| Part |
Differing Features |

|
- Board-to-Board Configuration = Right Angle
- Contact Transmits (Typical Application) Power
- Contact Transmits (Typical Application) Signal (Data)
- Contact Transmits (Typical Application) Signal (Data)/Power
- 2/AC Power, 18/Signal, 10/AC Power
|
- 30 Positions
- 18 Signal Positions
- 12 Power Positions
- Without PCB Mount Retention
- Termination Method to PC Board = Through Hole - Solder
|
| Always EU RoHS/ELV Compliant, Wave solder capable to 265°C |
|
|
|

|
- Board-to-Board Configuration = Right Angle
- Contact Transmits (Typical Application) Power
- Contact Transmits (Typical Application) Signal (Data)
- Contact Transmits (Typical Application) Signal (Data)/Power
- 2/AC Power, 18/Signal, 10/AC Power
|
- 30 Positions
- 18 Signal Positions
- 12 Power Positions
- Without PCB Mount Retention
- Termination Method to PC Board = Through Hole - Solder
|
| Always EU RoHS/ELV Compliant, Wave solder capable to 265°C |
|
|
|

|
- Board-to-Board Configuration = Right Angle
- Contact Transmits (Typical Application) Power
- Contact Transmits (Typical Application) Signal (Data)
- Contact Transmits (Typical Application) Signal (Data)/Power
- 14/Signal, 14/AC Power, 16/Signal
|
- 44 Positions
- 30 Signal Positions
- 14 Power Positions
- Without PCB Mount Retention
- Termination Method to PC Board = Through Hole - Solder
|
| Always EU RoHS/ELV Compliant, Wave solder capable to 265°C |
|
|
|

|
- Board-to-Board Configuration = Right Angle
- Contact Transmits (Typical Application) Power
- Contact Transmits (Typical Application) Signal (Data)
- Contact Transmits (Typical Application) Signal (Data)/Power
- 2/AC Power, 18/Signal, 10/AC Power
|
- 30 Positions
- 18 Signal Positions
- 12 Power Positions
- With PCB Mount Retention
- Boardlock(s)
|
| Always EU RoHS/ELV Compliant, Reflow solder capable to 260°C |
|
|
|

|
- Board-to-Board Configuration = Right Angle
- Contact Transmits (Typical Application) Power
- Contact Transmits (Typical Application) Signal (Data)
- Contact Transmits (Typical Application) Signal (Data)/Power
- 2/AC Power, 18/Signal, 10/AC Power
|
- 30 Positions
- 18 Signal Positions
- 12 Power Positions
- With PCB Mount Retention
- Action/Compliant Posts
|
| Always EU RoHS/ELV Compliant, Not applicable for solder process capability |
|
|
|

|
- Board-to-Board Configuration = Right Angle
- Contact Transmits (Typical Application) Power
- Contact Transmits (Typical Application) Signal (Data)
- Contact Transmits (Typical Application) Signal (Data)/Power
- 2/AC Power, 20/Signal, 16/AC Power
|
- 38 Positions
- 20 Signal Positions
- 18 Power Positions
- With PCB Mount Retention
- Action/Compliant Posts
|
| Always EU RoHS/ELV Compliant, Not applicable for solder process capability |
|
|
|

|
- Board-to-Board Configuration = Right Angle
- Contact Transmits (Typical Application) Power
- Contact Transmits (Typical Application) Signal (Data)
- Contact Transmits (Typical Application) Signal (Data)/Power
- 2/AC Power, 20/Signal, 16/AC Power
|
- 38 Positions
- 20 Signal Positions
- 18 Power Positions
- Without PCB Mount Retention
- Termination Method to PC Board = Through Hole - Solder
|
| Always EU RoHS/ELV Compliant, Wave solder capable to 265°C |
|
|
|

|
- Board-to-Board Configuration = Right Angle
- Contact Transmits (Typical Application) Power
- Contact Transmits (Typical Application) Signal (Data)
- Contact Transmits (Typical Application) Signal (Data)/Power
- 2/AC Power, 20/Signal, 16/AC Power
|
- 38 Positions
- 20 Signal Positions
- 12 Power Positions
- Without PCB Mount Retention
- Termination Method to PC Board = Through Hole - Solder
|
| Always EU RoHS/ELV Compliant, Wave solder capable to 265°C |
|
|
|

|
- Board-to-Board Configuration = Right Angle
- Contact Transmits (Typical Application) Power
- Contact Transmits (Typical Application) Signal (Data)
- Contact Transmits (Typical Application) Signal (Data)/Power
- 2/AC Power, 24/Signal, 12/AC Power
|
- 38 Positions
- 24 Signal Positions
- 14 Power Positions
- With PCB Mount Retention
- Boardlock(s)
|
| Always EU RoHS/ELV Compliant, Reflow solder capable to 260°C |
|
|
|

|
- Board-to-Board Configuration = Right Angle
- Contact Transmits (Typical Application) Power
- Contact Transmits (Typical Application) Signal (Data)
- Contact Transmits (Typical Application) Signal (Data)/Power
- 2/AC Power, 24/Signal, 12/AC Power
|
- 38 Positions
- 24 Signal Positions
- 14 Power Positions
- With PCB Mount Retention
- Boardlock(s)
|
| Always EU RoHS/ELV Compliant, Reflow solder capable to 260°C |
|
|
|

|
- Board-to-Board Configuration = Right Angle
- Contact Transmits (Typical Application) Power
- Contact Transmits (Typical Application) Signal (Data)
- Contact Transmits (Typical Application) Signal (Data)/Power
- 2/AC Power, 24/Signal, 12/AC Power
|
- 38 Positions
- 24 Signal Positions
- 14 Power Positions
- With PCB Mount Retention
- Boardlock(s)
|
| Always EU RoHS/ELV Compliant, Reflow solder capable to 260°C |
|
|
|

|
- Board-to-Board Configuration = Right Angle
- Contact Transmits (Typical Application) Power
- Contact Transmits (Typical Application) Signal (Data)
- Contact Transmits (Typical Application) Signal (Data)/Power
- 2/AC Power, 24/Signal, 8/AC Power
|
- 34 Positions
- 24 Signal Positions
- 10 Power Positions
- With PCB Mount Retention
- Boardlock(s)
|
| Always EU RoHS/ELV Compliant, Reflow solder capable to 260°C |
|
|
|

|
- Board-to-Board Configuration = Right Angle
- Contact Transmits (Typical Application) Power
- Contact Transmits (Typical Application) Signal (Data)
- Contact Transmits (Typical Application) Signal (Data)/Power
- 2/AC Power, 24/Signal, 8/AC Power
|
- 34 Positions
- 24 Signal Positions
- 1 Power Positions
- With PCB Mount Retention
- Boardlock(s)
|
| Always EU RoHS/ELV Compliant, Not applicable for solder process capability |
|
|
|

|
- Board-to-Board Configuration = Right Angle
- Contact Transmits (Typical Application) Power
- Contact Transmits (Typical Application) Signal (Data)
- Contact Transmits (Typical Application) Signal (Data)/Power
- 2/AC Power, 24/Signal, 8/AC Power
|
- 34 Positions
- 24 Signal Positions
- 10 Power Positions
- With PCB Mount Retention
- Boardlock(s)
|
| Always EU RoHS/ELV Compliant, Reflow solder capable to 260°C |
|
|
|

|
- Board-to-Board Configuration = Right Angle
- Contact Transmits (Typical Application) Power
- Contact Transmits (Typical Application) Signal (Data)
- Contact Transmits (Typical Application) Signal (Data)/Power
- 2/AC Power, 24/Signal, 4/AC Power
|
- 30 Positions
- 24 Signal Positions
- 6 Power Positions
- With PCB Mount Retention
- Boardlock(s)
|
| Always EU RoHS/ELV Compliant, Reflow solder capable to 260°C |
|
|
|

|
- Board-to-Board Configuration = Right Angle
- Contact Transmits (Typical Application) Power
- Contact Transmits (Typical Application) Signal (Data)
- Contact Transmits (Typical Application) Signal (Data)/Power
- 2/AC Power, 24/Signal, 4/AC Power
|
- 30 Positions
- 24 Signal Positions
- 6 Power Positions
- With PCB Mount Retention
- Boardlock(s)
|
| Always EU RoHS/ELV Compliant, Reflow solder capable to 260°C |
|
|
|

|
- Board-to-Board Configuration = Right Angle
- Contact Transmits (Typical Application) Power
- Contact Transmits (Typical Application) Signal (Data)
- Contact Transmits (Typical Application) Signal (Data)/Power
- 2/AC Power, 24/Signal, 4/AC Power
|
- 30 Positions
- 24 Signal Positions
- 6 Power Positions
- With PCB Mount Retention
- Boardlock(s)
|
| Always EU RoHS/ELV Compliant, Reflow solder capable to 260°C |
|
|
|

|
- Board-to-Board Configuration = Mezzanine
- Board-to-Board Configuration = Mezzanine/Right Angle
- Board-to-Board Configuration = Right Angle
- Contact Transmits (Typical Application) Power
- 6/AC Power
|
- 6 Positions
- 0 Signal Positions
- 6 Power Positions
- With PCB Mount Retention
- Solder Pads
|
| Always EU RoHS/ELV Compliant, Wave solder capable to 265°C |
|
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