| Part |
Differing Features |

|
- Connector Style = Receptacle
- Family Name = Fine Mate
- .50 mm Centerline
- 60 Positions
- PCB Mounting Orientation = Vertical
|
- Not Keyed
- Board-to-Board Stack Height = 4.00 mm
- Board-to-Board Stack Height = 4.50 mm
- Board-to-Board Stack Height = 5.50 mm
- Gold Contact Plating, Mating Area, Material
|
| Always EU RoHS/ELV Compliant, Reflow solder capable to 245°C |
|
|
|

|
- Connector Style = Plug
- Family Name = AF
- .80 mm Centerline
- 14 Positions
- PCB Mounting Orientation = Vertical
|
- Not Keyed
- Board-to-Board Stack Height = 11.00 mm
- Gold Contact Plating, Mating Area, Material
- Without Grounding Plate
- Without Grounding Contact
|
| Always EU RoHS/ELV Compliant, Reflow solder capable to 245°C |
|
|
|

|
- Connector Style = Plug
- Family Name = Free Height
- .50 mm Centerline
- 220 Positions
- PCB Mounting Orientation = Vertical
|
- Keyed
- Board-to-Board Stack Height = 8.00 mm
- Tin Contact Plating, Mating Area, Material
- With Grounding Plate
- With Grounding Contact
|
| Always EU RoHS/ELV Compliant, Reflow solder capable to 245°C |
|
|
|

|
- Connector Style = Receptacle
- Family Name = Fine Stack
- .50 mm Centerline
- 40 Positions
- PCB Mounting Orientation = Vertical
|
- Keyed
- Board-to-Board Stack Height = 1.50 mm
- Gold (30) Contact Plating, Mating Area, Material
- With Locating Post(s)
- With Vacuum Cover
|
| Always EU RoHS/ELV Compliant, Reflow solder capable to 245°C |
|
|
|

|
- Connector Style = Plug
- Family Name = Fine Stack
- .50 mm Centerline
- 40 Positions
- PCB Mounting Orientation = Vertical
|
- Keyed
- Board-to-Board Stack Height = 1.50 mm
- Gold (30) Contact Plating, Mating Area, Material
- With Locating Post(s)
- With Vacuum Cover
|
| Always EU RoHS/ELV Compliant, Reflow solder capable to 245°C |
|
|
|

|
- Connector Style = Receptacle
- Family Name = Fine Mate
- .50 mm Centerline
- 80 Positions
- PCB Mounting Orientation = Vertical
|
- Keyed
- Board-to-Board Stack Height = 4.50 mm
- Gold Contact Plating, Mating Area, Material
- With Locating Post(s)
- AMP
|
| Always EU RoHS/ELV Compliant, Reflow solder capable to 245°C |
|
|
|

|
- Connector Style = Plug
- Family Name = Fine Mate
- .50 mm Centerline
- 80 Positions
- PCB Mounting Orientation = Right Angle
|
- Keyed
- Board-to-Board Stack Height = 5.50 mm
- Gold Contact Plating, Mating Area, Material
- With Locating Post(s)
- AMP
|
| Always EU RoHS/ELV Compliant, Reflow solder capable to 245°C |
|
|
|

|
- Connector Style = Plug
- Family Name = Fine Stack
- .50 mm Centerline
- 60 Positions
- PCB Mounting Orientation = Vertical
|
- Board-to-Board Stack Height = 1.50 mm
- Gold (30) Contact Plating, Mating Area, Material
- With Locating Post(s)
- With Vacuum Cover
- AMP
|
| Always EU RoHS/ELV Compliant, Reflow solder capable to 245°C |
|
|
|

|
- Connector Style = Plug
- Family Name = Fine Stack
- .50 mm Centerline
- 80 Positions
- PCB Mounting Orientation = Vertical
|
- Board-to-Board Stack Height = 1.50 mm
- Gold (30) Contact Plating, Mating Area, Material
- With Locating Post(s)
- With Vacuum Cover
- AMP
|
| Not reviewed for RoHS Compliance, Not reviewed for solder process capability |
|
|
|