| Part |
Differing Features |

|
- PCB Mounting Orientation = Right Angle
- PCB Mount Style = Surface Mount
- Boardlock(s)
|
- Gold Flash Contact Plating, Mating Area, Material
- Packaging Method = Tape & Reel
|
| Always EU RoHS/ELV Compliant, Reflow solder capable to 260°C |
|
|
|

|
- PCB Mounting Orientation = Right Angle
- PCB Mount Style = Surface Mount
- Boardlock(s)
|
- Gold (30) Contact Plating, Mating Area, Material
- Packaging Method = Tape & Reel
|
| Always EU RoHS/ELV Compliant, Reflow solder capable to 260°C |
|
|
|

|
- PCB Mounting Orientation = Vertical
- PCB Mount Style = Surface Mount
- Boardlock(s)
|
- Gold Flash Contact Plating, Mating Area, Material
- Packaging Method = Tape & Reel
|
| Always EU RoHS/ELV Compliant, Reflow solder capable to 260°C |
|
|
|

|
- PCB Mounting Orientation = Vertical
- PCB Mount Style = Surface Mount
- Boardlock(s)
|
- Gold (15) Contact Plating, Mating Area, Material
- Packaging Method = Tape & Reel
|
| Always EU RoHS/ELV Compliant, Reflow solder capable to 260°C |
|
|
|

|
- PCB Mounting Orientation = Vertical
- PCB Mount Style = Surface Mount
- Boardlock(s)
|
- Gold (15) Contact Plating, Mating Area, Material
- Packaging Method = Tape & Reel
|
| Always EU RoHS/ELV Compliant, Reflow solder capable to 260°C |
|
|
|

|
- PCB Mounting Orientation = Vertical
- PCB Mount Style = Surface Mount
- Boardlock(s)
|
- Gold (30) Contact Plating, Mating Area, Material
- Packaging Method = Tape & Reel
|
| Always EU RoHS/ELV Compliant, Reflow solder capable to 260°C |
|
|
|

|
- PCB Mounting Orientation = Vertical
- PCB Mount Style = Surface Mount
- Solder Peg
|
- Gold (15) Contact Plating, Mating Area, Material
- Packaging Method = Tape & Reel
|
| Always EU RoHS/ELV Compliant, Reflow solder capable to 260°C |
|
|
|

|
- PCB Mounting Orientation = Vertical
- PCB Mount Style = Through Hole
- Solder Peg
|
- Gold (15) Contact Plating, Mating Area, Material
- Packaging Method = Loose Piece
|
| Always EU RoHS/ELV Compliant, Reflow solder capable to 260°C |
|
|
|

|
- PCB Mounting Orientation = Vertical
- PCB Mount Style = Through Hole
- Solder Peg
|
- Gold (30) Contact Plating, Mating Area, Material
- Packaging Method = Loose Piece
|
| Always EU RoHS/ELV Compliant, Reflow solder capable to 260°C |
|
|
|