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Centerline (mm) - Switch to in Centerline (mm) Explanation
Row-to-Row Spacing (mm) - Switch to in Row-to-Row Spacing (mm) Explanation
Number of Dual Positions Number of Dual Positions Explanation
Termination Post Length (mm) - Switch to in Termination Post Length (mm) Explanation
Post Type
  • Press-Fit
  • Common to all 15 remaining products
Mating Alignment
  • With
  • Common to all 15 remaining products
Mating Alignment Type
  • Standard
  • Common to all 15 remaining products
Standoffs Standoffs Explanation
Daughter Board Thickness (mm) - Switch to in Daughter Board Thickness (mm) Explanation
Contact Base Material Contact Base Material Explanation
Contact Plating, Mating Area, Material Contact Plating, Mating Area, Material Explanation
RoHS/ELV Compliance RoHS/ELV Compliance Explanation
  • Not ELV/RoHS compliant
  • Common to all 15 remaining products
Lead Free Solder Processes Lead Free Solder Processes Explanation
  • Not relevant for lead free process
  • Common to all 15 remaining products
Brand
  • TE Connectivity
  • Common to all 15 remaining products
Showing 1 - 15 of 15 Matching Products

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Part Differing Features
Click here for product details for C6D06PF29043

  • 3.96 mm Centerline
  • Row-to-Row Spacing = 5.08 mm
  • 6 Dual Positions
  • Termination Post Length = 4.57 mm
  • Card Slot Depth = 10.54 mm
  • With Standoffs
  • Daughter Board Thickness = 1.37 - 1.78 mm
  • High Strength Copper Alloy Contact Base Material
  • Gold (30) Contact Plating, Mating Area, Material
Not EU RoHS or ELV Compliant, Not applicable for solder process capability
Click here for product details for C6D43PF29043

  • 3.96 mm Centerline
  • Row-to-Row Spacing = 5.08 mm
  • 43 Dual Positions
  • Termination Post Length = 4.57 mm
  • Card Slot Depth = 10.54 mm
  • With Standoffs
  • Daughter Board Thickness = 1.37 - 1.78 mm
  • High Strength Copper Alloy Contact Base Material
  • Gold (30) Contact Plating, Mating Area, Material
Not EU RoHS or ELV Compliant, Not applicable for solder process capability
Click here for product details for C7D06PF29023

  • 3.18 mm Centerline
  • Row-to-Row Spacing = 6.35 mm
  • 6 Dual Positions
  • Termination Post Length = 4.57 mm
  • Card Slot Depth = 10.54 mm
  • Without Standoffs
  • Daughter Board Thickness = 1.37 - 1.78 mm
  • High Strength Copper Alloy Contact Base Material
  • Gold (30) Contact Plating, Mating Area, Material
Not EU RoHS or ELV Compliant, Not applicable for solder process capability
Click here for product details for C7D35PF29012

  • 3.18 mm Centerline
  • Row-to-Row Spacing = 6.35 mm
  • 35 Dual Positions
  • Termination Post Length = 17.02 mm
  • Card Slot Depth = 7.62 mm
  • With Standoffs
  • Daughter Board Thickness = 1.37 - 1.78 mm
  • High Strength Copper Alloy Contact Base Material
  • Gold (30) Contact Plating, Mating Area, Material
Not EU RoHS or ELV Compliant, Not applicable for solder process capability
Click here for product details for C7D50PF29043

  • 3.18 mm Centerline
  • Row-to-Row Spacing = 6.35 mm
  • 50 Dual Positions
  • Termination Post Length = 4.57 mm
  • Card Slot Depth = 10.54 mm
  • With Standoffs
  • Daughter Board Thickness = 1.37 - 1.78 mm
  • High Strength Copper Alloy Contact Base Material
  • Gold (30) Contact Plating, Mating Area, Material
Not EU RoHS or ELV Compliant, Not applicable for solder process capability
Click here for product details for C8D10PF29013

  • 2.54 mm Centerline
  • Row-to-Row Spacing = 5.08 mm
  • 10 Dual Positions
  • Termination Post Length = 4.57 mm
  • Card Slot Depth = 7.62 mm
  • With Standoffs
  • Daughter Board Thickness = 1.37 - 1.78 mm
  • High Strength Copper Alloy Contact Base Material
  • Gold (30) Contact Plating, Mating Area, Material
Not EU RoHS or ELV Compliant, Not applicable for solder process capability
Click here for product details for C8D15PF29023

  • 2.54 mm Centerline
  • Row-to-Row Spacing = 5.08 mm
  • 15 Dual Positions
  • Termination Post Length = 4.57 mm
  • Card Slot Depth = 10.54 mm
  • Without Standoffs
  • Daughter Board Thickness = 1.37 - 1.78 mm
  • High Strength Copper Alloy Contact Base Material
  • Gold (30) Contact Plating, Mating Area, Material
Not EU RoHS or ELV Compliant, Not applicable for solder process capability
Click here for product details for C8D30PF29013

  • 2.54 mm Centerline
  • Row-to-Row Spacing = 5.08 mm
  • 30 Dual Positions
  • Termination Post Length = 4.57 mm
  • Card Slot Depth = 7.62 mm
  • With Standoffs
  • Daughter Board Thickness = 1.37 - 1.78 mm
  • High Strength Copper Alloy Contact Base Material
  • Gold (30) Contact Plating, Mating Area, Material
Not EU RoHS or ELV Compliant, Not applicable for solder process capability
Click here for product details for C8D30PF29043

  • 2.54 mm Centerline
  • Row-to-Row Spacing = 5.08 mm
  • 30 Dual Positions
  • Termination Post Length = 4.57 mm
  • Card Slot Depth = 10.54 mm
  • With Standoffs
  • Daughter Board Thickness = 1.37 - 1.78 mm
  • High Strength Copper Alloy Contact Base Material
  • Gold (30) Contact Plating, Mating Area, Material
Not EU RoHS or ELV Compliant, Not applicable for solder process capability
Click here for product details for C8D31PF29023

  • 2.54 mm Centerline
  • Row-to-Row Spacing = 5.08 mm
  • 31 Dual Positions
  • Termination Post Length = 4.57 mm
  • Card Slot Depth = 10.54 mm
  • Without Standoffs
  • Daughter Board Thickness = 1.37 - 1.78 mm
  • High Strength Copper Alloy Contact Base Material
  • Gold (30) Contact Plating, Mating Area, Material
Not EU RoHS or ELV Compliant, Not applicable for solder process capability
Click here for product details for C8D36PF29023

  • 2.54 mm Centerline
  • Row-to-Row Spacing = 5.08 mm
  • 36 Dual Positions
  • Termination Post Length = 4.57 mm
  • Card Slot Depth = 10.54 mm
  • Without Standoffs
  • Daughter Board Thickness = 1.37 - 1.78 mm
  • High Strength Copper Alloy Contact Base Material
  • Gold (30) Contact Plating, Mating Area, Material
Not EU RoHS or ELV Compliant, Not applicable for solder process capability
Click here for product details for C8D50PF29023

  • 2.54 mm Centerline
  • Row-to-Row Spacing = 5.08 mm
  • 50 Dual Positions
  • Termination Post Length = 4.57 mm
  • Card Slot Depth = 10.54 mm
  • Without Standoffs
  • Daughter Board Thickness = 1.37 - 1.78 mm
  • High Strength Copper Alloy Contact Base Material
  • Gold (30) Contact Plating, Mating Area, Material
Not EU RoHS or ELV Compliant, Not applicable for solder process capability
Click here for product details for C8D60PF29023

  • 2.54 mm Centerline
  • Row-to-Row Spacing = 5.08 mm
  • 60 Dual Positions
  • Termination Post Length = 4.57 mm
  • Card Slot Depth = 10.54 mm
  • Without Standoffs
  • Daughter Board Thickness = 1.37 - 1.78 mm
  • High Strength Copper Alloy Contact Base Material
  • Gold (30) Contact Plating, Mating Area, Material
Not EU RoHS or ELV Compliant, Not applicable for solder process capability
Click here for product details for C9D020PF60048

  • 1.27 mm Centerline
  • Row-to-Row Spacing = 2.54 mm
  • 20 Dual Positions
  • Termination Post Length = 3.51 - 3.76 mm
  • Without Standoffs
  • Daughter Board Thickness = 2.36 mm
  • Beryllium Copper Contact Base Material
  • Gold or Gold Flash over Palladium Nickel Contact Plating, Mating Area, Material
Not EU RoHS or ELV Compliant, Not applicable for solder process capability
Click here for product details for C9D060PF60048

  • 1.27 mm Centerline
  • Row-to-Row Spacing = 2.54 mm
  • 60 Dual Positions
  • Termination Post Length = 3.51 - 3.76 mm
  • Without Standoffs
  • Daughter Board Thickness = 2.36 mm
  • Beryllium Copper Contact Base Material
  • Gold or Gold Flash over Palladium Nickel Contact Plating, Mating Area, Material
Not EU RoHS or ELV Compliant, Not applicable for solder process capability
Showing 1 - 15 of 15 Matching Products

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