STRADA Whisper, Cable Assemblies and I/O Connectors Deliver High-Density, High-Performance End-to-End Connectivity
July 16, 2015
HARRISBURG, Pa. – July 16, 2015 – TE Connectivity (TE), a world leader in connectivity, today announced that it is delivering key connectivity solutions for Intel® Omni-Path Architecture (Intel® OPA) as part of Intel Fabric Builders program. Specifically, TE is providing its STRADA Whisper backplane connectors and cable assemblies, internal cable assemblies, and I/O connectors for Intel’s new switch and other products that are part of the Intel OPA. TE’s solutions will be instrumental in enabling Intel OPA to deliver leading end-to-end performance and density for current and future high performance computing (HPC) workloads.
STRADA Whisper is TE’s revolutionary backplane connector and cable assembly solution that transfers data at 25 Gbps and offers scalability up to 56 Gbps. STRADA Whisper products operate with extremely low noise, low insertion loss and little to no skew—all of which provides system architects with design flexibility and high design margins.
TE’s internal cable assembly is an eight-channel cable assembly providing 25Gb/channel performance, which is available in two different lengths to facilitate various design configurations. TE is also a licensed supplier for the I/O connector solution that connects the internal cable assembly to the external cable assembly.
“This collaboration with Intel is a great example of how TE’s outstanding engineering team can adapt our products to provide high density, high performance, and low power consumption in data center products,” said John Hewitt, general manager, Data and Devices, TE Connectivity. “We are proud to be a member of Intel Fabric Builders and a contributor to the Intel Omni-Path Architecture product line, which promises new levels of performance for HPC data centers.”
“Intel® Omni-Path Architecture is the next-generation fabric for high performance computing and workloads benefiting from low-latency capabilities,” said Barry Davis, general manager of High Performance Fabric Organization at Intel. “We expect to have a very robust ecosystem in place when we launch later in the year, and we are excited to be working closely with TE on innovative cabling solutions that facilitate end user HPC deployments built upon the Intel® Omni-Path Architecture.”
TE Connectivity (NYSE: TEL) is a $12 billion global technology leader. Our commitment to innovation enables advancements in transportation, industrial applications, medical technology, energy, data communications, and the home. TE’s unmatched breadth of connectivity and sensor solutions, proven in the harshest of environments, helps build a safer, greener, smarter and more connected world. With 75,000 people – including more than 7,000 engineers – working alongside customers in nearly 150 countries, we help ensure that EVERY CONNECTION COUNTS – www.TE.com