02/04/2013
TE Connectivity (TE) announces a new low profile single sided DDR3 (Double-Data-Rate 3) SODIMM (Small Outline Dual In-line Memory Module) connector that delivers peak performance with high-speed data applications.
Product Features
- 0.6 mm pitch
- 204 position
- Connector height: 2.6mm
- Supports single side of memory
- STD and RVS type offered
- Angled insertion
Applications
- Ultrabook/notebook devices
- Desktops and All-in-One PCs
- Tablets
Documentation & Additional Information
TE Connectivity (TE) announces a new low profile single sided DDR3 (Double-Data-Rate 3) SODIMM (Small Outline Dual In-line Memory Module) connector that delivers peak performance with high-speed data applications.
Designed to accept the new DDR3 single sided SODIMM, the connector ensures durable connectivity to optimize device functionality, speed and usability. It features a 35 percent reduction in height, as compared with similar low profile products, which in turn reduces the height of the end-product by 5 to 10 percent. It also reduces motherboard shadow areas by nearly 156 mm2, or 312 mm2 for common dual-socket implementation. The DDR3 SODIMM connector accepts modules that meet JEDEC MO268 industry standards and is offered in both standard and reverse types.
BENEFITS:
- · Reduce connector height by 35 percent
- · Reduce layout space by 6 percent
- · Help reduce device height by 5 to 10 percent
- · Ultra low profile for new mobile computing form factors
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