| Part |
Differing Features |

|
- PCB Mount Style = Surface Mount
- Straight Leg
- Without Flange
- High Temperature Thermoplastic Housing Material
- Copper Alloy Contact Base Material
|
- Gold (30) over Nickel Contact Plating
- Top Mount Location
- Packaging Method = Tray
- Desktop PC Industry Application
- Netbook PC Industry Application
|
| Always EU RoHS/ELV Compliant, Reflow solder capable to 245°C |
|
|
|

|
- PCB Mount Style = Surface Mount
- Straight Leg
- Without Flange
- High Temperature Thermoplastic Housing Material
- Copper Alloy Contact Base Material
|
- Gold (30) over Nickel Contact Plating
- Top Mount Location
- Packaging Method = Tray
- Standard Industry Application
- AMP
|
| Always EU RoHS/ELV Compliant, Reflow solder capable to 260°C |
|
|
|

|
- PCB Mount Style = Surface Mount
- Straight Leg
- Without Flange
- Liquid Crystal Polymer (LCP) Housing Material
- Brass Contact Base Material
|
- Gold (30) over Nickel Contact Plating
- Bottom Mount Location
- Packaging Method = Reel
- Desktop PC Industry Application
- AMP
|
| Always EU RoHS/ELV Compliant, Reflow solder capable to 245°C |
|
|
|

|
- PCB Mount Style = Surface Mount
- Straight Leg
- With Flange
- High Temperature Thermoplastic Housing Material
- Copper Alloy Contact Base Material
|
- Gold (30) over Nickel Contact Plating
- Top Mount Location
- Packaging Method = Tray
- Standard Industry Application
- AMP
|
| Always EU RoHS/ELV Compliant, Reflow solder capable to 245°C |
|
|
|

|
- PCB Mount Style = Through Hole
- Straight Leg
- With Flange
- High Temperature Thermoplastic Housing Material
- Copper Alloy Contact Base Material
|
- Gold (30) over Nickel Contact Plating
- Top Mount Location
- Packaging Method = Tray
- Standard Industry Application
- AMP
|
| Always EU RoHS/ELV Compliant, Reflow solder capable to 245°C |
|
|
|

|
- PCB Mount Style = Through Hole
- Straight Leg
- With Flange
- High Temperature Thermoplastic Housing Material
- Copper Alloy Contact Base Material
|
- Gold (30) over Nickel Contact Plating
- Top Mount Location
- Packaging Method = Tray
- Standard Industry Application
- AMP
|
| Always EU RoHS/ELV Compliant, Reflow solder capable to 245°C |
|
|
|

|
- PCB Mount Style = Surface Mount
- SMT Hold Down
- With Flange
- High Temperature Thermoplastic Housing Material
- Copper Alloy Contact Base Material
|
- Gold (30) over Nickel Contact Plating
- Top Mount Location
- Packaging Method = Reel
- Standard Industry Application
- AMP
|
| Always EU RoHS/ELV Compliant, Reflow solder capable to 245°C |
|
|
|

|
- PCB Mount Style = Surface Mount
- SMT Hold Down
- Without Flange
- High Temperature Thermoplastic Housing Material
- Copper Alloy Contact Base Material
|
- Gold (30) over Nickel Contact Plating
- Top Mount Location
- Packaging Method = Tray
- Standard Industry Application
- AMP
|
| Always EU RoHS/ELV Compliant, Reflow solder capable to 245°C |
|
|
|

|
- PCB Mount Style = Through Hole
- Straight Leg
- Without Flange
- High Temperature Thermoplastic Housing Material
- Copper Alloy Contact Base Material
|
- Gold (30) over Nickel Contact Plating
- Top Mount Location
- Packaging Method = Reel
- Desktop PC Industry Application
- TE Connectivity
|
| Always EU RoHS/ELV Compliant, Reflow solder capable to 245°C |
|
|
|

|
- PCB Mount Style = Through Hole
- Straight Leg
- Without Flange
- High Temperature Thermoplastic Housing Material
- Copper Alloy Contact Base Material
|
- Gold (30) over Nickel Contact Plating
- Top Mount Location
- Packaging Method = Tray
- Netbook PC Industry Application
- Notebook PC Industry Application
|
| Always EU RoHS/ELV Compliant, Reflow solder capable to 245°C |
|
|
|

|
- PCB Mount Style = Surface Mount
- Straight Leg
- Without Flange
- High Temperature Thermoplastic Housing Material
- Copper Alloy Contact Base Material
|
- Gold (30) over Nickel Contact Plating
- Top Mount Location
- Packaging Method = Tray
- Standard Industry Application
- AMP
|
| Always EU RoHS/ELV Compliant, Reflow solder capable to 245°C |
|
|
|

|
- PCB Mount Style = Through Hole
- Straight Leg
- Without Flange
- High Temperature Thermoplastic Housing Material
- Copper Alloy Contact Base Material
|
- Gold (30) over Nickel Contact Plating
- Top Mount Location
- Packaging Method = Tape & Reel
- Standard Industry Application
- AMP
|
| Always EU RoHS/ELV Compliant, Reflow solder capable to 245°C |
|
|
|

|
- PCB Mount Style = Through Hole
- Straight Leg
- Without Flange
- High Temperature Thermoplastic Housing Material
- Copper Alloy Contact Base Material
|
- Gold (15) over Nickel Contact Plating
- Top Mount Location
- Packaging Method = Tape & Reel
- Standard Industry Application
- AMP
|
| Always EU RoHS/ELV Compliant, Reflow solder capable to 245°C |
|
|
|

|
- PCB Mount Style = Through Hole
- Straight Leg
- Without Flange
- High Temperature Thermoplastic Housing Material
- Copper Alloy Contact Base Material
|
- Gold Flash Contact Plating
- Top Mount Location
- Packaging Method = Tape & Reel
- Standard Industry Application
- AMP
|
| Always EU RoHS/ELV Compliant, Reflow solder capable to 245°C |
|
|
|

|
- PCB Mount Style = Surface Mount
- Straight Leg
- Without Flange
- High Temperature Thermoplastic Housing Material
- Copper Alloy Contact Base Material
|
- Gold (30) over Nickel Contact Plating
- Top Mount Location
- Packaging Method = Reel
- Standard Industry Application
- AMP
|
| Always EU RoHS/ELV Compliant, Reflow solder capable to 245°C |
|
|
|

|
- PCB Mount Style = Surface Mount
- SMT Hold Down
- With Flange
- High Temperature Thermoplastic Housing Material
- Copper Alloy Contact Base Material
|
- Gold (30) over Nickel Contact Plating
- Top Mount Location
- Packaging Method = Tray
- Standard Industry Application
- AMP
|
| Always EU RoHS/ELV Compliant, Reflow solder capable to 245°C |
|
|
|

|
- PCB Mount Style = Through Hole
- Straight Leg
- Without Flange
- High Temperature Thermoplastic Housing Material
- Copper Alloy Contact Base Material
|
- Gold (30) over Nickel Contact Plating
- Top Mount Location
- Packaging Method = Tray
- Standard Industry Application
- AMP
|
| Always EU RoHS/ELV Compliant, Not reviewed for solder process capability |
|
|
|