TE Circuits and Design is actively involved in the industry by researching and providing state of the art electrical performance reports, general reports and reference designs. These free resources cover such topics as alternate PCB materials, 5 and 10 gigabit system design, nanosecond discontinuities and optical backplane implementation.

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Routing & Application Guides Found...

Title Description
0.5mm Free Height (FH), 5mm Stack, COM Express Physical Test Data for COM Express, Tyco Electronics 0.5 mm Free Height Connector, 5 mm Stack Height
0.5mm Free Height (FH), 8mm Stack, COM Express Physical Test Data for COM Express, Tyco Electronics 0.5 mm Free Height Connector, 8 mm Stack Height
2mm HM 5+2 Row Use of Z-Pack 2mm HM for Fibre Channel Applications
Advanced Mezzanine Card (AMC) Connector Routing Guideline on Routing the Advanced Mezzanine Card (AMC) Connector with examples for AdvancedTCA
AMCC Using AMCC S2064 Drivers with AMP Connectors
CDFP Connector Routing Guideline on Routing CDFP Connector
CellBus in CPCI Implementing the TranSwitch CellBus Bus in CompactPCI Applications
CPCI 66 MHz CompactPCI at 66 MHz
Cubit CellBus TranSwitch CellBus Bus Reference Design Guideline for CUBIT-Pro Applications
CXP Connector Routing Guideline on Routing CXP Connector
HS3 Connector Routing Guideline on Routing the HS3 connector and its impact on electrical performance
JBOD using Vitesse Chips Excerpt - Guidelines for Implementing an Interconnect to Support a 2.125 Gb/s Fibre Channel JBOD
Lucent T8206 Implementing an Architecture Based on the Lucent T8206
MultiGig RT-2 Physical Test Data for Vita 41 and 46
MultiGig RT-2 Connector Routing Guide Guideline on Routing the MultiGig RT-2 Connector
Optical Backplanes Optical Backplanes - Fantasy or Reality?
RIMM Connector Designing a 28 Ohm Interconnection for Rambus
Step-Z Connector Routing This white paper describes how the Step-Z connector is routed, it details product dimensions as well as via, pad and antipad information.
Vitesse CrossStream Application Notes
Vitesse's Intelligent Switch Fabrics The Z-PACK HS3 Connector and Vitesse's Intelligent Switch Fabrics
XAUI HM-Zd Platform and Bitblitz Communications Describes the use of the Bitblitz nPower BBT3400 3.125 Gbps transceiver in the Tyco XAUI HM-Zd Interoperability Platform
XAUI HM-Zd Platform and Broadcom Describes the use of the Broadcom BCM8011 3.125 Gbps transceiver in the Tyco XAUI HM-Zd Interoperability Platform
XAUI HM-Zd Platform and IXIA Describes the use of IXIA load modules in the Tyco XAUI HM-Zd Interoperability Platform
XAUI HM-Zd Platform and Marvell Describes the use of the Marvell 88X2040 3.125 Gbps transceiver in the Tyco XAUI HM-Zd Interoperability Platform
XAUI HM-Zd Platform and Mindspeed Describes the use of the Mindspeed M27205 3.125 Gbps transceiver in the Tyco XAUI HM-Zd Interoperability Platform
XAUI HM-Zd Platform and PMC-Sierra Describes the use of the PMC-Sierra PM8355 QuadPHY-II 3.125 Gbps transceiver in the Tyco XAUI HM-Zd Interoperability Platform
XAUI HM-Zd Platform and Texas Instruments Describes the use of the Texas Instruments serial gigabit transceiver family in the Tyco XAUI HM-Zd Interoperability Platform
XAUI HM-Zd Platform and Velio Describes the use of the Velio 3.125 Gbps SerDes in the Tyco XAUI HM-Zd Interoperability Platform
Z-PACK HM-Zd Connector Noise Z-PACK HM-Zd - Connector Noise Analysis For XAUI Applications
Z-PACK HM-Zd PWB Footprint Optimization Guideline - Z-PACK HM-Zd PWB Footprint Optimization for Routing
Z-PACK TinMan Connector Routing This paper describes Z-PACK TinMan routing details
zQSFP+ SMT Connector Routing Guideline on Routing zQSFP+ SMT Connector
zQSFP+ Stacked Connector Routing Guideline on Routing zQSFP+ Stacked Connector
zSFP+ Stacked Connector Routing Guideline on Routing zSFP+ Stacked Connector

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