Introducing the Inverted Thru Board Card Edge & Poke In Connectors - Nov 26, 2013
The Inverted Card Edge and Poke-In Platform Connectors provide 3.0 mm creep and clearance from all other conductive components on FR4 and metal clad printed circuit boards. The 2 position connectors share the same printed circuit board footprint while offering flexibility in providing either a direct power driver board one piece mating solution or a poke-in wire connection to the underside of the LED array boards.
Micro MATE-N-LOK Strain Relief Covers - Nov 21, 2013
TE Connectivity’s new Micro MATE-N-LOK strain relief cover kit contains snap on 4 & 8 position Micro MATE-N-LOK strain relief covers that provide cable assembly retention capability that meets IEC 60598-1 cable retention specifications.
Introducing Ruggedized Optical Backplane Interconnect – Supporting VITA 66.1 Standard - Nov 4, 2013
TE Connectivity’s (TE) Ruggedized Optical Backplane interconnect system provides a high-density, blind-mate optical interconnect in a backplane/daughtercard configuration. The fiber optic (ribbon) cable interconnect is fed through the backplane to removable system modules using MT ferrules.
Introducing AS85049 Adapters and Band Straps - Nov 4, 2013
The AS85049 industry standard is used on most military circular connectors including M38999.
The band strap termination system provides ease of installation and
repair. TE offers the corrosion resisting steel bands in three styles to help meet our customer’s shield termination needs and termination tool of their choice.
Pivot Power RJ 45 - Oct 9, 2013
The Pivot Power RJ45 is a new, low voltage power connector that commons RJ45 contacts to provide two power connections through an industry standard RJ45 interface. The connector commons positions 1,3,5 and 7 to one 18AWG wire and 2,4,6, and 8 to another 18AWG wire with simple, fast pivoting termination of both wires at once.
New Fastest 28-Gbps Single-Channel Interconnect for Communication Systems - Oct 3, 2013
TE Connectivity unveils its zSFP+ pluggable I/O interconnects, the company’s new line of high-speed connectors and cages. Designed to transfer data at 28 Gbps, with potential for upgrade to 40 Gbps, the new zSFP+ product line is currently one of the fastest single-channel I/O connectors available on the market today.
Introducing the 20A Medical Power Line Filters - Oct 1, 2013
TE Connectivity has expanded the Corcom H, HQ, HT and HZ Series of power line filters for medical applications to include 20A versions ideal for medical applications with current ratings that require minimal leakage current. The 20A H, HQ, HT and HZ Series filters are available for chassis or panel mounting configurations.
DEUTSCH 369 Series Connector - Sep 20, 2013
The TE DEUTSCH 369 series has been developed to provide a range of high reliability, lightweight, compact and cost efficient connectors suited to aerospace and other harsh environment applications.
Side Entry Tinel-Lock Ring - Sep 19, 2013
The side entry Tinel-Lock ring is a heat recoverable metal braid
terminator, which provides a method of joining a gross cable or
harness shield to a customer built connector backshell or other
termination device, without prepositioning the ring on the harness
(side entry). This ring can be easily removed.
New Product: Flexible Diesel Resistant Power Cables (FDR25S) - Sep 18, 2013
TE Connectivity is pleased to announce the introduction of its new FDR2S highly flexible wire. Its highly flexible characteristic allows the cable to be bent and routed in extremely tight areas with no wrinkling or cracking of the insulation.
TE Connectivity Announces Board Level Shielding Products - Sep 16, 2013
TE board level shields are stamped or drawn one- and two-piece metal cages that help provide isolation of board level components, minimize crosstalk and reduce electromagnetic interference (EMI) susceptibility without impacting system speed.
Latest SFP+ Connector Enhancements Improve Efficiency for Communication Equipment - Aug 22, 2013
TE announces the availability of an enhanced line of 16-Gbps SFP+ connectors designed for the data communications industry. The new SFP+ connectors feature upgrades that improve thermal performance and increase EMI containment, enabling communication equipment to operate more efficiently and deliver increased bandwidth.
Z50 LED Holder Extensions - Jul 23, 2013
The TE Solderless LED Holder, Type Z50, is a circular LED holder family that is now extended to provide a solderless connection to the Philips Lumileds LUXEON® CoB LED array family (20x24), CITIZEN Electronics CLL030/032 and SAMSUNG LC026B/LC040B LEDs. These LED holders form the core of electrical, mechanical, thermal and optical connectivity.
TE Connectivity Introduces 0.35mm Fine Pitch Scalable Board-to-Board Connector for High-Performance, Thinner Smartphones - Jul 11, 2013
TE Connectivity (TE) today released a 0.35mm fine pitch scalable board-to-board (BtB) connector featuring a body width of 1.85mm, one of the narrowest on the market.
Three New Economy Power 2.5 Series Connectors - Jul 8, 2013
TE Connectivity (TE) today announced three new product additions to its successful Economy Power 2.5 (EP 2.5) connector series. The latest products extend the connector series to include single and double row wire-to-wire connectors, as well as dual row wire-to-board connectors.
CLOUDSPLITTER SMT Jack - Jul 1, 2013
The CLOUDSPLITTER SMT modular jack meets Cat5e performance per EIA-568-C.1. The CLOUDSPLITTER SMT Modular Jack is lead-free, reflow solder capable, and accepts the standard RJ 45 shielded plug. The modular jack contains status LED indicators for link activity and network speed verification.
CLOUDSPLITTER Connector System - Jul 1, 2013
The CLOUDSPLITTER Connector System is a single cable solution for powered devices that delivers Cat5e performance and up to 250 watts of power over a single cable.
VERSATILE, COST-EFFECTIVE M.2 (NGFF) CONNECTORS FOR SMALLER, LIGHTER AND THINNER COMPUTING DEVICES - May 8, 2013
TE Connectivity (TE) launched a line of M.2 next-generation form factor (NGFF) connectors, which are designed using the new interface standard for a smaller form factor in both size and volume. Engineered for a wide range of applications, TE’s M.2 (NGFF) products meet both current and future market needs for slim solutions.
Introducing the GDH-SA Series DIP Switch - May 3, 2013
TE Connectivity releases the GDH-SA Series DIP switch to meet the market demands of miniaturization allowing for embedded electronics. The GDH-SA Series DIP switch has J-bended terminals providing one of the smallest, surface mount, half pitch, DIP switches available in the industry, saving you design real-estate on the PC Board.
The New POWER TRIPLE LOCK connector system improves connection stability and reliability - May 2, 2013
The new POWER TRIPLE LOCK (PTL) product line provides enhanced benefits to customers. New features include an optional connector position assurance (CPA), an optional terminal position assurance (TPA), high temperature housings up to 150°C (302°F) and an upgraded lanceless contact design. For more information on TE’s power triple lock, please visit www.te.com/products/PTL-PR