| Part |
Differing Features |

|
- Connector Style = Plug
- 140 Positions
- Keyed
- Board-to-Board Stack Height = 10.00 mm
- Board-to-Board Stack Height = 18.00 mm
|
- Copper Alloy Contact Base Material
- Gold (8) Contact Plating, Mating Area, Material
- With Grounding Plate
- With Grounding Contact
- With Locating Post(s)
|
| Always EU RoHS/ELV Compliant, Reflow solder capable to 260°C |
|
|
|

|
- Connector Style = Plug
- 160 Positions
- Keyed
- Board-to-Board Stack Height = 10.00 mm
- Board-to-Board Stack Height = 18.00 mm
|
- Copper Alloy Contact Base Material
- Gold (8) Contact Plating, Mating Area, Material
- With Grounding Plate
- With Grounding Contact
- With Locating Post(s)
|
| Always EU RoHS/ELV Compliant, Reflow solder capable to 260°C |
|
|
|

|
- Connector Style = Plug
- 160 Positions
- Keyed
- Board-to-Board Stack Height = 10.00 mm
- Board-to-Board Stack Height = 18.00 mm
|
- Copper Alloy Contact Base Material
- Gold (8) Contact Plating, Mating Area, Material
- With Grounding Plate
- With Grounding Contact
- With Locating Post(s)
|
| Always EU RoHS/ELV Compliant, Reflow solder capable to 260°C |
|
|
|

|
- Connector Style = Plug
- 40 Positions
- Keyed
- Board-to-Board Stack Height = 6.00 mm
- Copper Alloy Contact Base Material
|
- Gold (8) Contact Plating, Mating Area, Material
- With Grounding Plate
- With Grounding Contact
- With Locating Post(s)
- Packaging Method = Tape & Reel
|
| Always EU RoHS/ELV Compliant, Reflow solder capable to 260°C |
|
|
|

|
- Connector Style = Plug
- 50 Positions
- Keyed
- Board-to-Board Stack Height = 6.00 mm
- Board-to-Board Stack Height = 14.00 mm
|
- Copper Alloy Contact Base Material
- Gold (8) Contact Plating, Mating Area, Material
- With Locating Post(s)
- Packaging Method = Tape & Reel
- Board-to-Board (Personal Systems/Computers) Industry Application
|
| Always EU RoHS/ELV Compliant, Reflow solder capable to 245°C |
|
|
|

|
- Connector Style = Plug
- 50 Positions
- Keyed
- Board-to-Board Stack Height = 5.00 mm
- Board-to-Board Stack Height = 13.00 mm
|
- Copper Alloy Contact Base Material
- Gold (8) Contact Plating, Mating Area, Material
- With Locating Post(s)
- Packaging Method = Tape & Reel
- Board-to-Board (Personal Systems/Computers) Industry Application
|
| Always EU RoHS/ELV Compliant, Reflow solder capable to 260°C |
|
|
|

|
- Connector Style = Plug
- 140 Positions
- Keyed
- Board-to-Board Stack Height = 8.00 mm
- Copper Alloy Contact Base Material
|
- Gold (8) Contact Plating, Mating Area, Material
- With Locating Post(s)
- With Sealant
- Packaging Method = Tape & Reel
- Board-to-Board (Personal Systems/Computers) Industry Application
|
| Always EU RoHS/ELV Compliant, Reflow solder capable to 245°C |
|
|
|

|
- Connector Style = Plug
- 140 Positions
- Keyed
- Board-to-Board Stack Height = 8.00 mm
- Copper Alloy Contact Base Material
|
- Gold (8) Contact Plating, Mating Area, Material
- With Grounding Plate
- With Grounding Contact
- With Locating Post(s)
- With Sealant
|
| Always EU RoHS/ELV Compliant, Reflow solder capable to 260°C |
|
|
|

|
- Connector Style = Receptacle
- 280 Positions
- Keyed
- Board-to-Board Stack Height = 4.00 mm
- Copper Alloy Contact Base Material
|
- Gold (8) Contact Plating, Mating Area, Material
- With Grounding Contact
- With Locating Post(s)
- With Vacuum Cover
- With Sealant
|
| Always EU RoHS/ELV Compliant, Reflow solder capable to 260°C |
|
|
|

|
- Connector Style = Plug
- 280 Positions
- Keyed
- Board-to-Board Stack Height = 4.00 mm
- Copper Alloy Contact Base Material
|
- Gold (8) Contact Plating, Mating Area, Material
- With Grounding Plate
- With Grounding Contact
- With Locating Post(s)
- With Vacuum Cover
|
| Always EU RoHS/ELV Compliant, Reflow solder capable to 260°C |
|
|
|

|
- Connector Style = Plug
- 280 Positions
- Keyed
- Board-to-Board Stack Height = 6.00 mm
- Copper Alloy Contact Base Material
|
- Gold (8) Contact Plating, Mating Area, Material
- With Grounding Plate
- With Grounding Contact
- With Locating Post(s)
- With Vacuum Cover
|
| Always EU RoHS/ELV Compliant, Reflow solder capable to 260°C |
|
|
|

|
- Connector Style = Plug
- 280 Positions
- Keyed
- Board-to-Board Stack Height = 8.00 mm
- Copper Alloy Contact Base Material
|
- Gold (8) Contact Plating, Mating Area, Material
- With Grounding Plate
- With Grounding Contact
- With Locating Post(s)
- With Vacuum Cover
|
| Always EU RoHS/ELV Compliant, Reflow solder capable to 260°C |
|
|
|

|
- Connector Style = Plug
- 280 Positions
- Keyed
- Board-to-Board Stack Height = 4.00 mm
- Copper Alloy Contact Base Material
|
- Gold (8) Contact Plating, Mating Area, Material
- With Locating Post(s)
- With Vacuum Cover
- With Sealant
- Packaging Method = Tape & Reel
|
| Always EU RoHS/ELV Compliant, Reflow solder capable to 260°C |
|
|
|

|
- Connector Style = Plug
- 160 Positions
- Keyed
- Board-to-Board Stack Height = 7.00 mm
- Copper Alloy Contact Base Material
|
- Gold (8) Contact Plating, Mating Area, Material
- With Grounding Plate
- With Grounding Contact
- With Locating Post(s)
- With Sealant
|
| Always EU RoHS/ELV Compliant, Reflow solder capable to 245°C |
|
|
|

|
- Connector Style = Plug
- 160 Positions
- Keyed
- Board-to-Board Stack Height = 10.00 mm
- Copper Alloy Contact Base Material
|
- Gold (8) Contact Plating, Mating Area, Material
- With Grounding Plate
- With Grounding Contact
- With Locating Post(s)
- With Sealant
|
| Always EU RoHS/ELV Compliant, Reflow solder capable to 260°C |
|
|
|

|
- Connector Style = Plug
- 160 Positions
- Keyed
- Board-to-Board Stack Height = 10.00 mm
- Copper Alloy Contact Base Material
|
- Gold (8) Contact Plating, Mating Area, Material
- With Grounding Plate
- With Grounding Contact
- With Locating Post(s)
- With Vacuum Cover
|
| Always EU RoHS/ELV Compliant, Reflow solder capable to 245°C |
|
|
|

|
- Connector Style = Plug
- 50 Positions
- Keyed
- Board-to-Board Stack Height = 10.00 mm
- Board-to-Board Stack Height = 18.00 mm
|
- Copper Alloy Contact Base Material
- Gold (8) Contact Plating, Mating Area, Material
- With Grounding Plate
- With Grounding Contact
- With Locating Post(s)
|
| Always EU RoHS/ELV Compliant, Reflow solder capable to 260°C |
|
|
|

|
- Connector Style = Receptacle
- 50 Positions
- Keyed
- Board-to-Board Stack Height = 4.00 mm
- Copper Alloy Contact Base Material
|
- Gold (8) Contact Plating, Mating Area, Material
- With Locating Post(s)
- With Vacuum Cover
- Packaging Method = Tape & Reel
- Board-to-Board (Personal Systems/Computers) Industry Application
|
| Always EU RoHS/ELV Compliant, Not reviewed for solder process capability |
|
|
|

|
- Connector Style = Receptacle
- 60 Positions
- Keyed
- Board-to-Board Stack Height = 4.00 mm
- Copper Alloy Contact Base Material
|
- Gold (8) Contact Plating, Mating Area, Material
- With Grounding Contact
- With Locating Post(s)
- Packaging Method = Tape & Reel
- Board-to-Board (Personal Systems/Computers) Industry Application
|
| Always EU RoHS/ELV Compliant, Reflow solder capable to 260°C |
|
|
|

|
- Connector Style = Plug
- 50 Positions
- Keyed
- Board-to-Board Stack Height = 8.00 mm
- Copper Alloy Contact Base Material
|
- Gold (8) Contact Plating, Mating Area, Material
- With Locating Post(s)
- With Vacuum Cover
- Packaging Method = Soft Tray
- Board-to-Board (Personal Systems/Computers) Industry Application
|
| Always EU RoHS/ELV Compliant, Reflow solder capable to 260°C |
|
|
|