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  • Mini Hermaphroditic Connector
    Mini Hermaphroditic Connector - Sep 3, 2014
    The low profile SMT miniature hermaphroditic board-to-board connectors are designed to provide power between adjacent linear printed circuit boards. Ideal for use in compact spaces with features designed for vacuum pick and place, the mini hermaphroditic is suitable for high volume manufacturing.

  • Offering Black Zinc Nickel Plating as Alternative to Cadmium
    Offering Black Zinc Nickel Plating as Alternative to Cadmium - Aug 27, 2014
    The ROHS-Compliant alternative to cadmium plating

  • 1.18mm anti-buckling, push-pull  micro-sim connector for mobile phones
    1.18mm anti-buckling, push-pull micro-sim connector for mobile phones - Aug 19, 2014
    Adding another third-form-factor (3FF) micro-SIM card connector solution for slimmer mobile phones and smartphones to its portfolio, TE Connectivity (TE), a world leader in connectivity, today introduced one of the market’s lowest-height, anti-buckling, push-pull micro-SIM connector.

  • New Releasable SMT Poke-In Wire Connectors
    New Releasable SMT Poke-In Wire Connectors - Jul 30, 2014
    TE Connectivity’s low profile, SMT releasable poke-in wire connector accommodates multiple design requirements with 1, 2 & 3 position connector configurations. The releasable poke-in wire connector features an integral conductor release mechanism, recessed below the top side of the connector and cannot be compromised or broken during multiple insertion and release cycles. Ideal for LED lighting applications, the surface mount releasable poke-in connectors accept 18 to 22 gauge solid and stranded conductors and are tape and reel packaged for high speed SMT processing.

  • Introducing Next Generation EVC 250 Main Contactor
    Introducing Next Generation EVC 250 Main Contactor - Jun 30, 2014
    The new EVC 250 main contactor (EVC 250) has specifically been designed for use in hybrid, full-electric and fuel cell vehicles, as well as in vehicle charging systems and works without pressurized contact chambers.

  • Introducing High Speed Multi I/O Connector
    Introducing High Speed Multi I/O Connector - Jun 4, 2014
    TE’s High Speed Multi I/O product provides several industry-defined, value-added features, including rapid charging (according to electrical requirements of Micro USB Power Delivery at 3A), verification of performance at higher speeds up to 10Gbps.

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  • ECOC 2014
    ECOC 2014 - Sep 22, 2014
    Join TE at ECOC 2014 to see our full solution set of fiber optics products. September 22-24, 2014 Cannes, France Palais de Festivals Stand # 522

  • Medtec China 2014
    Medtec China 2014 - Sep 9, 2014
    Come Visit TE Medical at Medtec China.

  • NUKLEA 2014
    NUKLEA 2014 - Sep 9, 2014
    Join us at NUKLEA 2014 to discover TE Connectivity's interconnect solutions that help withstand the harshest environments in nuclear applications.

  • 2014 Battery Show and Charging Infrastructure Expo
    2014 Battery Show and Charging Infrastructure Expo - Aug 4, 2014
    CONNECTING & PROTECTING FROM GRID TO VEHICLE Recharge your creative thinking with one of our many experts at TE and design-in the lates in advanced battery connection solutions for your next-generation electric & hybrid vehicles.

  • MILCOM 2014
    MILCOM 2014 - Jul 28, 2014
    HIGH TECHNOLOGY, HIGH QUALITY, HIGH RELIABILITY Join us at MILCOM 2014, the Military Communications Conference. October 6 - 8, 2014 Baltimore Convention Center Baltimore, MD

  • APEX IFSA 2014
    APEX IFSA 2014 - Jul 28, 2014
    ENABLING THE CONNECTED PASSENGER: Join us at the 2014 APEX IFSA Expo to see our product offering for cabin and IFE systems. Sept. 16-18, 2014 Anaheim Convention Center Anaheim, CA

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SOLVING FOR A MORE CONNECTED WORLD
SOLVING FOR A MORE CONNECTED WORLD
For the second consecutive year, TE was recognized as a Top 100 Global Innovator by Thomson Reuters. This prestigious distinction recognizes an organization’s commitment to innovation.
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