| Background |
| Tin Plating at TE |
| Customer Information Package |
| "Backwards Compatibility of RoHS Compliant Products", ECN article, Nov 2005 |
| Lead Free Components in Automotive Applications, presented at IPC/JEDEC 2003 conference |
| Lead free paper presented at IICIT, October 2001 |
| Lead Free Manufacturing Paper |
| Solderability |
| Solder Joint Inspection Information for Lead Free Solder - IPC 610D |
| Solderability of Lead Free Electrodeposits in Tin/Lead Solder - (Backwards Compatibility) (503-1001) |
| IPC/JEDEC J-STD-002B Solderability Test Report (Tin/Lead and Lead Free Solder) (503-1) |
| IPC/JEDEC J-STD-002A Solderability Test Report (Dip & Look) |
| Presentation on solderability testing |
| BGA connectors using lead free |
| Hot Air Leveled Tin: Solderability and Some Related Properties |
| Whiskering |
| Tin Reflow for Tin Whisker Mitigation, Presented at 2010 CALCE Tin Whisker Conference |
| Tin Whisker Testing: Hot Air Leveled Tin and Electroplated-Reflowed Tin |
| An Electrical Characterization of Tin Whiskers, Presented at MRS Spring Meeting, April 2007 |
| Bright Tin for Whisker Mitigated Electronics Applications, presented at IPC/JEDEC 11th Conf on Leadfree, Dec 2005 |
| Tin Whisker Reliability Assessment by Monte Carlo Simulation (IPC/JEDEC 2005) |
| Tin Whisker Qualification Testing - Eye of the Needle Compliant Pin Products (503-1006) |
| Electrostatic Fields and Current Flow Impact on Whisker Growth (IEEE journal paper) |
| NEMI Tin Whisker Acceptance Test Requirements Document |
| NEMI Tin Whisker Update - Oct 2004 |
| Presentation on our whisker tests and results (Updated) |
| Investigations of Zinc (Zn) Whiskers using FIB Technology Paper, presented at IPC/JEDEC 2004 |
| Investigations of Zinc (Zn) Whiskers using FIB Technology Presentation |
| Durability/Friction |
| Presentation on Durability |
| Coefficient of Friction |
| Contact Resistance |
| Fretting Performance of Lead Free Surface Finishes (503-1002) |
| Presentation on contact resistance testing of lead free platings |
| Lubricant Stability after SMT Soldering |
| Press-fit Terminations |
| Toward Lead-Free Compliant Pin Connections, presented at the SMTA 2005 conference |
| Evaluation of Plated-Through-Hole Deformation in Lead-Free Press-Fit Connections (503-2 RevA) |
| Effects of Lead-Free Surface Finishes on Press-Fit Connections, presented at IPC 2003 conference |
| Friction Behavior of Press-Fit Applications: Test Apparatus and Methodology, presented at IEEE Holm 2003 conference |
| White paper on press-fit connectors (tin and tin-lead) used in lead free boards |
| Slide show presentation form of this white paper |
| Presentation on press-fit from ICEC 2002 |
| Heat Resistance of Polymers |
| Effect of Transient Thermal Profiles in Wave Soldering Processes on Connector Performance, presented at IPC/APEX 2004 conference |
| Presentation overviewing the impact of higher temperatures on the performance of plastics in connectors. |
| Resistance to Soldering Heat - Reflow: TE Spec. TEC-109-201 |
| Resistance to Soldering Heat - Wave: TE Spec. 109-202 |
| Wire Deformation |
| Insulation Displacement Connections for RoHS Compliance (503-1008) |
| Crimp Qualification Testing: USCAR-21 |
| Crimp Qualification Testing: USCAR-20 |
| Relays |
| Axicom lead free products site |
| Other Hazardous Materials |
| Design for Low-Halogen Green Electronics |
| Low Halogen Polymers for Electronic Applications |
| Case study in Hexavalent Chromate Replacement |
| General Hazardous Materials Concerns at TE |
| Hexavalent Chromium and Cadmium Overview |
