Improved Packaging Space
A vehicle’s weight can be reduced utilizing lighter or less material. One way to employ less material in a vehicle is to miniaturize its components.
TE is meeting this challenge with the our NanoMQS and MCON 0.50 interconnection systems. TE’s miniaturized connectivity solutions enable a reduced PCB size for electronic components, smaller wires down to 0.13mm2 and a reduced total connector package. These features combine to conserve energy and resources while reducing weight and, ultimately, CO2 emissions. Leading products include:
MCON 0.50 Interconnection System
The MCON 0.50 provides a clean body contact system which supports a durable integration of matt seals into the contact housing. The connectors widen the application options to include signal transfer using smaller standard wires.