TE has storage connectivity solutions that address the growing wireless communications demand.
As the Internet of Things (IoT) expands and the growing connected world generates exponentially more data, efficient and reliable storage solutions become even more critical across the wireless and communications infrastucture. Whether you are designing to scale up or scale out with your data center storage solutions, TE has a broad range of input/output (I/O), board-to-board, power products and more to help you achieve your storage performance objectives. TE combines innovation and quality, dependable products with the flexibility to deliver storage interconnect solutions practically anywhere in the world. TE is your partner for creating the solutions that meet the demand of the next generation of our data-driven world.
Memory and Sockets
We have a range of solderless, compression-mount socketing solutions and the latest in memory connectors.
Robust and reliable bus bar, cable, hot-pluggable and blind mating solutions for critical storage applications including our MULTI-BEAM XLE Connectors.
High Speed Backplane
Transfer data at speeds of 25 Gbps with scalability up to 56 Gbps—upgrade without costly backplane redesigns.
QSFP Interconnect Portfolio
Built to meet your requirements for today and tomorrow, our QSFP/QSFP+ and zQSFP+ interconnects offer data rates up to 28 Gbps in an industry standard, scalable design.
TE continues to be engaged in the latest storage interface standards to support the ever evolving market and its continual need for higher bandwidth. With the technical expertise required to deliver superior designs and customer support, TE offers solutions to virtually any storage challenge.
Four Trends Affecting Connectivity Design
From “Big Data” and the Internet of Things (IoT) to wearable devices, 4K television, and 5G wireless networks, market forces are driving the need to move more data faster than ever to more places.