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Z-PACK TinMan High Density Backplane Connectors Overview


Z-PACK TinMan connector
Z-PACK TinMan Connector

eLearning Module
The Z-PACK TinMan Backplane Connector family is a cost-effective solution for customers searching for a high density, high performance backplane interconnect system.

The Z-PACK TinMan Connector design follows proven industry backplane convention by offering a fully protected right-angle receptacle for use on daughtercards where handling damage can be a concern when mating to a vertical male header. This connector permits field repairability at either the module or single pin levels.

Ground contacts positioned within each column of the connector, combined with unique contact lead frame arrangements, enable the Z-PACK TinMan Connector to achieve low crosstalk and high through-put performance levels. Reliability is assured with a dual point of contact mating interface and compliant pin interface to the printed circuit board.

    Key Features
    • 12+ Gb/s performance
    • 85 ohm Impedance for differential pair configuration
    • 100 ohm Impedance for differential pair configuration
    • 6 pair module offers 31 pairs/10mm [80 diff. pairs/inch] fitting within a 29.21 [1.15] card slot pitch
    • 5 pair module offers 26 pairs/10mm [66 diff. pairs/inch] fitting within a 25.40 [1.00] card slot pitch
    • 4 pair module offers 21 pairs/10mm [53 diff. pairs/inch] fitting within a 20.30 [.800] card slot pitch
    • 3 pair module offers 16 pairs/10mm [40 diff. pairs/inch] fitting within a 16.25 [.640] card slot pitch
    • Right angle pin headers (coplanar) in 3 pair, 4 pair and 5 pair modules
    • Vertical receptacles (parallel board) in 4 pair modules
    • 6x12 and 6x6 modules for mid-plane orthogonal applications
    • Reliable, redundant contact design on every signal contact
    • Modular system offered in various column modules
    • Meets Industry reliability requirements of Bellcore/Telcordia
    • Sequencing for ground and signal contacts
    • RoHS Compliant
    Applications
  • Designed for cost pressured, high signal density applications requiring interconnection between two printed circuit boards
  • Switches: Stackable, Carrier Grade, Core, Edge and Metro Ethernet
  • Servers: Blade, Rack Mount and Mainframe
  • Routers: Edge, Core, Enterprise Class, Carrier Ethernet, BRAS, and Multi Service Edge
  • Optical: Transport:Carrier Grade Optical, Metro WDM, Optical Multi-Service Provisioning, Long Haul Optical and Enterprise LAN Optical Ethernet

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