Nickel PTFE-Plated DEUTSCH 38999 Connectors Offer Alternative to Cadmium - Sep 26, 2014
TE Connectivity announces a new RoHS-compliant nickel PTFE plating for its DEUTSCH standard MIL-DIL-38999 Series III connectors.
Mini Hermaphroditic Connector - Sep 3, 2014
The low profile SMT miniature hermaphroditic board-to-board connectors are designed to provide power between adjacent linear printed circuit boards. Ideal for use in compact spaces with features designed for vacuum pick and place, the mini hermaphroditic is suitable for high volume manufacturing.
Offering Black Zinc Nickel Plating as Alternative to Cadmium - Aug 27, 2014
The ROHS-Compliant alternative to cadmium plating
1.18mm anti-buckling, push-pull micro-sim connector for mobile phones - Aug 19, 2014
Adding another third-form-factor (3FF) micro-SIM card connector solution for slimmer mobile phones and smartphones to its portfolio, TE Connectivity (TE), a world leader in connectivity, today introduced one of the market’s lowest-height, anti-buckling, push-pull micro-SIM connector.
New Releasable SMT Poke-In Wire Connectors - Jul 30, 2014
TE Connectivity’s low profile, SMT releasable poke-in wire connector accommodates multiple design requirements with 1, 2 & 3 position connector configurations. The releasable poke-in wire connector features an integral conductor release mechanism, recessed below the top side of the connector and cannot be compromised or broken during multiple insertion and release cycles. Ideal for LED lighting applications, the surface mount releasable poke-in connectors accept 18 to 22 gauge solid and stranded conductors and are tape and reel packaged for high speed SMT processing.
Introducing Next Generation EVC 250 Main Contactor - Jun 30, 2014
The new EVC 250 main contactor (EVC 250) has specifically been designed for use in hybrid, full-electric and fuel cell vehicles, as well as in vehicle charging systems and works without pressurized contact chambers.
Introducing High Speed Multi I/O Connector - Jun 4, 2014
TE’s High Speed Multi I/O product provides several industry-defined, value-added features, including rapid charging (according to electrical requirements of Micro USB Power Delivery at 3A), verification of performance at higher speeds up to 10Gbps.
Easy-to-install connector system safely and reliably ensures communication in harsh industrial environments - Jun 2, 2014
The newly expanded, easy-to-install M8/M12 connector system offers design engineers a reliable and complete solution to decrease downtime in industrial environments and supports higher bandwidth needs, meeting the requirements of up to 10 Gb/s.
The Industrial Mini I/O Offers A Field Installable Connectivity Solution - May 22, 2014
The Industrial Mini I/O Field Installable connector provides innovative and time-saving wire-termination alongside serving as a space saving and reliable I/O solution for industrial environments.
NEW INSERT ARRANGEMENTS FOR ARINC 600 NEXT-GENERATION RECEPTACLE CONNECTORS NOW AVAILABLE - May 19, 2014
These connectors are ideal for commercial and military avionics for air-to-ground communications, in-flight entertainment and collision avoidance, and they deliver significant cost and weight savings.
LUMAWISE LED Holders Type Z50 Extensions - May 14, 2014
The new LUMAWISE LED holders offering for OSRAM Opto, Cree, Philips LUMILEDS and NICHIA join TE's innovative LUMAWISE family of products that offer a solderless, easy to assemble, termination solution for the LED lighting marketplace. LUMAWISE LED holders provide flexible and adaptable connection platforms that are compatible with an extensive range of commercial LEDs.
Introducing the EYE Check Camera Alignment Accessory from TE Application Tooling - Apr 24, 2014
The EYE Check Accessory aids in applicator feed setup and terminal alignment to help eliminate errors.
SESD Devices Help Designers Solve Complex ESD and Surge Protectioon Challenges - Mar 17, 2014
Enhanced Silicon ESD devices offer 20kV air discharge rating for more robust protection in automobile, consumer and computing designs
New Multi-Channel Photocontrol Receptacle - Feb 20, 2014
TE Connectivity launches the new ANSI C136.41 compliant Dimming Receptacle and spring leaf contacts providing an electrical and mechanical interconnection between an ANSI C136.41-2013 photo control cell and luminaire.
Introducing CeeLok FAS-T Nano Circular Connectors - Feb 4, 2014
TE Connectivity’s (TE) CeeLok FAS-T Nano Circular connector is a
rugged, nano-miniature I/O connector capable of meeting 10 GbE
performance. The patented, noise-cancelling contact configuration
minimizes cross talk making it ideal for a variety of markets.
Introducing New Composite EMI Shields - Jan 6, 2014
Today’s military enclosures have ever increasing size, weight and
power (SWaP) demands and shape complexity. TE Connectivity (TE)
is a global provider of high performance polymer composites and
molding processes for military and aerospace enclosures.
TE Connectivity Introduces 0.5mm Fine Pitch Hermaphroditic Board-to-Board Connector - Dec 10, 2013
In response to the electronics market’s increasing need for smaller connectors that handle faster speed, TE Connectivity (TE), a world leader in connectivity, today introduced a new 0.5mm fine pitch hermaphroditic (FPH) board-to-board connector for parallel stacking of printed circuit boards.
Introducing the Inverted Thru Board Card Edge & Poke In Connectors - Nov 26, 2013
The Inverted Card Edge and Poke-In Platform Connectors provide 3.0 mm creep and clearance from all other conductive components on FR4 and metal clad printed circuit boards. The 2 position connectors share the same printed circuit board footprint while offering flexibility in providing either a direct power driver board one piece mating solution or a poke-in wire connection to the underside of the LED array boards.
Micro MATE-N-LOK Strain Relief Covers - Nov 21, 2013
TE Connectivity’s new Micro MATE-N-LOK strain relief cover kit contains snap on 4 & 8 position Micro MATE-N-LOK strain relief covers that provide cable assembly retention capability that meets IEC 60598-1 cable retention specifications.
Introducing Ruggedized Optical Backplane Interconnect – Supporting VITA 66.1 Standard - Nov 4, 2013
TE Connectivity’s (TE) Ruggedized Optical Backplane interconnect system provides a high-density, blind-mate optical interconnect in a backplane/daughtercard configuration. The fiber optic (ribbon) cable interconnect is fed through the backplane to removable system modules using MT ferrules.