Europe/ Middle East / Africa
TE Connectivity (TE) designs and manufactures antennas that comply with the most stringent operating requirements. We are a pioneer of customized embedded antenna solutions to meet the wireless industry's demand for increased complexity and miniaturization combined with the need to integrate a multi-radio environment into one component.
Our innovative antenna designs have been applied to a wide range of wireless products including some of the thinnest laptops, leading touch screen smartphones, and revolutionary gaming consoles. Our antennas offer endless possibilities for our customers to create wireless devices with several combinations of features in a variety of shapes or sizes.
WLAN / WWAN / Voice
(The Bluetooth trademarks are owned by Bluetooth SIG, Inc. ZigBee is a trademark of ZigBee Alliance.)
Numerous Industries have integrated wireless functionality into their everyday products and services. TE provides advanced antenna solutions for most wireless devices, with many combinations of features that are required. Our antenna designs accommodate numerous sets of frequency bands for operation on any network - in both regional and global markets - at a competitive price point.
TE Connectivity is a leading developer and manufacturer of high performance embedded and external antennas for diverse wireless applications in various industries. TE has a global presence with manufacturing and design locations around the world.
TE most commonly utilizes the following manufacturing technologies: Molded Interconnect Device (MID) Technology: Two Shot and Laser Direct Structuring; Stamped Metal; Printed Circuit Board (PCB) and Flexible Printed Circuit (FPC).
TE is one of the leading provider of Molded Interconnect Device (MID) technology with more than 25 years mass production experience. In its most basic form, MID technology is defined as a process that results in selectively plated plastic parts. This technology is most often used in three basic ways: electro-mechanical (signal or current carrying traces), RF technology (antennas), and for shielding applications. MIDs can integrate electrical and mechanical elements into almost any shape of interconnect device allowing entirely new functions to be created while facilitating the miniaturization of products.
TE utilizes two different technologies to manufacture MID antennas: 2-Shot molding and Laser Direct Structuring (LDS).
Two Shot MID Technology Custom Antenna Design Request
Two Shot molding is a mature and well understood process that remains viable for cost effective and repeatable production of MIDs. The basic process has only two steps, injection molding of two distinct thermoplastic polymers and the electroless plating process, resulting in a selectively plated component. In order to achieve the selectivity during plating, a catalyst doped “plateable” resin is molded in conjunction with a standard non-plateable resin to define the desired area to be plated. This area is metallized initially with copper, followed by nickel and, optionally, gold plating. The following are just a few of the several advantages that MID 2-Shot technology delivers compared to alternative technologies:
Laser Direct Structuring MID Technology Custom Antenna Design Request
Laser Direct Structuring (LDS) is an exciting technology used to create Molded Interconnect Devices (MID). Through the use of the dedicated laser system and a variety of the proprietary resins, it opens up many possibilities to create 3 dimensional MIDs with finer line width and spacing than what is possible with the conventional MID processes. LDS is a three step process. First, the antenna is molded in a standard single shot mold using one of the LDS resins. Second, the desired pattern is directly structured onto the antenna by the 3D laser system. Finally, the pattern is plated using industry-standard methods where the plating adheres to the plastic only where the plastic has been activated by the laser, thus creating a conductive pattern. LDS offers some of the 2-Shot technology advantages mentioned above plus:
Printed Antennas Custom Antenna Design Request
Printing is an emerging manufacturing process being used to produce antennas. The Antenna carrier is molded of standard resin materials. Then the antenna pattern is structured onto the carrier by applying a conductive, non-plate particulate in a tightly controlled manner with a 3D print system.
Stamped Metal Antennas Custom Antenna Design Request
TE has developed a line of low profile, high performance Stamped Metal embedded antenna solutions for single-, dual-, tri- and quad band applications. Stamped Metal antennas offer OEM’s a low cost and highly repeatable manufacturing solution with a number of standard or customized antenna designs. Stampings are a proven solution with several advantages such as:
Flexible Printed Circuit (FPC) and Printed Circuit Board (PCB) Antennas Custom Antenna Design Request
Flexible Printed Circuits and Printed Circuit Boards are ideal for multi band antennas, allowing virtually any wireless product to operate at different frequencies without multiple antennas. TE Connectivity offers a broad range of low profile, high performance FPC and PCB embedded antennas. Similar to our Stamped Metal antennas, FPC and PCB antennas offer OEM’s a low cost and highly repeatable manufacturing solutions in a number of standard or customized antenna designs. FPC and PCB antennas address the needs of a variety of wireless applications and offer several advantages such as:
Speaker Acoustic Modules Custom Antenna Design Request
TE has in-house capability for designing, assembling, and testing speaker acoustic modules (SAMs). The antenna and acoustic chamber are designed together as one assembly. The acoustic chamber becomes the carrier for the antenna using one of the above technologies. SAMs are 100% RF and acoustic tested in the production line prior to packaging.
TE Connectivity is a leading developer and manufacturer of high performance embedded and external antennas for diverse wireless applications in various industries. TE has a global presence with manufacturing and design locations around the world.Product Management & Design Locations: