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Sockets to Support INTEL® CORE™ i7 989 & 988 Mobile Processors

01/28/2010

TE launches new surface mount rPGA sockets designed to support INTEL® CORE™ i7 989 and 988 mobile processors and validated to Intel design guides for high-performance and extreme mobile products.

Product Features
  • Contact positions on a 1.0 mm X 1.0 mm grid
  • Simple cam screw actuation
  • Solder balls facilitate surface mount to PCB
  • Meets Intel® validation
 Applications
  • Notebook Computers
  • CPUs

Documentation & Additional Information

 
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HARRISBURG, Pa. -- Jan. 28, 2010 -- Tyco Electronics launches new surface mount rPGA sockets designed to support INTEL® CORE™ i7 989 and 988 mobile processors and validated to Intel design guides for high-performance and extreme mobile products.

The sockets were designed with pin count patterns of 989 or 988 contact positions to ensure proper alignment of the processor to the socket. Contacts are arranged on a symmetrical 1.0mm x 1.0mm grid. The sockets -- each with a screw-activated cam -- are equipped with solder balls for direct printed circuit board (PCB) attachment. Placement of the processor into the socket and turning the screw secures the processor in its mated position. For automated pick-and-place, removable caps are supplied.

Specific product application includes CPUs used in notebook computers that require low-profile surface mount interconnects. The socket height after reflow is 3mm.

For more information on the new sockets for the INTEL® CORE™ i7 989 and 988 mobile processors, contact Tyco Electronics' Product Information Center at www.tycoelectronics.com/help. Product literature number 1-1773456-7 can be requested through this center.
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