| Part |
Differing Features |

|
- Number of Rows = Single
- PCB Mounting Orientation = Vertical
- PCB Mount Style = Through Hole
- Type = A
|
- Gold (15) Contact Plating, Mating Area, Material
- High Temperature Housing = No
- Packaging Method = Tube
|
| Always EU RoHS/ELV Compliant, Wave solder capable to 265°C |
|
|
|

|
- Number of Rows = Single
- PCB Mounting Orientation = Vertical
- PCB Mount Style = Through Hole
- Type = A
|
- Gold (15) Contact Plating, Mating Area, Material
- High Temperature Housing = No
- Packaging Method = Tube
|
| Always EU RoHS/ELV Compliant, Wave solder capable to 265°C |
|
|
|

|
- Number of Rows = Dual
- PCB Mounting Orientation = Vertical
- PCB Mount Style = Through Hole
- Type = B
|
- Gold (15) Contact Plating, Mating Area, Material
- High Temperature Housing
- Packaging Method = Loose Piece
|
| Always EU RoHS/ELV Compliant, Wave solder capable to 265°C |
|
|
|

|
- Number of Rows = Single
- PCB Mounting Orientation = Right Angle
- PCB Mount Style = Surface Mount
|
- Gold Flash Contact Plating, Mating Area, Material
- High Temperature Housing
- Packaging Method = Tube
|
| Always EU RoHS/ELV Compliant, Reflow solder capable to 260°C |
|
|
|

|
- Number of Rows = Single
- PCB Mounting Orientation = Vertical
- PCB Mount Style = Through Hole
- Type = A
|
- Gold Flash Contact Plating, Mating Area, Material
- High Temperature Housing = No
- Packaging Method = Tube
|
| Always EU RoHS/ELV Compliant, Wave solder capable to 265°C |
|
|
|

|
- Number of Rows = Single
- PCB Mounting Orientation = Vertical
- PCB Mount Style = Through Hole
- Type = A
|
- Gold (15) Contact Plating, Mating Area, Material
- High Temperature Housing = No
- Packaging Method = Tube
|
| Always EU RoHS/ELV Compliant, Wave solder capable to 265°C |
|
|
|

|
- Number of Rows = Single
- PCB Mounting Orientation = Vertical
- PCB Mount Style = Through Hole
- Type = A
|
- Gold (30) Contact Plating, Mating Area, Material
- High Temperature Housing = No
- Packaging Method = Tube
|
| Always EU RoHS/ELV Compliant, Wave solder capable to 265°C |
|
|
|

|
- Number of Rows = Single
- PCB Mounting Orientation = Vertical
- PCB Mount Style = Through Hole
- Type = A
|
- Gold Flash Contact Plating, Mating Area, Material
- High Temperature Housing = No
- Packaging Method = Tube
|
| Always EU RoHS/ELV Compliant, Wave solder capable to 265°C |
|
|
|

|
- Number of Rows = Dual
- PCB Mounting Orientation = Vertical
- PCB Mount Style = Through Hole
- Type = B
|
- Gold Flash Contact Plating, Mating Area, Material
- High Temperature Housing
- Packaging Method = Loose Piece
|
| Always EU RoHS/ELV Compliant, Wave solder capable to 265°C |
|
|
|

|
- Number of Rows = Dual
- PCB Mounting Orientation = Vertical
- PCB Mount Style = Through Hole
- Type = B
|
- Gold (15) Contact Plating, Mating Area, Material
- High Temperature Housing
- Packaging Method = Loose Piece
|
| Always EU RoHS/ELV Compliant, Wave solder capable to 265°C |
|
|
|

|
- Number of Rows = Dual
- PCB Mounting Orientation = Vertical
- PCB Mount Style = Through Hole
- Type = B
|
- Gold (30) Contact Plating, Mating Area, Material
- High Temperature Housing
- Packaging Method = Loose Piece
|
| Always EU RoHS/ELV Compliant, Wave solder capable to 265°C |
|
|
|

|
- Number of Rows = Dual
- PCB Mounting Orientation = Vertical
- PCB Mount Style = Through Hole
- Type = B
|
- Gold Flash Contact Plating, Mating Area, Material
- High Temperature Housing
- Packaging Method = Loose Piece
|
| Always EU RoHS/ELV Compliant, Wave solder capable to 265°C |
|
|
|

|
- Number of Rows = Dual
- PCB Mounting Orientation = Vertical
- PCB Mount Style = Through Hole
- Type = B
|
- Gold Flash Contact Plating, Mating Area, Material
- High Temperature Housing
- Packaging Method = Loose Piece
|
| Always EU RoHS/ELV Compliant, Wave solder capable to 265°C |
|
|
|

|
- Number of Rows = Dual
- PCB Mounting Orientation = Vertical
- PCB Mount Style = Through Hole
- Type = B
|
- Gold (15) Contact Plating, Mating Area, Material
- High Temperature Housing
- Packaging Method = Loose Piece
|
| Always EU RoHS/ELV Compliant, Wave solder capable to 265°C |
|
|
|

|
- Number of Rows = Dual
- PCB Mounting Orientation = Vertical
- PCB Mount Style = Through Hole
- Type = B
|
- Gold (15) Contact Plating, Mating Area, Material
- High Temperature Housing
- Packaging Method = Loose Piece
|
| Always EU RoHS/ELV Compliant, Wave solder capable to 265°C |
|
|
|

|
- Number of Rows = Dual
- PCB Mounting Orientation = Vertical
- PCB Mount Style = Through Hole
- Type = B
|
- Gold (15) Contact Plating, Mating Area, Material
- High Temperature Housing
- Packaging Method = Loose Piece
|
| Always EU RoHS/ELV Compliant, Wave solder capable to 265°C |
|
|
|

|
- Number of Rows = Dual
- PCB Mounting Orientation = Vertical
- PCB Mount Style = Through Hole
- Type = B
|
- Gold (15) Contact Plating, Mating Area, Material
- High Temperature Housing
- Packaging Method = Loose Piece
|
| Always EU RoHS/ELV Compliant, Wave solder capable to 265°C |
|
|
|

|
- Number of Rows = Dual
- PCB Mounting Orientation = Vertical
- PCB Mount Style = Through Hole
- Type = B
|
- Gold (30) Contact Plating, Mating Area, Material
- High Temperature Housing
- Packaging Method = Loose Piece
|
| Always EU RoHS/ELV Compliant, Wave solder capable to 265°C |
|
|
|

|
- Number of Rows = Dual
- PCB Mounting Orientation = Vertical
- PCB Mount Style = Through Hole
- Type = B
|
- Gold Flash Contact Plating, Mating Area, Material
- High Temperature Housing
- Packaging Method = Loose Piece
|
| Always EU RoHS/ELV Compliant, Wave solder capable to 265°C |
|
|
|

|
- Number of Rows = Dual
- PCB Mounting Orientation = Vertical
- PCB Mount Style = Through Hole
- Type = B
|
- Gold (15) Contact Plating, Mating Area, Material
- High Temperature Housing
- Packaging Method = Loose Piece
|
| Always EU RoHS/ELV Compliant, Wave solder capable to 265°C |
|
|
|