pack.
TE mobile battery connector series consists of several types - low profile battery connector, leaf battery connector and floating battery interconnection system (FBIS II). Mobile battery connectors’ key benefits - low cost, high reliability and durability, low profile design and high design flexibility - allow it to be used in various fields.
Our flat flexible cable connectors include a wide variety of high density cable-to-board and cable-to-cable connectors designed for automated assembly. They are composed of pin and receptacle housings on .100 [2.54] centerline contact spacing and receptacle housings on .050 [1.27] centerline contact spacing. Receptacle housings not only mate with the pin housings, but also mate with an array of printed circuit board headers from other TE connector lines.
We, a standard member of Universal Serial Bus-Implementers Forum (USB-IF), offer a new USB 3.0 connector retaining all the great features of previous generations of USB interconnects while improving upon them in the areas of performance and power management.
Non-ZIF FPC connector is developed for internal connections of mobile equipment such as digital cameras, tablet PCs, smartphones, and handheld game consoles. Compared to existing products, TE’s new Non-ZIF FPC connector is small and very low-profile, with a depth of only 0.9mm and a width of only 2.45mm, which meet the high-density package requirements for multifunction, high-performance mobile devices.
TE designs and manufactures antennas that support a broad range of frequencies including Wi-Fi, Bluetooth, ZigBee, ISM, GPS, NFC and cellular solutions for GSM and LTE applications. This 58 paged brochure includes comprehensive offerings of standard antenna solutions with clear statement of specifications, test statistics, mounting guides and product drawings.
TE's High Speed Multi I/O product combines all your mobile connectivity needs in a single Micro USB 2.0 form factor providing several value-added features including rapid charging, higher speed up to 10Gbps (USB 3.1 standard), external display connectivity including Mobility DisplayPort (MyDP) and Mobile High-Definition Link (MHL) capability, and backwards compatibility to Micro USB 2.0.
The AMP Mini CT connectors are miniature wire-to-board and wire-to-wire connectors, tailored for improved harness productivity. They feature a compact design with contacts on 1.5 mm pitch, and wire-side connectors can be used to produce a variety of harness styles by fully automatic high-speed assembling machines.
As the demands for higher-density packaging of electronic equipment increase, the use of FPCs to reduce size, weight and assembly costs has expanded. Our FPC solutions are available in 0.25mm, 0.3mm, 0.4mm, 0.5mm, 1.0mm, and 1.25mm centerline spacing.
The M.2 next generation form factor (NGFF) product line is a natural transition from the mini card and half mini card to a smaller form factor in both size and volume. It supports multiple function add-in cards or modules, including: WiFi, Bluetooth, global navigation satellite systems, near field communication, hybrid digital radio, Wireless Gigabit Alliance (WiGig), wireless wide area network, and solid-state storage devices.
Subscriber identity module (SIM) and universal identity module (UIM) cards are widely used in a variety of mobile applications, including, billing, security, and number storage purposes in mobile devices. The SIM card parameters are defined by ISO, ETSI, and GSM standards.
TE introduces the next generation LCD coaxial embedded display interface (LCEDI) family of connectors designed to provide exceptional electrical performance in both low voltage, differential signling (LVDS), and embedded DisplayPort (eDP) applications.
TE is a standing member of the USB Implementers Forum (USB-IF) and offers a wide range of products to meet your interconnect needs. Our products accommodate the two differentially driven data wires that provide bi-directional, simultaneous signals for USB 2.0 (480 mbps) and USB 1 (1.5 & 12 mbps).
TE's fine pitch FPC solutions are reliable interconnects that use an actuator to secure the cable termination and are field terminatable (require no tooling). TE's FPC solutions are available in centerline spacings of 0.25mm, 0.3mm, 0.5mm, 1.0mm, and 1.25mm.
TE's surface mount LGA socket was designed for use with Intel’s Core i7 LGA 1366 processor. The contacts have .64mm diameter solder balls for surface mounting onto the PCB, while the top side provides a cantilever beam interface to the package.